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Polymer thin sheet, and manufacturing method and application thereof

A polymer and sheet technology, used in applications, chemical instruments and methods, household components, etc., can solve the problems of large compression set, difficult to ultra-thin, unfavorable packaging and processing, etc., and achieve low compression set. Quantitative, good low-density effects

Active Publication Date: 2016-11-16
HUBEI XIANGYUAN NEW MATERIAL TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Among the above three categories of products, polyurethane foam materials have excellent performance, but have defects such as high density and difficulty in ultra-thin processing (thickness cannot be less than 0.1mm); polyolefin supercritical foam materials are light and soft, but permanent compression. The deformation is large, which is not conducive to long-term sealing and shock absorption; the performance of polyolefin cross-linked foam materials is also very good, but the ultra-thin (thickness is less than 0.1mm) products have a high density, and because the material is a closed-cell structure, the compression ratio is low. It is also not conducive to packaging processing

Method used

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  • Polymer thin sheet, and manufacturing method and application thereof
  • Polymer thin sheet, and manufacturing method and application thereof
  • Polymer thin sheet, and manufacturing method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Select a commercially available rigid polyurethane foam substrate with a thickness of 5 mm, a width of 500 mm, a length of 800 m, an average pore diameter of 500 μm, and an apparent density of 0.7 g / cm 3 , The compression ratio is 30%, its 70 ℃ compression set ≤ 50% (75% compression, 22h), 23 ℃ compression set ≤ 30%, hardness (Shore D) 50 degrees.

[0069] Step 5: Cut the first layer of the rigid polyurethane foam substrate, place the raw material of the rigid polyurethane foam substrate on the unwinding device, start the knife belt type skin cutting machine, the winding device, and the unwinding device,

[0070] Unwinding step: send the rigid polyurethane foam substrate to the cutting device, the feeding speed is 0.1m / min, the thickness of the rigid polyurethane foam substrate is 5mm,

[0071] Continuous cutting step: according to the average pore diameter of the polymer raw material, the cross-section perpendicular to the thickness direction of the polymer coil is cut...

Embodiment 2

[0078] Select a commercially available foam substrate made of natural rubber and butyl rubber, the thickness of the substrate is 3 mm, the width is 800 mm, the length is 800 m, the pore diameter range is 40 μm to 400 μm, the average pore diameter is 300 μm, and the apparent density is 0.5 g / cm 3 , The compression ratio is 40%, its 70 ℃ compression set ≤ 40% (75% compression, 22h), 23 ℃ compression set ≤ 35%, the hardness is (Shore C) 45 degrees.

[0079] Cutting of the first layer of the substrate: place the substrate raw material on the unwinding device, start the knife belt type skin cutting machine, the winding device, and the unwinding device,

[0080] Unwinding step: feed the polymer coil with the same material as the polymer sheet into the cutting device, the feeding speed is 10m / min, the thickness of the polymer coil is 3mm,

[0081] In the continuous cutting step, according to the average pore diameter of the polymer raw material, the polymer coil is cut into polymer s...

Embodiment 3

[0088] Select a commercially available foaming coil with polycarbonate as the main component, the thickness of the coil is 0.1mm, the width is 1500mm, the length is 1000m, the average pore diameter is 10μm, and the apparent density is 0.04g / cm 3 , The compression ratio is 60%, the compression set at 70°C is ≤30% (75% compression, 22h), the compression set at 23°C is ≤20%, and the hardness is (Shore C) 10 degrees.

[0089] Step 3: Cut the first layer of polycarbonate coil, place the polycarbonate coil on the unwinding device, start the hot wire cutting machine, winding device, unwinding device,

[0090] Unwinding step: feed the polymer coil with the same material as the polymer sheet into the cutting device, the feeding speed is 5m / min, the thickness of the polymer coil is 0.1mm,

[0091] Continuous cutting step: according to the average pore diameter of the polymer raw material, the polymer sheet is thinned into a polymer sheet with a set thickness along the cross-section of t...

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Abstract

The invention discloses a polymer thin sheet, and a manufacturing method and application thereof, and belongs to the field of polymer materials and processing. The thickness of the polymer thin sheet is smaller than the average pore size of the thin sheet, the polymer thin sheet is provided with a through hole in the thickness direction so that the polymer thin sheet can be in a cellular board shape, the through hole rate is 20-60%, the thickness is 10-500 [mu]m, and the average pore size is 10-500 [mu]m. The preparation method comprises an unwinding step, a continuous cutting step and a winding step. The precision error of the continuous cutting step is + / -0.02 mm. By the adoption of the method, materials with low density, impact resistance, high compression ratio and low compression permanent deformation performance can be prepared and can be applied to sealing and buffering of electronic equipment. In addition, the method is high in production efficiency, low in production cost and suitable for large-scale industrial application.

Description

technical field [0001] The invention belongs to the field of sealing and buffering materials for electronic equipment, and more specifically relates to a polymer sheet containing a through-hole structure for sealing and buffering of electronic equipment, a manufacturing method and an application thereof. Background technique [0002] In recent years, the design of electronic devices such as smartphones, LCD TVs, and tablet computers has become thinner and lighter, which requires the components used to be thinner and lighter. For this type of electronic equipment, the sealing and cushioning materials used are also required to be thinner and lighter, and they are expected to be thin-layer sheets of 0.3 mm or less. On the other hand, with the upgrading of smart handheld electronic products, the size of the display screen is getting larger and larger, and the requirements for buffer protection of large-size screens and electronic modules are also getting higher and higher, which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D3/28B65H16/00B65H18/00B32B3/12B32B7/10B32B33/00
CPCB26D3/28B32B3/12B32B7/10B32B33/00B65H16/00B65H18/00B32B37/12B32B37/182B32B2553/02B65H18/28B65H2301/4148B65H2301/51532B65H2301/51539B65H2301/5155B65H2511/13B65H2701/1718B65H2220/04B32B5/18B32B2266/06B32B2266/104
Inventor 郭可锐魏琼
Owner HUBEI XIANGYUAN NEW MATERIAL TECH INC
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