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Preparation technology of bisphenol fluorene epoxy resin

A bisphenol fluorene epoxy resin and a preparation process technology, applied in the epoxy resin field, can solve the problems of unfavorable electronic device safety performance, limited formulation selection space, reduced insulation performance and the like, and achieve improved chemical stability, good optical properties, The effect of improving the heat and humidity resistance

Inactive Publication Date: 2016-07-13
EPOXY BASE ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Halogen groups present in trace amounts in epoxy resin will undergo hydrolysis, resulting in reduced insulation performance and wire corrosion, which is not conducive to the safety performance of electronic devices
The total chlorine content of ordinary epoxy resin is about 1600ppm-2500ppm, which limits its application in the field of high-end packaging
According to the international standard IEC61249-2-21 formulated by the International Electrotechnical Commission, the total chlorine content of electronic components is required to be less than 900ppm. To meet this requirement, engineers need to add a large amount of halogen-free fillers and curing agents to the formula, which limits the choice of formula space

Method used

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  • Preparation technology of bisphenol fluorene epoxy resin

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preparation example Construction

[0031] The preparation process of the bisphenol fluorene epoxy resin of the present invention comprises: catalytic grafting reaction, ring closure reaction, refining reaction, desalination, concentration, brine treatment process; Obtain high-performance bisphenol fluorene epoxy resin, produce in the production process The sodium chloride waste brine is recovered and concentrated to obtain standard industrial sodium chloride salt, and the water can be reused to achieve clean production.

[0032] The catalytic grafting reaction step includes: grafting bisphenol fluorene and epichlorohydrin in the presence of a catalyst.

[0033] The molar ratio of bisphenol fluorene to epichlorohydrin is 1:5 to 1:20. For 1 mole of bisphenol fluorene, when the number of moles of epichlorohydrin is greater than 15, the recovery of excess epichlorohydrin is large. , time-consuming and energy-consuming, the number of moles is less than 5 pairs of bisphenol fluorene epoxy dissolvability that reaction...

Embodiment 1

[0043] Put 76.6 grams of epichlorohydrin and 28 grams of bisphenol fluorene into a four-port glass reaction tank equipped with a thermometer, a stirring device, a nitrogen injection pipe, and a heating device, stir evenly and rise from normal temperature to 55°C, and add 0.7 grams of 50% sodium hydroxide, and kept stirring at constant temperature for 2 hours. Adjust the vacuum to 210 torr, add 12 g of 50% sodium hydroxide with a quantitative pump, and keep stirring at a constant temperature of 58° C. for 2 hours. Adjust the vacuum to 60torr, and heat to 120°C to recover excess epichlorohydrin. Add 35 g of methyl isobutyl ketone, add 4.6 g of 50% sodium hydroxide, adjust the temperature to 80° C., and keep stirring at constant temperature for 2 hours. Add 30 grams of deionized water and 5 grams of 20% hydrochloric acid solution, stir and let stand for liquid separation, and drain the lower layer of brine. After the resin layer is filtered, the vacuum degree is adjusted to 60 ...

Embodiment 2

[0046] Put 76.6 grams of epichlorohydrin and 28 grams of bisphenol fluorene into a four-port glass reaction tank equipped with a thermometer, a stirring device, a nitrogen injection pipe, and a heating device, stir evenly and rise from normal temperature to 57 ° C, and add 0.7 grams of 50% sodium hydroxide, and kept stirring at constant temperature for 3 hours. Adjust the vacuum degree to 190 torr, add 12 grams of 50% sodium hydroxide with a quantitative pump, and keep stirring at a constant temperature of 62° C. for 2 hours. Adjust the vacuum to 40torr, and heat to 120°C to recover excess epichlorohydrin. Add 35 g of methyl isobutyl ketone, add 13 g of 20% sodium hydroxide, adjust the temperature to 90° C., and keep stirring at constant temperature for 2 hours. Add 30 grams of deionized water and 5 grams of 20% hydrochloric acid solution, stir and let stand for liquid separation, and drain the lower layer of brine. After the resin layer is filtered, the vacuum degree is adj...

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Abstract

The invention relates to the field of epoxy resin and particularly discloses a preparation technology of bisphenol fluorene epoxy resin. The preparation technology of bisphenol fluorene epoxy resin comprises the processes of catalytic grafting reaction, ring-closure reaction, refining reaction, desalting, concentration and brine treatment. The bisphenol fluorene epoxy resin obtained by the preparation technology disclosed by the invention has the properties of low water absorption, low total chlorine content and high heat resistance; the byproduct brine generated in the preparation process and the organic solvent of certain concentration contained in the brine are recycled, and the wastewater is treated to avoid direct discharge to the environment; the obtained sodium chloride can be sold as industrial salt, thereby turning waste into wealth; and the water obtained by condensation can be repeatedly used, thus the water consumption is reduced, and the energy is saved while the emission is reduced.

Description

technical field [0001] The invention relates to the field of epoxy resin, in particular to a preparation process of bisphenol fluorene epoxy resin. Background technique [0002] Epoxy resins generally refer to organic polymer compounds containing two or more epoxy groups in the molecule. The molecular structure is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Epoxy resin has excellent adhesion, mechanical properties, and electrical properties, and is widely used in coatings, electronic components, building materials, aerospace materials, etc. [0003] The epoxy resin currently on the market is mainly bisphenol A type epoxy resin, and its preparation method is generally obtained by reacting bisphenol A and epichlorohydrin. Bisphenol A type epoxy resin has the advantages of good fluidity, high mechanical properties, and low price, and can meet the needs of most fie...

Claims

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Application Information

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IPC IPC(8): C08G59/06
CPCC08G59/06
Inventor 林新冠林仁宗周冰湛爱冰
Owner EPOXY BASE ELECTRONICS MATERIAL
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