Method for preparing copper substrate with two wetting characteristics of hydrophility and hydrophobicity

A technology of wetting characteristics and copper substrate, which is applied to the device of coating liquid on the surface, vacuum evaporation plating, coating, etc., can solve the problem of condensate droplet adhesion, improve heat exchange efficiency, and facilitate mass production Effect

Inactive Publication Date: 2016-11-16
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
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Problems solved by technology

[0004] The invention provides a method for preparing a copper substrate with both hydrophilic and hydrophobic wetting properties. The self-flow of droplets on the gradient surface solves the problem of condensed droplets on the surface of the heat exchanger, and can improve the heat exchange efficiency of the heat exchanger.

Method used

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  • Method for preparing copper substrate with two wetting characteristics of hydrophility and hydrophobicity
  • Method for preparing copper substrate with two wetting characteristics of hydrophility and hydrophobicity
  • Method for preparing copper substrate with two wetting characteristics of hydrophility and hydrophobicity

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Embodiment 1

[0032] Embodiment 1 includes electron beam evaporation coating step, plasma treatment step, preparation of molecular self-assembled film (SAM) step and experimental verification step:

[0033] A, electron beam evaporation coating step, including the following sub-steps:

[0034] Sub-step A1: immerse the smooth copper plate 30mm×30mm×1mm polished by sandpaper into a beaker filled with 50mL of dichloromethane (DCM, 99%) solution, and put the beaker into an ultrasonic cleaner for 10 minutes to take it out;

[0035] Sub-step A2: Take the aluminum foil and cut out the desired pattern (wedge-shaped areas with top angles of 20° and 35° respectively), such as figure 1 , the cut aluminum foil is used as a mask to cover the copper plate;

[0036] Sub-step A3: Fix the back of the masked copper plate on the sample stage with high-temperature double-sided adhesive, and then put it into an electron beam evaporation coating machine for aluminum plating, and the coating thickness is 50nm;

...

Embodiment 2

[0048] Embodiment 2, including electron beam evaporation coating step, plasma treatment step, preparation molecular self-assembled thin film (SAM) step and experimental verification step:

[0049] A, electron beam evaporation coating step, including the following sub-steps:

[0050] Sub-step A1: immerse the smooth copper plate 30mm×30mm×1mm polished by sandpaper into a beaker filled with 50mL of dichloromethane (DCM, 99%) solution, and put the beaker into an ultrasonic cleaner for 20 minutes to take it out;

[0051] Sub-step A2: If figure 1 , take the aluminum foil paper, cut out the required pattern (wedge-shaped area with top angles of 20° and 35° respectively), and use the cut aluminum foil paper as a mask to cover the copper plate;

[0052]Sub-step A3: Fix the back of the masked copper plate on the sample stage with high-temperature double-sided adhesive, and then put it into an electron beam evaporation coating machine for aluminum plating, and the coating thickness is 2...

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Abstract

The invention discloses a method for preparing a copper substrate with two wetting characteristics of hydrophility and hydrophobicity and belongs to a method for preparing surface gradient free energy materials. The method includes the electron beam evaporation coating step, the plasma processing step and the molecular self-assembly membrane preparation step, wherein firstly, the surface of a Cu plate is coated with a thin Al membrane in an evaporation coating manner through an electron beam evaporation coating machine; a sample is put into a plasma cleaning machine to be treated, and the overall hydrophility of the sample is improved; the sample is soaked into a mercaptan solution for a reaction, and then the hydrophobic copper surface and the hydrophilic aluminum surface are obtained after the sample is taken out and cleaned. By the adoption of the method, operation is easy and convenient, and preparation of the same substrate with two different wetting characteristic surfaces is achieved, so that spontaneous movement of liquid drops under the non-external-force effect can be achieved. The prepared copper substrate can be applied to the surface of a heat exchanger, and the heat exchange efficiency of the heat exchanger is improved by controlling flowing of condensate liquid drops.

Description

technical field [0001] The invention belongs to a method for preparing a surface gradient free energy material, and in particular relates to a method for preparing a copper substrate with two wetting properties, hydrophilic and hydrophobic. Background technique [0002] The gradient free energy surface is a high-performance material whose structure, composition, and wettability change continuously or stepwise with space. The surface tension of liquid droplets in all directions on the surface of the material with gradient changes in wettability is unbalanced. This will make the droplet have the tendency and ability to spontaneously flow from low surface energy to high surface energy. Wettability gradient surfaces have broad application prospects in the fields of biology, diagnostics, microfluidic devices, and liquid self-transport. At present, many scholars at home and abroad are devoted to the research of gradient surface preparation methods using silicon and glass as subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/18B05D7/24B05D3/00C23C14/30C23C14/16
CPCB05D1/18B05D3/002B05D7/24B05D2202/45B05D2350/00C23C14/16C23C14/30
Inventor 罗小兵黄梦宇袁超马预谱程焱华
Owner HUAZHONG UNIV OF SCI & TECH
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