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Curable block type organopolysiloxane composition and semiconductor device

A polysiloxane and composition technology, applied in semiconductor devices, electrical solid devices, electrical components, etc., can solve the problems of poor resistance to cold and thermal shock, and achieve good vulcanization resistance, high refractive index, and excellent cold and heat resistance. The effect of impact performance

Active Publication Date: 2019-03-19
GUANGZHOU HUMAN CHEM
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of poor cold and heat shock resistance in the prior art under the premise of maintaining good vulcanization resistance, and to provide a curable vulcanization compound with long vulcanization time and excellent cold and heat shock resistance. The block type organopolysiloxane composition

Method used

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  • Curable block type organopolysiloxane composition and semiconductor device
  • Curable block type organopolysiloxane composition and semiconductor device

Examples

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Comparison scheme
Effect test

Embodiment 1

[0099] Resin (A1), (A2), (B1) and (B2) prepared by synthesis examples 1 to 8 and

[0100] (C) addition reaction catalyst: octanol solution of chloroplatinic acid (platinum concentration is 5wt%);

[0101] (D) Inhibitor: 2-phenyl-3-butyn-2-ol.

[0102] Mix according to the combinations shown in Table 1 (each composition is calculated in parts by weight) to obtain the composition of the present invention.

[0103] figure 1 The semiconductor device LED lamp shown is packaged in the following way, providing a support 1 fixed with a light emitting element 2, wherein the light emitting element 2 is connected to the electrode 3 through a bonding wire 4 (usually a gold wire), and the above-mentioned light emitting element of the present invention The curable organopolysiloxane composition 5 is coated on the support 1 on which the light-emitting element 2 is fixed, and cured.

[0104] The physicochemical properties of the obtained compositions were evaluated by the following methods...

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Abstract

The invention provides a curable block organopolysiloxane composition and a semiconductor device to overcome the defect of poor cold and heat shock resistance in the prior art. The curable block organopolysiloxane composition has tensile strength of 1 to 8 Mpa, elongation at break of 50 to 200% and a refractive index of no less than 1.45 in a curing state under the conditions of a temperature of 25 DEG C and humidity of 60% RH. The composition comprises (A1) a block branched-chain-structured organopolysiloxane copolymer containing a R13SiO1 / 2 unit, a [R22SiO2 / 2]m unit and a [R3SiO3 / 2]n unit; (B1) straight-chain-structured polyorganohydrosiloxane, each molecule of which has at least one hydrogen atom bonding with silicon and at least one aromatic group on average; and (C) a hydrosilylation catalyst, wherein the amount of the hydrosilylation catalyst is sufficient to promote curing of the composition. Compared with the prior art, the curable block organopolysiloxane composition provided by the invention not only maintains good sulfuration resistance, a high refractive index and high hardness and has excellent cold and heat shock resistance.

Description

technical field [0001] The invention relates to a silicone composition, in particular to a curable block type organopolysiloxane composition and a semiconductor device formed by curing the composition. Background technique [0002] The basic structural unit of silicone polymers is composed of silicon-oxygen chains, and the side chains are connected to various other organic groups through silicon atoms. Compared with other polymer materials, organosilicon polymers have the following outstanding properties: 1. Temperature resistance, organosilicon products are based on silicon-oxygen (Si-O) bonds as the main chain structure, so the thermal stability of organosilicon products High, under high temperature (or radiation exposure) the chemical bonds of molecules will not be broken or decomposed. 2. Weather resistance, the main chain of silicone products is -Si-O-, which has better thermal stability, radiation resistance and weather resistance than other polymer materials, and has...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/10C08L83/04C08L83/05H01L33/56
CPCH01L2224/48091H01L2224/48247H01L2924/00014
Inventor 郑海庭何海朱经纬黄光燕
Owner GUANGZHOU HUMAN CHEM
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