Normal temperature and pressure micro-order heat stability test system and method

Abstract

The invention provides a normal temperature and pressure micro-order heat stability test system and method. The test system comprises a supporting frame, a supporting platform, a CCD camera, an image processing computer, a thermal control heater, a thermal control and program control power source, a temperature measuring element, a thermal control temperature measuring collecting card and a thermal control computer. A tested object is a measuring structure. The measuring structure and the supporting frame are fixed to the supporting platform. The CCD camera is installed on the supporting frame, wherein the installation position meets the condition that the CCD camera can monitor the installation face of the measuring structure and the outer surface of a main supporting structure. The image processing computer is connected with the CCD camera. The thermal control heater and the temperature measuring element are arranged on the surface of the measuring structure, and the thermal control and program control power source is connected with the thermal control heater. The thermal control temperature measuring collecting card is connected with the temperature measuring element, and the thermal control computer is connected with the thermal control and program control power source and the thermal control temperature measuring collecting card. By means of the test system and method, the influence of test noise can be effectively eliminated, and the test precision under the normal temperature and pressure can be ensured.

Description

technical field [0001] The invention belongs to the technical field of spacecraft thermal stability testing, and in particular relates to a micron-level thermal stability testing system and testing method at normal temperature and pressure. Background technique [0002] High precision, high stability, and high agility have become typical features of a new generation of high-performance spacecraft. As one of the key elements, the on-orbit dimensional stability of the mechanical support system directly affects key imaging components such as cameras, antennas, star sensors, and gyroscopes, as well as data reception. The geometric relationship with the transmission components and attitude control components and between them is one of the important factors that determine the image positioning accuracy, camera imaging quality, and data transmission quality. At present, internationally renowned aerospace research institutions represented by NASA and ESA have carried out long-term r...

AI Technical Summary

Problems solved by technology

Due to the high requirements for test accuracy and test environment, the test of the thermal expansion coefficient at the specimen level is gradually becoming mature, but there is no mature test method for the thermal deformation test of the component level and large-scale structures.

According to ESA design standards, foreign language model reports and other documents and information research results, the thermal deformation tests carried out by foreign research institutions are mainly carried out in vacuum tanks and environmental simulation boxes, with corresponding complex test equipment and corresponding auxiliary devices, etc. , there are many influencing links, the system design is relatively complicated, and the cost is high. It cannot be implemented in domestic applications in the short term and still has the above problems

The existing domestic thermal deformation measurement equipment is mainly concentrated in the field of machinery manufacturing, such as precision forging die thermal deformation detection system and its detection method (CN102890097A), three-dimensional high-precision multifunctional thermal deformation experimental device (CN2700874Y), temperature and thermal Deformation comprehensive monitoring system and monitoring method (CN102166722A), its purpose is to monitor the thermal deformation performance of processing equipment or mechanical parts during mechanical processing, but the test size range, test accuracy, test environment, etc. are not suitable for spacecraft component-level structures ( About 0.2m~2m) Micron thermal deformation measurement

The thermal stability test of the structure under normal temperature and pressure is still in the exploratory stage. The test method research based on laser, optical fiber and other means, the accuracy of the spacecraft component-level structure test is generally tens or even hundreds of microns, which cannot meet the requirements of the entire field. Micron-level precision measurement, some test methods can realize full-field measurement (such as reflective surface surface precision photogrammetry), but it only stays on the basis of the initial processing accuracy evaluation of the surface, and fails to monitor and measure the deformation process under thermal load

[0004] For the measurement of micron-level thermal deformation, the thermal deformation of structures can only be predicted through finite element simulation analysis, but the correctness of the simulation analysis results cannot be verified by experiments, and the simulation analysis model cannot be corrected based on test data. Micron-level thermal stabilization is urgently needed Research on sex test methods

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