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Negative-type photosensitive resin comopsition and photocurable pattern forming by the same

A photosensitive resin and photocurable technology, which is applied in the field of negative photosensitive resin composition and photocurable patterns formed by it, can solve the problems of inability to display resolution, etc., and achieve excellent pattern forming ability and adhesion Excellent, fine pattern effect

Inactive Publication Date: 2017-03-15
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Korean Registered Patent No. 10-1302508 discloses a negative photosensitive resin composition excellent in heat resistance and light resistance by including a copolymer obtained by polymerization using a cyclohexene acrylate monomer, but cannot show Resolution Required for Forming Fine Patterns

Method used

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  • Negative-type photosensitive resin comopsition and photocurable pattern forming by the same
  • Negative-type photosensitive resin comopsition and photocurable pattern forming by the same
  • Negative-type photosensitive resin comopsition and photocurable pattern forming by the same

Examples

Experimental program
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Effect test

manufacture example 1

[0103] Production example 1. Synthesis of alkali-soluble resin (A-1)

[0104] In a 1L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, flow nitrogen at 0.02L / min to form a nitrogen atmosphere, introduce 200g of propylene glycol monomethyl ether acetate, and after raising the temperature to 100°C, add acrylic acid 46.8 g (0.65 mol), styrene 26.0g (0.25 mol), tricyclic [5.2.1.0 2,6 ] 22.3 g (0.10 mol) of decyl methacrylate was stirred.

[0105] Next, in this reaction solution, 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) was added dropwise to propylene glycol monomethyl ether acetate from the dropping funnel over 2 hours. 150 g of the obtained solution was further stirred at 100° C. for 5 hours.

[0106] In the above reaction mixture, 64.0 g [0.45 mol (69 mol % relative to the acrylic acid used in this reaction)] of glycidyl methacrylate was further put into the flask, and the reaction was continued at 110° C. for 6 hours to obtain a solid content o...

manufacture example 2

[0109] Production example 2. Synthesis of alkali-soluble resin (A-2)

[0110] Under the same conditions as in Production Example 1, 46.8 g (0.65 moles) of acrylic acid, 26.0 g (0.25 moles) of styrene, tricyclic [5.2.1.0 2,6 ] 22.0 g (0.10 mol) of decyl methacrylate was dissolved in 150 g of propylene glycol monomethyl ether acetate, and 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) was added The solution was added dropwise from the dropping funnel to the flask over 2 hours. Then, 37.0 g [0.26 mol (40 mol % relative to the acrylic acid used in this reaction)] of glycidyl methacrylate was put into the flask, and the reaction was continued at 110° C. for 6 hours to obtain a solid content with an acid value of 68 mgKOH / g. Copolymer A-2 represented by the repeating unit of the above Chemical Formula 1-1. The polystyrene-equivalent weight average molecular weight measured by GPC was 12,400, the molecular weight distribution (Mw / Mn) was 2.1, and the calculated double bond equival...

manufacture example 3

[0111] Production example 3. Synthesis of alkali-soluble resin (A-3)

[0112] Under the same conditions as in Production Example 1, 46.1 g (0.64 moles) of acrylic acid, 27.1 g (0.26 moles) of styrene, tricyclic [5.2.1.0 2,6 ] 22.0 g (0.10 mol) of decyl methacrylate was dissolved in 150 g of propylene glycol monomethyl ether acetate, and 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) was added The solution was added dropwise from the dropping funnel to the flask over 2 hours. Then, 21.3 g [0.15 mol (23 mol % relative to the acrylic acid used in this reaction)] of glycidyl methacrylate was put into the flask, and the reaction was continued at 110° C. for 6 hours to obtain a solid content with an acid value of 78 mgKOH / g. Copolymer A-3 represented by the repeating unit of the above Chemical Formula 1-1. The polystyrene-equivalent weight average molecular weight measured by GPC was 14,300, the molecular weight distribution (Mw / Mn) was 2.4, and the calculated double bond equival...

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Abstract

The present invention relates to a negative photosensitive resin composition and a photocurable pattern formed therefrom, and more particularly to a negative type of a photocurable pattern capable of realizing a fine pattern having a fine line width and a high height, satisfying a specific parameter A photosensitive resin composition.

Description

technical field [0001] The present invention relates to a negative-type photosensitive resin composition and a photocurable pattern formed therefrom, and more particularly relates to a negative-type photosensitive resin composition that is excellent in pattern shape when forming a fine pattern and that can form a pattern with excellent adhesion to a substrate Resin composition and photocurable pattern formed therefrom. Background technique [0002] In the display field, the photosensitive resin composition is used for forming various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and columnar spacers. Specifically, the required photocuring pattern will be formed by selectively exposing and developing the photosensitive resin composition through the photolithography process, but in this process, in order to improve the yield of the process, the Physical properties require a highly sensitive photosensitive resin composition. ...

Claims

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Application Information

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IPC IPC(8): G03F7/038G03F7/027G03F7/004
CPCG03F7/004G03F7/027G03F7/0388
Inventor 赵庸桓安菩恩
Owner DONGWOO FINE CHEM CO LTD
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