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Silicon boron tackifier, preparation method thereof and application thereof in double-component LED packaging gel

A technology of LED packaging and tackifier, which is applied in the direction of adhesives, polymer adhesive additives, adhesive additives, etc., can solve the problems of poor bonding performance of LED substrates, increased costs and workload, and achieve industrialization. Strong, less dangerous, and the effect of improving adhesion

Active Publication Date: 2016-07-27
清远市美佳乐环保新材股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding performance of two-component silicone rubber to LED substrates is poor, and it is usually necessary to use a primer on the substrate to meet the bonding requirements, which undoubtedly increases the cost and workload.

Method used

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  • Silicon boron tackifier, preparation method thereof and application thereof in double-component LED packaging gel
  • Silicon boron tackifier, preparation method thereof and application thereof in double-component LED packaging gel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Preparation of epoxy-modified polysiloxane: Add 114.2 g of allyl glycidyl ether and 100.0 g of hydrogen-containing silicone oil to a 500-ml three-necked flask. The hydrogen value of the hydrogen-containing silicone oil is 0.8%, and 120 ppm chlorine The platinum acid catalyst and 80.0 g of toluene solvent were reacted at 80° C. for 6 hours, and the low boilers were removed at 110° C. under low pressure to obtain epoxy-modified polysiloxane.

[0032] (2) Preparation of phenylpolysiloxane prepolymer: Add 104.0g ethyl orthosilicate, 198.0g phenyltrimethoxysilane, 558.0g divinyltetramethyldisiloxane to a 1000ml three-necked flask Alkanes and 150.0g toluene solvent, add 160.0g of 1.0% sulfuric acid solution dropwise at 70°C, react for 4 hours and then heat up to 100°C for distillation until no fractions are distilled out, wash with water until neutral, and remove low boiling substances under low pressure to obtain Phenyl polysiloxane prepolymer.

[0033] (3) Mix 100.0 g ...

Embodiment 2

[0035] (1) Preparation of epoxy-modified polysiloxane: Add 248.0 g of 4-vinyl epoxycyclohexane and 110.0 g of high hydrogen-containing silicone oil into a 500 ml three-necked flask, and the hydrogen content of the hydrogen-containing silicone oil is 1.6%. , 240ppm chloroplatinic acid catalyst and 160.0g toluene solvent were reacted at 85°C for 5 hours, and low boilers were removed at 110°C under low pressure to obtain epoxy-modified polysiloxane.

[0036] (2) Preparation of phenylpolysiloxane prepolymer: Add 104.0g ethyl orthosilicate, 198.0g phenyltrimethoxysilane, 558.0g divinyltetramethyldisiloxane to a 1000ml three-necked flask Alkanes and 150.0g toluene solvent, add 160.0g of 1.0% sulfuric acid solution dropwise at 70°C, react for 4 hours and then heat up to 100°C for distillation until no fractions are distilled out, wash with water until neutral, and remove low boiling substances under low pressure to obtain Phenyl polysiloxane prepolymer.

[0037] (3) Mix 100.0 g of t...

Embodiment 3

[0039] (1) Preparation of epoxy-modified polysiloxane: Add 114.2 g of allyl glycidyl ether and 100.0 g of hydrogen-containing silicone oil to a 500-ml three-necked flask. The hydrogen value of the hydrogen-containing silicone oil is 0.8%, and 120 ppm chlorine The platinum acid catalyst and 80.0 g of toluene solvent were reacted at 80° C. for 6 hours, and the low boilers were removed at 110° C. under low pressure to obtain epoxy-modified polysiloxane.

[0040] (2) Preparation of phenylpolysiloxane prepolymer: add 122.2g of diphenyldimethoxysilane, 396.0g of phenyltrimethoxysilane, 184.0g of divinyltetramethyl in a 1000ml three-necked flask Disiloxane and 160.0g of toluene solvent, add 120.0g of 1.5% sulfuric acid solution dropwise at 80°C, react for 4 hours and then raise the temperature to 100°C for distillation until no fractions are distilled out, wash with water until neutral, and remove the low boiling point under low pressure products to obtain phenylpolysiloxane prepolym...

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Abstract

The invention belongs to the field of organosilicon materials and discloses a silicon boron tackifier, a preparation method thereof and application thereof in double-component LED packaging gel. The preparation method includes: subjecting unsaturated monomer with epoxy group and polysiloxane with hydrogen group to hydrosilylation to obtain epoxy modified polysiloxane; subjecting silane monomers R1Me2SiOR, PhR2Si(OR)2, R4Si(OR)3 and Si(OR)4 to hydrolytic condensation under an acidic condition to obtain a phenyl polysiloxane prepolymer; mixing the epoxy modified polysiloxane with the phenyl polysiloxane prepolymer, adding borate, and allowing reaction under action of alkaline catalysis to obtain the silicon boron tackifier. The silicon boron tackifier can be directly added into an LED packaging silica gel system, adhesion between the LED packaging silica gel and lamp beads is improved, requirements on sealing the lamp beads are met, and the silicon boron tackifier has high refractive rate and good yellowing resistance.

Description

technical field [0001] The invention belongs to the field of organic silicon materials, and in particular relates to a silicon-boron tackifier, a preparation method thereof and an application in two-component LED encapsulation glue. Background technique [0002] LED is used more and more widely, and has the advantages of small size, low operating voltage, high safety factor, long life, energy saving and environmental protection, etc., and it is a direction for the development of light sources in the future. The performance of the encapsulant directly affects the performance and life of the LED, and the encapsulation material of the LED has been a hot research topic in recent years. The two-component silicone rubber material of organic silicon has the characteristics of good transparency, high refractive index, good thermal stability, small stress cracking, and good water resistance. It has become an excellent raw material for LED packaging adhesives. [0003] Two-component ...

Claims

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Application Information

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IPC IPC(8): C09J11/08C09J183/07C09J183/05C08G81/00
CPCC08G81/00C08L2203/206C08L2205/025C08L2205/035C09J11/08C09J183/04C08L83/04C08L87/005
Inventor 黄伟良王纲杨建宇唐强
Owner 清远市美佳乐环保新材股份有限公司
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