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Manufacturing method of ultra-fine special-shaped spinneret holes

A manufacturing method and spinneret technology, which is applied in the direction of spinneret assembly, filament/thread forming, textile and papermaking, etc., can solve the problems such as difficult to achieve ultra-fine special-shaped nozzles, and achieve easy batch processing and high precision The effect of high height and various structural forms

Active Publication Date: 2017-11-07
SHANGHAI HUANXIN ELECTRONICS & TECH CO LTD
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

CN1279224C proposes a surface treatment method of a tantalum spinneret, although the obtained tantalum spinneret has significantly improved scratch resistance and service life, and the spinneret has excellent spinnability, and can be used to replace the precious metal spinneret. However, since the tantalum spinneret is made of tantalum plate, it can only be processed into a simple shape such as a circle, and it is difficult to achieve ultra-fine special-shaped nozzles

Method used

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  • Manufacturing method of ultra-fine special-shaped spinneret holes

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preparation example Construction

[0050] (7) Preparation of the etching mask for the special-shaped hole of the spinneret: on the silk outlet surface layer of the integrated structure, the UV-LIGA technology is used to carry out the second photolithography, including the glue rejection, exposure, and development carried out in sequence Processing, to realize the patterning of the special-shaped spinneret hole mask, and with the help of double-sided photolithography technology, to realize the alignment of the two photolithography, that is, to realize the alignment of the special-shaped spinneret hole and the guide hole to be processed.

[0051] In some embodiments, the "by means of double-sided lithography technology" refers to: loading the first photoresist plate and the second photoresist plate containing alignment marks into the upper and lower plate positions of the lithography machine respectively , placing the opaque integrated structure between the first photoresist and the second photoresist, using doubl...

Embodiment 1

[0059] Embodiment 1: This embodiment is implemented under the following conditions of implementation and technical requirements:

[0060] (1) Design photolithography layout: design the shape and layout layout of the spinneret guide hole 4, i.e. the mask plate used for the first photolithography; design the shape and layout layout of the spinneret capillary hole 2, namely The mask used in the second photolithography (see figure 1 ). Among them, the shape of the special-shaped hole of the spinneret is "Y-shaped", the outer diameter of the cross section is about 5 μm, and the minimum line width is about 3 μm.

[0061] (2) Preparation of a photoresist mold for the guide hole 4 of the spinneret. On a glass substrate about 3 inches in diameter, the sputter thickness is about thin layer of metallic Ti, and at a temperature of about 65°C, at a concentration of about 2wt% NaOH and 1wt% H 2 o 2 Oxidation treatment in the mixed solution for about 3 minutes to form a uniform and den...

Embodiment 2

[0068] Embodiment 2: This embodiment is implemented under the following conditions of implementation and technical requirements:

[0069] (1) Design the photolithography layout. Design the shape and layout layout of the spinneret guide hole 4, that is, the mask plate used for the first photolithography. Design the shape and layout layout of the capillary hole 2 of the spinneret, i.e. the mask plate used for the second photolithography (refer to figure 1 ). Among them, the shape of the special-shaped hole of the spinneret is "H shape", the outer diameter of the cross section is about 10 μm, and the minimum line width is 4 μm.

[0070] (2) Spinneret guide hole photoresist mold preparation. On a glass substrate with a diameter of about 4 inches, the sputtering thickness is about Metal Ti thin layer, and at 65 °C, in 2wt% NaOH and 1wt% H 2 o 2 Oxidation treatment in the mixed solution for about 3 minutes to form a uniform and dense black titanium oxide film layer to ensure ...

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Abstract

The invention discloses a method for making ultrafine specially-shaped spinning holes. According to the method, a UV-LIG technology, a micro-electroforming technology, a electrodeposition technology and an etching technology are mainly utilized; furthermore, the making method includes the following steps that a photolithography mask pattern is designed; a guide hole photoresist die is prepared; a guide hole layer is subjected to micro-electroforming machining; the guide hole layer is subjected to planarization treatment, a spinning hole layer is subjected to electroforming machining, post-treatment is conducted; a spinning head specially-shaped hole etching mask is prepared; a spinning head specially-shaped hole is subjected to etching machining. By means of the method, one-time machining and forming of the ultrafine specially-shaped spinning holes can be achieved, the process is simple, efficiency is high, cost is low, and prepared spinning heads are diversified in structural form, high in accuracy, good un uniformity and prone to batched production.

Description

technical field [0001] The invention relates to a manufacturing method of a fine special-shaped spinneret, in particular to a manufacturing method of an ultra-fine special-shaped spinneret, which belongs to the technical field of microprocessing. Background technique [0002] The spinneret is a key precision part in the chemical fiber industry. Its function is to extrude the precisely metered spinning solution through numerous spinneret holes on it to extrude fiber bundles with a certain thickness and fine texture. Therefore, its quality is guaranteed. The quality of finished fiber and an important condition for a good spinning process, and the quality of the spinneret mainly depends on the processing quality of the spinneret hole, and the most important thing is that the spinneret is in the process of spinning process conditions close to the maximum allowable conditions Micropore arrangement and cross-sectional shape. Studies have shown that most chemical fibers with circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D01D5/253D01D4/02C25D1/08
CPCC25D1/08D01D4/022D01D5/253
Inventor 邓敏刘瑞张方兴李晓波
Owner SHANGHAI HUANXIN ELECTRONICS & TECH CO LTD
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