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Negative photosensitive resin composition, pattern formed therewith, and image display device

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of pattern peeling, residue generation, difficulty in fine pattern formation, etc., and achieves excellent adhesion, storage stability, and excellent heat resistance. and chemical resistance effect

Active Publication Date: 2021-01-15
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The photosensitive resin composition is coated on these to form a pattern. At this time, if the adhesion between the photosensitive resin composition and the substrate is not good, peeling of the pattern may occur, the development property may decrease, and the formation of a fine pattern may be difficult. question
[0007] In order to solve such problems, Korean Laid-Open Patent No. 2014-0071725 is known for photosensitive resin compositions containing oxime E-based, oxime A-based, and acetophenone-based photopolymerization initiators, but those that use oxime-based initiators in large quantities In some cases, residues are likely to be generated, and there is an increased possibility of outgassing, requiring research on more effective methods

Method used

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  • Negative photosensitive resin composition, pattern formed therewith, and image display device
  • Negative photosensitive resin composition, pattern formed therewith, and image display device
  • Negative photosensitive resin composition, pattern formed therewith, and image display device

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0090] Production Example 1. Synthesis of Alkali-Soluble Resin

[0091] In a 1L flask equipped with a reflux cooler, a dropping funnel, and a stirrer, nitrogen was flowed in at 0.02L / min to form a nitrogen atmosphere, 300 parts by weight of methyl ethyl diglycol was charged, and heated to 70°C while stirring. ℃. Next, 20 parts by weight of norbornene, 30 parts by weight of styrene, 45 parts by weight of methacrylic acid, 3-acryloyloxy-2-hydroxypropyl methacrylate (3-Acryloyloxy-2- 135 parts by weight of hydroxypropyl methacrylate) were dissolved in 140 parts by weight of methyl ethyl diglycol to prepare a solution.

[0092] Using a dropping funnel, the prepared solution was dropped into a flask kept at 70° C. over 4 hours. On the other hand, 30 parts by weight of the photopolymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in methyl ethyl diglycol 225 over a period of 4 hours using another dropping funnel. The solution in parts by weight was dropp...

manufacture example 2

[0094] Production Example 2. Synthesis of Alkali-Soluble Resin

[0095] A 1 L flask equipped with a reflux cooler, a dropping funnel, and a stirrer was made into a nitrogen atmosphere, 300 parts by weight of methyl ethyl diglycol was charged, and it heated to 70 degreeC, stirring. Next, 300 parts by weight of a mixture of the following chemical formula 4 and chemical formula 5 (the molar ratio is 50:50), (3-ethyloxetan-3-yl) methyl methacrylate ((3-ethyloxetan - 150 parts by weight of 3-yl)methyl methacrylate) and 50 parts by weight of methacrylic acid were dissolved in 140 parts by weight of methyl ethyl diglycol to prepare a solution.

[0096] [chemical formula 4]

[0097]

[0098] [chemical formula 5]

[0099]

[0100] The prepared solution was dropped into a flask kept at 70° C. using a dropping funnel over 4 hours. On the other hand, 30 parts by weight of the photopolymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in methyl ethyl digl...

manufacture example 3

[0102] Production Example 3. Synthesis of Alkali-Soluble Resin

[0103] Except that no norbornene (norbornene) was added, an alkali-soluble resin was produced in the same manner as in Production Example 1 above to obtain a copolymer c with a solid content of 35.5% by weight and an acid value of 123.7 mgKOH / g (solid content conversion). solution.

[0104] At this time, the weight average molecular weight of the resin was 15,000, and the molecular weight distribution (Mw / Mn) was 2.3.

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Abstract

The present invention relates to a photosensitive resin composition, a pattern formed by using the same and an image display device. More specifically, the present invention relates to a negative photosensitive resin composition which exhibits excellent adhesiveness to a substrate, chemical resistance, and storage stability.

Description

technical field [0001] This invention relates to a photosensitive resin composition, More specifically, it is related with the negative photosensitive resin composition excellent in the adhesiveness with respect to a board|substrate, chemical resistance, and storage stability. Background technique [0002] In the display field, the photosensitive resin composition is used for forming various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and columnar spacers. Specifically, the photosensitive resin composition is selectively exposed and developed through a photolithography process to form a desired photocuring pattern. In order to improve the yield in the process and improve the physical properties of the application object in this process, it is required to have a high Sensitive photosensitive resin composition. [0003] The patterning of the photosensitive resin composition utilizes a photolithography method, that is, a chan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/038G03F7/031
CPCG03F7/027G03F7/031G03F7/0388G03F7/0045G03F7/028G03F7/0382
Inventor 全志珉金圣彬朴汉雨
Owner DONGWOO FINE CHEM CO LTD