High-conductivity low-temperature sliver paste and preparation method thereof
A high-conductivity, low-temperature technology, applied in the direction of cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problem that the resin cannot fully and effectively coat the silver powder, the surface layer of the silver powder is not adsorbed firmly, and high polymerization To avoid problems such as poor hardness of objects, to avoid overall performance decline, good adhesion and wear resistance, and fast curing reaction
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0044] The present invention will be further described below in conjunction with accompanying drawing and embodiment:
[0045] Preparation of High Conductivity Low Temperature Silver Paste
[0046] According to the formula in Table 1, mix and disperse the high-toughness resin, thickener, toughening agent, curing agent, and organic solvent in sequence; then add low-melting point alloy, flux, and conductive silver powder in sequence, and stir at 1200 rpm for 15 minutes to obtain Slurry: use a three-roll grinder to grind the obtained slurry to a fineness of 5-10 μm to obtain conductive silver paste.
[0047] Print conductive silver paste evenly on PET by screen printing, bake the PET film in a blast oven at 150°C for 50 minutes, take it out and cool it, measure the line thickness (film thickness is 4-6 microns), line resistance, Hardness, adhesion, bending and other performance results. According to the film thickness, line resistance, line width, and line length, use the squar...
PUM
Property | Measurement | Unit |
---|---|---|
boiling point | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
glass transition temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com