Ultraviolet avalanche photo-detector
A photodetector and ultraviolet avalanche technology, applied in the field of photoelectric detection, can solve the problems of high breakdown voltage and high cost, and achieve the effects of low breakdown voltage, low breakdown voltage and noise, and low voltage bias
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Embodiment 1
[0019] Such as figure 2 Shown is an ultraviolet avalanche photodetector, which includes from bottom to top: silicon substrate 1, N+ doped silicon 2, P type doped silicon 4, AlN buffer layer 5, GaN nucleation layer 6, intrinsic i- al y Ga 1-y N7, P-type doped P-Al x Ga 1-x N8, P-type ohmic electrode 9 and N-type ohmic electrode 3, wherein intrinsic i-Al y Ga 1-yN 7 and P-type doped P-Al x Ga 1-x N8 acts as an absorbing layer to absorb ultraviolet light, and P-type doped silicon 4 and N+ doped silicon 2 form a PN junction as a silicon-based avalanche region through photogenerated carriers (mainly electrons) to generate avalanche multiplication, thereby realizing the AlGaN absorption region and the separation of silicon-based multiplication regions.
[0020] In the device structure, from the silicon substrate 1 up, the thickness of the N+ doped silicon 2 is about 1 μm, and the concentration is at least 1×10 19 cm -3 , belonging to the high-concentration end of the PN j...
Embodiment 2
[0027] Such as image 3 Shown is an ultraviolet avalanche photodetector, which includes from bottom to top: silicon substrate 1, N+ doped silicon 2, intrinsic i-Si4, P-type doped silicon P-Si5, AlN buffer layer 6, GaN formed Core layer 7, intrinsic i-Al y Ga 1-y N8, P-type doped P-Al x Ga 1-x N9, P-type ohmic electrode 10 and N-type ohmic electrode 3, wherein intrinsic i-Al y Ga 1-y N8 and P-type doped P-Al x Ga 1-x N9 acts as an absorbing layer to absorb ultraviolet light. P-type doped silicon P-Si5, intrinsic i-Si4 and N+ doped silicon 2 form a PIN structure, which is used as a silicon-based avalanche region to generate photogenerated carriers (mainly electrons). Avalanche multiplication, thereby achieving the separation of the AlGaN absorption region and the silicon-based multiplication region.
[0028] In the device structure, from the silicon substrate 1 up, the thickness of the N+ doped silicon 2 is about 1 μm, and the concentration is at least 1×10 19 cm -3 , ...
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