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A laser gain chip, laser component, power amplifier and oscillator

A laser gain chip, laser technology, applied in lasers, laser parts, phonon exciters, etc., can solve the problems of difficult to ensure the stability of laser devices, complex structure, bulky and other problems, and achieve the benefits of engineering implementation and convenient operation. , the effect of high gain ability

Inactive Publication Date: 2018-11-23
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The power expansion is achieved by cascading multiple amplification head modules. In order to make full use of the pumping field, an image transmission system is used between the modules. The length of the laser device needs to be increased by four times the focal length for each additional module. The laser composed of dozens of thin slices The resonant cavity can reach 50 meters, the structure is complex, and the volume is large, so it is difficult to ensure the stability of the laser device

Method used

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  • A laser gain chip, laser component, power amplifier and oscillator
  • A laser gain chip, laser component, power amplifier and oscillator
  • A laser gain chip, laser component, power amplifier and oscillator

Examples

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Effect test

Embodiment 1

[0044] Such as Figure 1-3 As shown, a laser gain chip includes a laser source, a gain medium 1, a pump source 2 and a cooling fluid 5, the pump source 2 includes a connected diode array and a coupling device 203, and the diode array includes a gain The medium 1 is a diode array one 201 and a diode array one 202 arranged symmetrically to the center, and the diode array one 201 and the diode array one 202 are respectively connected to the gain medium 1 through a coupling device 203, and the coupling device 203 is configured as a strip structure, It is formed by arranging a plurality of optical fibers 204, which are arranged in surface-to-face contact with the gain medium 1, and utilizes the advantage of the flexible transmission of the coupling device 203 to improve the degree of freedom between the diode array and the gain medium 1 in space, so that the pump source 2 and the gain medium 1 are convenient. Arrangement of the gain medium 1 and thermal management.

[0045] The la...

Embodiment 2

[0049] Such as Figure 1-5 As shown, the gain medium 1 is set as a sheet structure, and its interior is set as a graded doping structure along the transmission direction of the pump light 4 to ensure uniform distribution of gain in the gain medium 1. This structure is very suitable for quasi- A three-level gain medium or a gain medium with a low absorption coefficient, the gain medium 1 sequentially includes a central region 101, a transition layer 102 and a cladding layer 103 from the inside to the outside, and the central region 101 and the cladding layer 103 are all set to be gradually doped structure, the active ions doped inside the central region 101 are Nd 3+ or Yb 3+ , thereby ensuring that the pump light 4 is absorbed in the central region 101, and the corresponding doped active ions inside the cladding layer 103 are Sm 3+ or Cr 4+ , which absorb less pumping light 4, have high absorption efficiency for spontaneous emission of laser light 3, suppress the lateral se...

Embodiment 3

[0052] Such as figure 1 , 6 As shown, a laser component includes the above-mentioned laser gain chip, and multiple laser gain chips are cascaded along the laser transmission direction to realize power expansion. Each gain medium 1 has an independent pump source 2, and each gain medium 1 has an independent pump source 2, and each The same small-signal gain can be obtained in the gain medium 1, and the gain distribution is uniform, and the absorbed pump energy and heat generation density have the same distribution. In the process of power expansion, there is no need to consider the influence of other factors, and the operation is convenient. At the same time, The distance between adjacent laser gain chips is on the order of millimeters, preferably 0.5-5mm, with a compact structure and a small occupied space.

[0053] The laser assembly is arranged inside the laser assembly housing 6, the laser assembly housing 6 includes a window 61 and a housing 62, the window 61 is coated wit...

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Abstract

The invention relates to a laser gain chip, a laser assembly, a power amplifier and an oscillator, and belongs to the technical field of laser equipment. The laser gain chip comprises a laser source, a gain medium, a pumping source and cooling fluid, wherein the pumping source comprises a diode array and a coupling device which are connected; the laser source, the coupling device and the cooling fluid are respectively arranged in a way of corresponding to different side surfaces of the gain media; the transmission directions of cooling fluid, pumping light and laser are in perpendicular quadrature; a gradual change doping structure is arranged inside the gain medium along the transmission direction of the pumping light. The three fields including the pumping field, the laser field and the cooling fluid field are in perpendicular quadrature; the space coupling in the three fields is relieved, so that each field can be independently controlled; in addition, each gain medium has a unique pumping source; a plurality of laser gain chips are in cascade connection in the laser transmission direction; the power expansion can be realized; the operation is convenient; the engineering implementation is facilitated.

Description

technical field [0001] The invention belongs to the technical field of laser equipment, and in particular relates to a laser gain chip, a laser component, a power amplifier and an oscillator. Background technique [0002] High average power lasers are widely used in national defense, industry, scientific research and other fields. In repetitive frequency high-energy and high-power laser devices, slab-shaped, lamination-shaped or thin-sheet-shaped gain media are generally used. The advantage of the slab medium is that the laser beam is confined inside the slab in a way of total reflection transmission. This transmission optical path is called the Zig-Zag optical path. Inhomogeneity reduces the resulting thermal lensing and stress-induced birefringence. The pumping method has been developed from the initial side pumping to the end pumping, which increases the absorption length of the pumping light from the millimeter level to the centimeter level, ensures the efficient absor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/0941H01S3/042H01S3/16
CPCH01S3/042H01S3/0941H01S3/1601
Inventor 李敏张小民李明中王振国严雄伟郑建刚蒋新颖肖凯博高松张君田晓琳张雄军粟敬钦胡东霞朱启华
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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