Organosilicon waterproof dustproof anticorrosion adhesive, and preparation method and application thereof

A technology of three-proof glue and silicone, which is applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor waterproof effect, high cost and complicated preparation process of small-pitch high-definition display screens, and achieve Improvement of working stability and reliability, reduction of viscosity, and expansion of application range

Inactive Publication Date: 2017-01-04
深圳市钧泰丰新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a silicone three-proof glue and its preparation method and application, so as to solve the problem of complicated preparation process, high cost and poor waterproof effect of the silicone potting glue in the prior art when applied to small-pitch high-definition display screens. question

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Preparation of synthetic reinforcing agent: mix ethyl orthosilicate, polymethyltriethoxysilane, trimethylsilanol, ethanol, and acetic acid aqueous solution in a weight ratio of 100:30:150:60:5, and heat at 40°C Under the conditions of reaction for 3 hours, then under the conditions of 30 ℃ and pressure -0.5MPa, low molecular solvents such as ethanol, methanol and water were distilled off to obtain an oily viscous and transparent synthetic reinforcing agent.

[0028] Preparation of silicone conformal adhesive: component A is mixed with hydroxyl-terminated polydimethylsiloxane, dimethyl silicone oil, synthetic reinforcing agent and diluent in a weight ratio of 100:20:10:60, packaged ; Component B is formed by mixing crosslinking agent, catalyst, coupling agent and diluent in a weight ratio of 6.0:5.0:10:180, and packaged. A component and B component are mixed in a weight ratio of 1:1.

[0029] Mix component A and component B and stir evenly, pour into the mold, the surfa...

Embodiment 2

[0031] Preparation of synthetic reinforcing agent: Mix ethyl orthosilicate, polymethyltriethoxysilane, trimethylsilanol, ethanol, and acetic acid aqueous solution in a weight ratio of 100:30:200:60:5, and heat at 60°C Under the conditions of reaction for 4 hours, then under the conditions of 50 ℃ and pressure -0.1MPa, low molecular solvents such as ethanol, methanol and water were distilled off to obtain an oily viscous and transparent synthetic reinforcing agent.

[0032] Preparation of silicone conformal adhesive: component A is mixed with hydroxyl-terminated polydimethylsiloxane, dimethyl silicone oil, synthetic reinforcing agent and diluent in a weight ratio of 100:20:20:60, packaged ; Component B is made by mixing cross-linking agent, catalyst, coupling agent and diluent in a weight ratio of 6:4.0:8:160, and packaged. A component and B component are mixed in a weight ratio of 1:1.

[0033] Mix component A and component B and stir evenly, pour into the mold, the surface d...

Embodiment 3

[0035] Preparation of synthetic reinforcing agent: mix ethyl orthosilicate, polymethyltriethoxysilane, trimethylsilanol, ethanol, and acetic acid aqueous solution in a weight ratio of 100:50:200:60:10, and heat at 45°C Under the conditions of reaction for 4 hours, then under the conditions of 40 ℃ and pressure -0.3MPa, low molecular solvents such as ethanol, methanol and water were distilled off to obtain an oily viscous and transparent synthetic reinforcing agent.

[0036] Preparation of silicone conformal adhesive: component A is mixed with hydroxyl-terminated polydimethylsiloxane, dimethyl silicone oil, synthetic reinforcing agent and diluent in a weight ratio of 100:30:20:80, packaged ; Component B is formed by mixing cross-linking agent, catalyst, coupling agent and diluent in a weight ratio of 10:2.0:12:150, and packaged. A component and B component are mixed in a weight ratio of 1:1.

[0037] Mix component A and component B and stir evenly, pour into the mold, the surf...

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Abstract

The invention discloses an organosilicon waterproof dustproof anticorrosion adhesive which comprises a component A and a component B in a weight ratio of 1:1. The component A is composed of the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 20-50 parts of dimethyl silicone oil, 10-40 parts of synthetic reinforcing agent and 60-100 parts of diluter. The component B is composed of the following raw materials in parts by weight: 6-20 parts of crosslinking agent, 2.0-5.0 parts of catalyst, 3-15 parts of coupling agent and 120-180 parts of diluter. The invention also discloses a preparation method of the organosilicon waterproof dustproof anticorrosion adhesive and application of the organosilicon waterproof dustproof anticorrosion adhesive in LED (light-emitting diode) lamp bars and display screens. The method can effectively enhance the properties of the organosilicon waterproof dustproof anticorrosion adhesive, and has the advantages of fewer preparation steps and lower cost. After being coated on the surface of the LED lamp bar and display screen, the organosilicon waterproof dustproof anticorrosion adhesive can perform the waterproof dustproof anticorrosion functions, and thus, the working stability and reliability are effectively enhanced.

Description

technical field [0001] The invention relates to a packaging material for LED products, in particular to an organic silicon conformal adhesive and its preparation method and application. Background technique [0002] After decades of development, LED technology has been widely used in sign lighting, signal display, backlight of liquid crystal display, automobile combination taillight and other products, due to its longer durability, lower energy consumption, energy saving and environmental protection And other advantages, it is expected to become the fourth generation of light sources after incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps. LED needs to be packaged with potting glue to ensure high transparency and long-term working stability. Therefore, the development of LED will inevitably drive the application and development of potting glue. [0003] At present, the packaging materials of LED products mainly include: epoxy resin, polyurethane,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J11/08C09J11/06
CPCC09J183/06C08L2203/206C08L2205/025C08L2205/03C09J11/06C09J11/08C08L83/04C08K5/54C08K5/5415C08K5/5419C08K5/544C08K5/5435
Inventor 张燕袁磊袁志钧
Owner 深圳市钧泰丰新材料有限公司
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