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Quick-dry type silver paste used for PCB through hole and preparation method for quick-dry type silver paste

A quick-drying, silver paste technology, applied in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc., can solve problems such as low production efficiency, high curing temperature, and inapplicability. Achieve the effects of improving wear resistance, no three wastes pollution, and preventing sagging

Active Publication Date: 2016-07-20
SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its high curing temperature and low production efficiency are no longer applicable

Method used

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  • Quick-dry type silver paste used for PCB through hole and preparation method for quick-dry type silver paste
  • Quick-dry type silver paste used for PCB through hole and preparation method for quick-dry type silver paste
  • Quick-dry type silver paste used for PCB through hole and preparation method for quick-dry type silver paste

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Material preparation: Prepare materials according to the following components: 30kg of metallic silver powder, 4kg of polymer resin, 1kg of organic additive, and 15kg of organic solvent. The metal silver powder used is micron silver powder and nano silver powder, wherein the metal silver powder includes 20kg of micron silver powder, 10kg of nano silver powder, the particle size of the micron silver powder is 5μm, the tap density is 2.5g / ml, and the particle size of the nano silver powder is 135nm. The density is 2.8g / ml. The polymer resin used is polyurethane resin. The organic additives used include 0.2 kg of sealing curing agent, 0.2 kg of thickening agent fumed silica, 0.2 kg of hardening agent conductive graphite, 0.1 kg of silane coupling agent KH5500, and 0.3 kg of leveling agent silicone resin. The organic solvent used contains 2kg of methyl ethyl ketone, 2kg of ethylene glycol ether acetate, 3kg of isophorone, and 8kg of divalent ester

[0030] (2) The con...

Embodiment 2

[0034] (1) Material preparation: Prepare materials according to the following components: 36kg of metallic silver powder, 4.8kg of polymer resin, 1.2kg of organic additives, and 18kg of organic solvent. The metal silver powder used is micron silver powder and nano silver powder, wherein the metal silver powder contains 24kg of micron silver powder, 12kg of nano silver powder, the average particle size of the micron silver powder is 5.8μm, the tap density is 2.6g / ml, and the particle size of the nano silver powder is 165nm. The tap density is 2.7 g / ml. The polymer resin used is polyurethane resin. The organic additives used include 0.24 kg of sealing curing agent, 0.24 kg of thickening agent fumed silica, 0.24 kg of hardening agent conductive graphite, 0.12 kg of silane coupling agent KH5500, and 0.36 kg of leveling agent silicone resin. The organic solvent used contains 2.4kg of methyl ethyl ketone, 2.4kg of ethylene glycol ether acetate, 3.6kg of isophorone, and 9.6kg of dib...

Embodiment 3

[0039](1) Material preparation: Prepare materials according to the following components: 15kg of metallic silver powder, 2kg of polymer resin, 0.5kg of organic additive, and 7.5kg of organic solvent. The metal silver powder used is micron silver powder and nano silver powder, wherein the metallic silver powder includes 10kg of micron silver powder and 5kg of nano silver powder, the average particle size of the micron silver powder is 6.0 μm, and the tap density is 2.3 g / ml. The polymer resin used is polyurethane resin. The organic additives used include 0.1kg of sealing curing agent, 0.1kg of thickening agent fumed silica, 0.1kg of hardening agent conductive graphite, 0.05kg of silane coupling agent KH550, KH560, KH570, and leveling agent silicone resin 0.15kg. The organic solvent used contains 1kg of methyl ethyl ketone, 1kg of ethylene glycol ether acetate, 1.5kg of isophorone, and 4kg of divalent ester

[0040] (2) The configuration of the carrier: Weigh the polyurethane ...

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Abstract

The invention relates to quick-dry type silver paste used for a PCB through hole and a preparation method for the quick-dry type silver paste. The raw materials of the silver paste comprise the following components in parts by weight: 60-75 parts of metal silver powder, 5-10 parts of macromolecule resin, 0.5-3 parts of organic additives and 25-35 parts of organic solvent. The quick-dry type silver paste is prepared by the steps of weighing the macromolecule resin and the organic solvent and pouring the macromolecule resin and the organic solvent into a stirring vessel, stirring until the mixture is transparent; then carrying out filtering and impurity removing through a 300-400-mesh polyester net to obtain a carrier; weighing the metal silver powder, the carrier and the organic additives, and putting the weighed mixture in a high-speed dispersion machine to carry out high-speed dispersion to obtain uniform paste; grinding the paste by a three-roll mill; enabling the fineness of the silver paste to be less than 15[mu]m through adjustment of gaps of the rolling mill; enabling the viscosity of the silver paste to be within a range of 10-20Pa.S through fine tuning of the solvent; and filtering the paste by a 300-mesh stainless steel net to obtain the quick-dry type silver paste used for the PCB through hole. Compared with the prior art, the silver paste prepared by the method can be dried rapidly without being cured at a high temperature, and the production efficiency is high.

Description

technical field [0001] The invention relates to silver paste for PCB boards, in particular to a quick-drying silver paste for PCB through holes and a preparation method thereof. Background technique [0002] With the maturity of PCB board processing technology, printed boards are developing towards high-precision, thin-line, and high-density SMT assembly. The price limit and profit are also gradually shrinking. The emergence of new technology of silver paste through-hole has pointed out a direction for reducing the cost of PCB boards and improving profits. However, the old copper sinking and electroplating processes are gradually being restricted by environmental protection and high cost. This silver conductive paste achieves double-sided printed circuit board connection technology through screen printing of conductive printing materials. This silver conductive paste is adopted and absorbed in more electronic fields. Simple and fast production methods, effective interconn...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 江海涵何利娜朱庆明
Owner SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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