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Heat machining and heat treatment process of aluminum-silicon alloy plate prepared by powder sintering

A technology of aluminum-silicon alloy and thermal processing, which is applied in the field of processing and heat treatment of powder metallurgy materials, to achieve the effects of excellent mechanical properties, fine grains of the matrix, and excellent air tightness

Active Publication Date: 2016-12-14
HUNAN HYDRO DYNAMIC NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is: for the Al-Si alloy ingot prepared by powder metallurgy sintering, provide a thermal processing and heat treatment process of an aluminum-silicon alloy plate prepared by powder sintering; adopt the subsequent thermal deformation and heat treatment of the present invention process to obtain Al-Si electronic packaging material sheets with low expansion coefficient, high thermal conductivity, excellent air tightness, good strength and elongation and other physical and mechanical properties, and realize short-process and low-cost Al-Si alloys with high silicon content production and preparation technology

Method used

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  • Heat machining and heat treatment process of aluminum-silicon alloy plate prepared by powder sintering
  • Heat machining and heat treatment process of aluminum-silicon alloy plate prepared by powder sintering
  • Heat machining and heat treatment process of aluminum-silicon alloy plate prepared by powder sintering

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Experimental program
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Effect test

Embodiment 1

[0047] Use aluminum powder and silicon powder with a purity >99.9%, and mix them thoroughly according to the Al-40% Si composition ratio, put the Al and Si mixed powder into the mold, and apply a pressure of 20Mpa to the Al and Si mixed powder. The mold and the Al and Si mixed powder are heated together to 510°C and kept for 10 minutes; then, continue to heat up to the sintering temperature of 1000°C and sinter for 20 minutes. During the sintering process, a pressure of 50Mpa is applied to the Al and Si mixed powder. , depressurization, and natural cooling to obtain an Al-40% Si alloy sintered ingot;

[0048] The Al-40% Si alloy sintered billet was annealed for 72 hours at 500 ° C for homogenization heat treatment;

[0049] The Al-40%Si alloy ingot after homogenization heat treatment annealing is heated to 550°C, and then forged on a hydraulic press, the forging reduction rate is controlled at about 1m / min, and the forging deformation is 15%. Rolling, the reduction amount of ...

Embodiment 2

[0052] Use aluminum powder and silicon powder with purity >99.9%, according to the Al-10% Si composition ratio, after fully mixing evenly, put the Al and Si mixed powder into the mold, and apply a pressure of 5Mpa to the Al and Si mixed powder. Heat the mold together with the Al and Si mixed powder to 490°C and keep it warm for 5 minutes; then, continue to heat up to the sintering temperature of 800°C and sinter for 10 minutes. During the sintering process, a pressure of 10Mpa is applied to the Al and Si mixed powder. , depressurization, and natural cooling to obtain an Al-40% Si alloy sintered ingot;

[0053] The Al-10%Si alloy sintered billet was annealed for 24 hours at 300°C for homogenization heat treatment;

[0054] The Al-10%Si alloy sintered ingot after homogenization heat treatment and annealing is heated to 400°C, and hot rolled directly without forging. The reduction of each pass of hot rolling is controlled at about 3%, and the cumulative deformation reaches 30 %,...

Embodiment 3

[0057] Use aluminum powder and silicon powder with a purity >99.9%, according to the distribution ratio of Al-27% Si, after fully mixing evenly, put the Al and Si mixed powder into the mold, and apply a pressure of 15Mpa to the Al and Si mixed powder. Heat the mold together with the Al and Si mixed powder to 500°C and keep it warm for 7 minutes; then, continue to heat up to the sintering temperature of 900°C and sinter for 15 minutes. During the sintering process, a pressure of 25Mpa is applied to the Al and Si mixed powder. , depressurization, and natural cooling to obtain an Al-40% Si alloy sintered ingot;

[0058] The Al-27%Si alloy sintered billet was annealed for 48 hours at 400°C for homogenization heat treatment;

[0059] The Al-27% Si alloy ingot after homogenization heat treatment and annealing is heated to 450°C, and hot rolled directly without forging. The reduction of each pass of hot rolling is controlled at about 10%, and the cumulative deformation reaches 30%. ...

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Abstract

The invention discloses a heat machining and heat treatment process of an aluminum-silicon alloy plate prepared by powder sintering. The content of Si in an Al-Si alloy is controlled in a range of 10-40%; after a high-silicon aluminum alloy blank ingot obtained by sintering is uniformly annealed at 300-500 DEG C for heat forging with deformation of not more than 20%, the multi-pass hot rolling with the pass reduction of not more than 30% is performed; or the multi-pass hot rolling with the pass reduction of not more than 30% is directly performed for the blank ingot after homogenization in the step 2; and a product obtained by hot rolling is annealed to obtain the Al-Si alloy plate product. The prepared high-silicon-content aluminum-silicon alloy blank ingot is precise in component control, compact, and short in heat deformation and heat treatment process flow; and the obtained Al-Si alloy plate has such physical and mechanical performances as air tightness, heat conductivity, thermal expansion coefficient, tensile strength and bending strength needed by application of electronic packing materials, reduces the subsequent mechanical workload of the materials, and improves the utilization rate and the production efficiency of the materials.

Description

technical field [0001] The invention relates to a thermal processing and heat treatment process of an aluminum-silicon alloy plate prepared by a powder metallurgy sintering process, a method for realizing plastic deformation and improving performance by using the thermal processing and heat treatment technology, which can be used in light electronic packaging materials and belongs to powder metallurgy Material processing and heat treatment field. Background technique [0002] With the rapid development of modern electronic information technology, electronic devices and systems are developing in the direction of integration, miniaturization, high efficiency and high reliability, and the complexity and density of related components in electronic systems are increasing day by day. A new type of electronic packaging material that is excellent and meets various needs. Aluminum-silicon (Al-Si) alloy with high silicon content has become the material of choice for lightweight elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/14B22F3/18B22F3/17C22F1/043C22C21/02
CPCB22F3/14B22F3/17B22F3/18B22F2003/175B22F2003/185B22F2998/10C22C21/02C22F1/043B22F1/0003B22F3/02B22F2003/248
Inventor 余琨
Owner HUNAN HYDRO DYNAMIC NEW MATERIAL CO LTD
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