Method for preparing PF (phenol-formaldehyde resin) foamed heat-insulating plate
A thermal insulation board and foam technology, which is applied in the field of thermal insulation materials, can solve the problems of fragility, high energy consumption, and low strength of thermal insulation boards, and achieve rapid foaming and solidification, reduced production energy consumption, and good thermal insulation effects
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[0012] The present invention will be described in detail below in conjunction with specific embodiments.
[0013] A preparation method for a PF foam insulation board, comprising the steps of:
[0014] 1) Prepare the following raw materials: phenol, formaldehyde, sodium hydroxide, hydrochloric acid, hydroxylamine hydrochloride, n-pentane foaming agent and Tween-20;
[0015] 2) Put phenol and formaldehyde into the autoclave according to the material ratio of 1:3, turn on the agitator to stir the autoclave and feed steam into the autoclave at the same time, when the temperature in the autoclave reaches 60°C, add hydrogen oxide to the autoclave sodium;
[0016] 3) Continue to feed steam into the reaction kettle. When the temperature in the kettle reaches 86°C, keep it warm for 1 hour, then lower the temperature in the kettle to 70°C for 1 hour, and then lower the temperature in the kettle to 1°C·s -1 Lower the temperature to 60°C, neutralize the pH value to 6.5-7.5 with hydrochl...
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