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Rhodium plating method of molybdenum sheets used for semiconductors

A semiconductor and molybdenum sheet technology, which is applied in the field of rhodium plating process for semiconductor molybdenum sheets, can solve the problems of limiting the thickness of the non-crack coating, pores or shedding, and discoloration of the coating, and achieve good compactness, stable properties, and uniform rhodium coating Effect

Inactive Publication Date: 2016-12-21
成都立威讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no mature process for rhodium plating on molybdenum substrates. The existing rhodium plating process will generate high stress when electroplating the rhodium layer, and the coating is prone to discoloration, cracks, pores or peeling off, which greatly limits the thickness of the crack-free coating.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of molybdenum sheet rhodium plating process for semiconductors of the present embodiment is mainly realized by the following technical scheme: a kind of molybdenum sheet rhodium plating process for semiconductors is used for electroplating rhodium molybdenum sheets for semiconductors with a molybdenum mass fraction greater than 99.9%, including The following steps:

[0024] Step 1: preprocessing;

[0025] Step 2: pickling;

[0026] Step three: alkaline washing;

[0027] Step 4: Rhodium plating.

[0028] The pretreatment process is used to thoroughly remove impurities such as floating ash and dust on the surface of the molybdenum sheet as far as possible;

[0029] The pickling and alkali cleaning processes are used to remove the oxide layer on the surface of the molybdenum sheet, and do substrate surface treatment for electroplating rhodium;

[0030] The rhodium electroplating process is used to coat a uniform rhodium layer on the surface of the molybdenum she...

Embodiment 2

[0033] This embodiment is further optimized on the basis of the above embodiments. Further, in order to better realize the present invention, a rhodium plating process for molybdenum sheets for semiconductors is used for electroplating rhodium on molybdenum sheets for semiconductors with a molybdenum mass fraction greater than 99.9%. Include the following steps:

[0034] Step 1: Pretreatment; specifically, soaking the molybdenum sheet with deionized water and ultrasonic waves for 2-6 minutes to remove impurities such as dust on the surface of the molybdenum sheet.

[0035] Step 2: pickling; specifically, the pretreated molybdenum flakes quickly enter the pickling tank, and in the pickling solution at a current density of 0.02-0.2A / dm 2 Power on and react for 1-5 minutes, and then rinse the pickling solution on the surface of the molybdenum sheet with deionized water; the pickling solution is a sulfuric acid solution with a mass fraction of 18-22%.

[0036] Step 3: Alkali wash...

Embodiment 3

[0040] This embodiment is further optimized on the basis of the above-mentioned embodiments. Further, in order to better realize the present invention, a rhodium-plating process for molybdenum sheets for semiconductors is aimed at installing 6 pieces of molybdenum sheets with a diameter of 80-110mm at the same time on a pair of hangers. Molybdenum wafers are electroplated, including the following steps:

[0041] Step 1: Pretreatment; specifically, soaking the molybdenum sheet with deionized water and ultrasonic waves for 2-6 minutes to remove impurities such as dust on the surface of the molybdenum sheet.

[0042] Step 2: pickling; specifically, the pretreated molybdenum flakes quickly enter the pickling tank, and in the pickling solution at a current density of 0.02-0.2A / dm 2 Power on and react for 1-5 minutes, and then rinse the pickling solution on the surface of the molybdenum sheet with deionized water; the pickling solution is a sulfuric acid solution with a mass fractio...

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Abstract

The invention discloses a rhodium plating method of molybdenum sheets used for semiconductors. The rhodium plating method is used for rhodium plating of molybdenum sheets used for semiconductors, wherein the molybdenum mass fraction of the molybdenum sheets is higher than 99.9%. The rhodium plating method comprises following steps: 1, pretreatment; 2, acid washing; 3, alkaline washing; and 4, electroplating of rhodium. According to the rhodium plating method, combination of rhodium plating layers with the molybdenum sheets is excellent; and after rhodium plating, no dark spot, oil stain, or peeling is observed on the surfaces of the molybdenum sheets.

Description

technical field [0001] The invention relates to the field of noble metal electroplating for semiconductor materials, in particular to a rhodium-plating process for molybdenum sheets for semiconductors. Background technique [0002] With the rapid development of my country's economy, the continuous improvement of people's living standards, and the rapid development of the semiconductor industry, in order to maintain stable performance in high-temperature environments such as IGBT modules, the surface of the molybdenum substrate needs to be coated with a layer to prevent molybdenum oxidation and prevent Coatings that affect the flatness and physical properties of molybdenum substrates. In industry, it has been found that the physical properties of rhodium and molybdenum are relatively close and the surface forms a protective layer after oxidation, thereby preventing further oxidation. However, there is no mature process for rhodium plating on molybdenum substrates. The existin...

Claims

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Application Information

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IPC IPC(8): C25D7/12C25D5/38C25D3/50
CPCC25D7/12C25D3/50C25D5/38
Inventor 杨素贤
Owner 成都立威讯科技有限公司