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Method for preparing PF (phenol-formaldehyde resin) foamed heat-insulating plate

A thermal insulation board and foam technology, which is applied in the field of thermal insulation materials, can solve the problems of fragility, high energy consumption, and low strength of thermal insulation boards, and achieve rapid foaming and solidification, reduced production energy consumption, and good thermal insulation effects

Inactive Publication Date: 2016-08-24
许智静
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the preparation of PF foam at home and abroad mostly adopts high-temperature heating method for foaming. The disadvantages are: this method consumes a lot of energy, low output, high production cost, and the insulation board produced has low strength, fragility, and easy slag drop defect

Method used

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Embodiment Construction

[0012] The present invention will be described in detail below in conjunction with specific embodiments.

[0013] A preparation method for a PF foam insulation board, comprising the steps of:

[0014] 1) Prepare the following raw materials: phenol, formaldehyde, sodium hydroxide, hydrochloric acid, hydroxylamine hydrochloride, n-pentane foaming agent and Tween-20;

[0015] 2) Put phenol and formaldehyde into the autoclave according to the material ratio of 1:3, turn on the agitator to stir the autoclave and feed steam into the autoclave at the same time, when the temperature in the autoclave reaches 60°C, add hydrogen oxide to the autoclave sodium;

[0016] 3) Continue to feed steam into the reaction kettle. When the temperature in the kettle reaches 86°C, keep it warm for 1 hour, then lower the temperature in the kettle to 70°C for 1 hour, and then lower the temperature in the kettle to 1°C·s -1 Lower the temperature to 60°C, neutralize the pH value to 6.5-7.5 with hydrochl...

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PUM

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Abstract

The invention discloses a method for preparing a PF (phenol-formaldehyde resin) foamed heat-insulating plate and belongs to the field of heat insulating materials. The method comprises the following steps: getting the following raw materials ready: phenol, formaldehyde, sodium hydroxide, hydrochloric acid, hydroxylamine hydrochloride, a n-pentane foamer and Tween-20; putting the phenol and the formaldehyde into an autoclave in accordance with that the mass ratio of the phenol to the formaldehyde is 1: 3, turning on a stirrer to carry out stirring on the autoclave while introducing steam into the autoclave, and adding the sodium hydroxide into the autoclave when the internal temperature of the autoclave reaches 60 DEG C; continuing to introduce steam into the autoclave, carrying out heat preservation for 1 hour when the internal temperature of the autoclave reaches 86 DEG C, then, cooling the internal temperature of the autoclave to 70 DEG C, carrying out a reaction for 1 hour, then, cooling the internal temperature of the autoclave to 60 DEG C at the rate of 1 degree centigrade per second, neutralizing the pH value to 6.5 to 7.5 by using hydrochloric acid, and depressurizing and dewatering the interior of the autoclave, so as to obtain foamed PF; and stirring and mixing the foamed PF, the Tween-20 and the n-pentane at a high speed at room temperature according to the mass ratio of 1: 1: 2, and meanwhile, pressurizing the mixture. According to the method, the cost is reduced, the strength is high, and the heat insulating effect is good.

Description

technical field [0001] The invention belongs to the field of thermal insulation materials, and in particular relates to a PF foam thermal insulation board. Background technique [0002] In the prior art, phenolic resin (PF) is the first artificially synthesized polymer compound in the world. PF foam has low thermal conductivity, good heat resistance and heat insulation performance, excellent flame retardancy and fire resistance, and low smoke even when burned. Low flame, no dripping, non-toxic, it is widely used as insulation material in automobiles, ships, construction, aviation and other fields. At present, the preparation of PF foam at home and abroad mostly adopts high-temperature heating method for foaming. The disadvantages are: this method consumes a lot of energy, low output, high production cost, and the produced insulation board has low strength, fragility, and easy slag drop defect. Contents of the invention [0003] The purpose of the present invention is to ...

Claims

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Application Information

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IPC IPC(8): C08J9/14C08L61/10C08G8/10
Inventor 许智静
Owner 许智静