Liquid organic silicon doping hexagonal boron nitride material and automatic preparation and industrial application method thereof

Abstract

The invention discloses a liquid organic silicon-doped hexagonal boron nitride material and its automatic preparation and industrial application methods. The material is composed of component A composed of vinyl silicone oil, surface-activated hexagonal boron nitride, inhibitor and catalyst, and group B composed of vinyl silicone oil, hydrogen-containing silicone oil and surface-activated hexagonal boron nitride grouped. Its automatic preparation and industrial application method, the steps are as follows: 1) A and B components are automatically transported and mixed, and then enter the precision injection system; 2) At the same time, the silver-plated stone black ene composite metal sheet is automatically transported to the mold setting 3) Then after glue injection, curing, wrapping, slicing, chip sticking, gold wire connection, potting glue potting, it is transformed into components such as LED light source and IC patch. The liquid organic silicon-doped hexagonal boron nitride material prepared by the invention has excellent characteristics such as high and low temperature resistance, high molding efficiency, good sealing performance, and low cost, and can be widely used in various fields of optoelectronic components.

Description

technical field [0001] The invention relates to a liquid organic silicon-doped hexagonal boron nitride material and its automatic preparation and industrial application method, belonging to the technical field of photoelectric components. Background technique [0002] At present, in the field of optoelectronic components, the materials used for surface mount device (SMD) patches and lead brackets, electronic connectors, IC bases, etc. are usually high temperature resistant engineering plastics, such as polyphthalamide (PPA), poly 1,4-cyclohexanedimethanol terephthalate (PCT), etc. However, PPA has the problems of poor high and low temperature resistance and aging resistance and serious waste of secondary nozzle materials in practical applications. Although PCT materials have good temperature resistance, they also have poor bonding with silicone potting adhesives and nozzle materials cannot be recycled. defect. For components with heat dissipation requirements, a large amou...

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Problems solved by technology

Epoxy resin and polyurethane potting adhesives can achieve a good sealing effect with engineering plastic substrates, but due to the problems of easy yellowing and poor aging resistance of epoxy resin potting adhesives and polyurethane potting adhesives, they are used in In practical applications, silicone potting adhesives are widely used for potting protection of optoelectronic components due to their excellent weather resistance, aging resistance, high and low temperature resistance, mechanical and electrical insulation properties, etc.

However, engineering plastics and silicone potting adhesives are non-homogeneous materials after all, and the adhesion and sealing properties are difficult to meet higher requirements for use.

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