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Low-expansion high-thermal-conducting copper-stainless invar alloy composite material and preparation method thereof

A composite material, stainless steel technology, applied in metal processing equipment, coating, transportation and packaging, etc., to achieve the effect of reducing production cost, easy sintering, and lower sintering temperature

Active Publication Date: 2016-07-27
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The present invention provides a copper-stainless invar alloy composite material with low expansion and high thermal conductivity and a preparation method thereof, aiming at the performance requirements such as low expansion and high thermal conductivity urgently needed by current electronic packaging materials.

Method used

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  • Low-expansion high-thermal-conducting copper-stainless invar alloy composite material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0040] Using high-purity metals Cu, Fe, Co, and Cr as raw materials, it is configured according to Cu700g, Fe110g, Co160g, and Cr30g. The error in the actual configuration process is guaranteed to be within 0.001g. First, the weighed alloy raw materials are ultrasonically cleaned, and then placed in the vacuum induction furnace of the atomization equipment. Pump the chamber of the atomization device to 1×10 -3 The vacuum degree of Pa is filled with argon to slightly more than 1 atmospheric pressure. After the alloy is completely melted into a liquid, the air pressure device is started to make the molten liquid flow into the atomization chamber, and at the same time, the high-pressure argon valve (air pressure is 3-10MPa) is quickly opened to spray high pressure. The gas atomizes the metal liquid. When all the molten liquid flows into the spray chamber, the argon flow valve can be closed. After the atomization equipment cools down, powder samples can be obtained in the collec...

Embodiment 2

[0043] Using high-purity metals Cu, Fe, Co, and Cr as raw materials, it is configured according to Cu400g, Fe220g, Co320g, and Cr60g. The error in the actual configuration process is guaranteed to be within 0.001g. First, the weighed alloy raw materials are ultrasonically cleaned, and then placed in the vacuum induction furnace of the atomization equipment. Pump the chamber of the atomization device to 1×10 -3 The vacuum degree of Pa is filled with argon to slightly more than 1 atmospheric pressure. After the alloy is completely melted into a liquid, the air pressure device is started to make the molten liquid flow into the atomization chamber, and at the same time, the high-pressure argon valve (air pressure is 3-10MPa) is quickly opened to spray high pressure. The gas atomizes the metal liquid. When all the molten liquid flows into the spray chamber, the argon flow valve can be closed. After the atomization equipment cools down, powder samples can be obtained in the collec...

Embodiment 3

[0046] Using high-purity metals Cu, Fe, Co, and Cr as raw materials, it is configured according to Cu250g, Fe280g, Co400g, and Cr70g. The error in the actual configuration process is guaranteed to be within 0.001g. First, the weighed alloy raw materials are ultrasonically cleaned, and then placed in the vacuum induction furnace of the atomization equipment. Pump the chamber of the atomization device to 1×10 -3 The vacuum degree of Pa is filled with argon to slightly more than 1 atmospheric pressure. After the alloy is completely melted into a liquid, the air pressure device is started to make the molten liquid flow into the atomization chamber, and at the same time, the high-pressure argon valve (air pressure is 3-10MPa) is quickly opened to spray high pressure. The gas atomizes the metal liquid. When all the molten liquid flows into the spray chamber, the argon flow valve can be closed. After the atomization equipment cools down, powder samples can be obtained in the collec...

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Abstract

The invention relates to a composite material, in particular to a low-expansion high-thermal-conducting copper-stainless invar alloy composite material and a preparation method thereof. The low-expansion high-thermal-conducting copper-stainless invar alloy composite material is composed of, by mass, 20%-75% of Cu, 9%-30% of Fe, 12%-45% of Co, 2%-8% of Cr, and 0-5% of an additive. The preparation method includes the steps that through a phase diagram calculation method, the components of the composite material are designed, and a two-liquid-phase separated zone of a Cu-rich phase and a Fe-Co-Cr-rich phase is made to exist in the components of the composite material; various raw materials are weighed and put into gas-atomization powder making equipment, vacuumizing, induction smelting and gas atomization are carried out, and kernel / casting type self-wrapped composite powder is obtained; the obtained kernel / casting type self-wrapped composite powder is put into a sintering furnace and subjected to hot-pressing sintering under the argon protection, and a copper-stainless invar alloy composite material sintered body is obtained after cooling; and then annealing is carried out, so that the low-expansion high-thermal-conducting copper-stainless invar alloy composite material is obtained.

Description

technical field [0001] The invention relates to a composite material, in particular to a copper-stainless invar alloy composite material with low expansion and high thermal conductivity and a preparation method thereof. Background technique [0002] Since the advent of the first semiconductor integrated circuit (IC) in 1958, integrated circuit packaging technology has been developing towards high integration, miniaturization and light weight, which has put forward higher and higher requirements for the performance of electronic packaging materials (Zhang Chen, Shen Nengjue, Current Situation and Development of Electronic Packaging Materials [J], New Materials Industry, 2003, 3:5-11). With the continuous improvement of chip integration and computing speed, the problem of heat dissipation has become an important problem that needs to be solved urgently for various packaging materials. Especially for high-power devices, if the heat cannot be conducted and dissipated in time, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C9/06C22C30/02C22C1/04C22F1/08C22F1/00
CPCC22C1/0425C22C1/0433C22C9/00C22C9/06C22C19/07C22C30/02C22F1/08C22F1/10B22F2998/10B22F2999/00B22F9/082B22F1/17
Inventor 王翠萍刘兴军柳玉恒石田清仁何洲峰杨双张锦彬杨水源施展
Owner XIAMEN UNIV
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