AZO coarsened layer-equipped high brightness AlGaInP light emitting diode and manufacturing method therefor
A technology of light-emitting diodes and a manufacturing method, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as high price and toxicity, and achieve the effects of simple methods, wide sources, and reduced accumulation.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0027] The present invention is further described in conjunction with drawings and implementation.
[0028] 1. Manufacturing specific implementation steps:
[0029] 1. Fabrication of epitaxial chips by MOCVD technology: N-GaAs buffer layer 200, AlAs / AlGaAs reflective layer 201, N-AlGaInP lower confinement layer 202, MQW multi-quantum well active layer 203, a P-AlGaInP upper confinement layer 204, a P-GaInP buffer layer 205, and a P-GaP current spreading layer 206, wherein the thickness of the P-GaP current spreading layer 206 highly doped with magnesium is 4.5 μm to ensure that a good Ohmic contact, the doping concentration of magnesium is 8×10 17 cm -3 ~1×10 19 cm -3 .
[0030] 2. Clean the P-GaP current spreading layer 206 with 215 and 511 solutions on the epitaxial chip, and deposit a layer of SiO on the surface by PECVD 2 , in SiO 2 The positive photoresist is spin-coated on the layer, and after baking, exposure, baking, and development, the chip is spin-dried by a ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 