Unlock instant, AI-driven research and patent intelligence for your innovation.

A pcb acid etching solution suitable for ozone recovery method

A technology of acid etching solution and recycling method, which is applied in the field of PCB acid etching solution, can solve the problems of etching effect, hidden danger, and not in a new reaction system, and achieve the effect of simplifying the formula

Inactive Publication Date: 2019-01-15
SOUTH CHINA UNIV OF TECH
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Hydrogen peroxide is difficult to store, easy to decompose, and easy to cause safety hazards
Although sodium chlorate is very stable, as the reaction progresses, the amount of sodium chloride continues to rise, so that sodium chloride eventually exceeds its solubility and precipitates, which has an inevitable impact on etching
Now a set of oxidation regeneration system using ozone has been designed, but the formula according to the original process conditions is no longer suitable for the new reaction system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A PCB acidic etchant suitable for the ozone recovery method is formed by mixing the following components, and the content of each component in the etchant is: etching mother liquor copper (copper chloride) 150g / L, hydrochloric acid 2mol / L, Calcium chloride 160g / L, stabilizer (urea) 5g / L, wetting agent (2-ethylhexyl sodium sulfate) 0.2g / L, bank protection agent (2-mercaptobenzothiazole) 0.3g / L, The rest is water.

[0020] The following reactions take place during acid etching of this system:

[0021] 1. Copper corrosion reaction: metal copper is bitten off by divalent copper in the solution, and the reaction formula is:

[0022] 3Cu+3CuCl 2 → 6CuCl

[0023] 2. Regeneration reaction: metal copper is etched by Cu in the bath solution 2+ Oxidation and dissolution, the resulting 2Cu + It is oxidized by the ozone fed into the system and oxidized to Cu through a series of reactions. 2+ , and these Cu 2+ Continue to react with the metal copper on the board surface, so t...

Embodiment 2

[0027] A PCB acidic etchant suitable for the ozone recovery method, the components of the etchant and the contents of each component are: etching mother liquor copper (copper chloride) 130g / L, hydrochloric acid 1.5mol / L, calcium chloride 120g / L, Stabilizer (urea) 1g / L, wetting agent (sodium 2-ethylhexanol sulfate) 0.1g / L, bank revetment agent (2-mercaptobenzothiazole) 0.1g / L, and the rest is water.

[0028] The following reactions take place during acid etching of this system:

[0029] 1. Copper corrosion reaction: metal copper is bitten off by divalent copper in the solution, and the reaction formula is:

[0030] 3Cu+3CuCl 2 → 6CuCl

[0031] 2. Regeneration reaction: metal copper is etched by Cu in the bath solution 2+ Oxidation and dissolution, the resulting 2Cu + It is oxidized by the ozone fed into the system and oxidized to Cu through a series of reactions. 2+ , and these Cu 2+ Continue to react with the metal copper on the board surface, so that the etchant can bi...

Embodiment 3

[0035] A PCB acidic etchant suitable for the ozone recovery method, the components of the etchant and the contents of each component are: etching mother liquor copper (copper chloride) 170g / L, hydrochloric acid 2.5mol / L, calcium chloride 200g / L, Stabilizer (urea) 10g / L, wetting agent (sodium 2-ethylhexanol sulfate) 0.3g / L, bank protection agent (2-mercaptobenzothiazole) 0.5g / L, and the rest is water.

[0036] The following reactions take place during acid etching of this system:

[0037] 1. Copper corrosion reaction: metal copper is bitten off by divalent copper in the solution, and the reaction formula is:

[0038] 3Cu+3CuCl 2 → 6CuCl

[0039] 2. Regeneration reaction: metal copper is etched by Cu in the bath solution 2+ Oxidation and dissolution, the resulting 2Cu + It is oxidized by the ozone fed into the system and oxidized to Cu through a series of reactions. 2+ , and these Cu 2+ Continue to react with the metal copper on the board surface, so that the etchant can ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses PCB acid etching liquid suitable for an ozone recycling method. The PCB acid etching liquid is prepared from bivalence copper with the content being 130 g / L-170 g / L, high-solubility chlorate with the content being 120 g / L-200 g / L, hydrochloric acid with the content being 1.5 mol / L-2.5 mol / L, a stabilizing agent with the content being 1 g / L-10 g / L, a wetting agent with the content being 0.1 g / L-0.3 g / L and a banking agent with the content being 0.1 g / L-0.5 g / L. According to the PCB acid etching liquid, sodium chloride in the original process is removed, chlorate higher in solubility is adopted so that crystallization can be convenient, the formula totally adapts to a new technological process, subsequent crystallization treatment is facilitated, and an original acid etching liquid formula is simplified.

Description

technical field [0001] The invention relates to the technical field of PCB (printed circuit board) manufacturing technology, in particular to a PCB acid etching solution suitable for the ozone recovery method. Background technique [0002] In the manufacture of printed circuit boards, in addition to multiple wiring, additive methods, etc., traditional printed circuit boards use chemical reactions to remove unnecessary copper on the PCB to form the required circuit. graphics. The pattern transfer or screen printing method used as the circuit pattern part makes the photoresist of the organic compound system or the metal resist layer cover the surface of the circuit pattern to prevent the metal copper from being etched away. Therefore, the etching process is an indispensable and important step in the manufacture of printed circuit boards. At present, the most commonly used inner layer in the PCB industry is H 2 o 2 / HCl system and NaClO 3 There are many types of these two ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/46C23F1/18
CPCC23F1/18C23F1/46
Inventor 黄洪邢征司徒粤
Owner SOUTH CHINA UNIV OF TECH