Low-melting-point glass sizing agent and preparation method thereof

A low-melting glass and paste technology, applied in the field of low-melting glass paste and its preparation, to achieve the effects of improving insulation resistance, reducing dielectric loss, and stabilizing physical and chemical properties

Inactive Publication Date: 2017-03-22
广东羚光新材料股份有限公司
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention can effectively solve the problems of glass encapsulation paste in acid resistance, electroplating resistance, thermal shock resistance, etc. The sintering temperature is about 600°C, which can effectively ensure the stability and consistency of the adjacent silver layer, and the materials used can all Meet the requirements of foreign environmental protection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-melting-point glass sizing agent and preparation method thereof
  • Low-melting-point glass sizing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The low-melting point glass paste of the present embodiment is made up of following weight percent raw material:

[0035] Glass powder 65%, inorganic pigment 4%, organic vehicle 31%, of which glass powder is B 2 o 3 -SiO 2 -Bi 2 o 3 System glass powder, converted into oxides, is composed of the following components by weight percentage: B 2 o 3 10.5%, SiO 2 14%, Bi 2 o 3 66%, Nb 2 o 5 2.5%, ZnO 1.5%, CaO 1%, Al 2 o 3 2.5%, TiO 2 2%; Inorganic pigments are inorganic composite oxides, composed of the following transition metal oxides by weight percentage: NiO 40%, CoO 20%, Ti 2 O 40%; the organic vehicle is made up of the following raw materials in weight percentage: high molecular polymer 15% (wherein ethyl cellulose 11%, polyvinyl alcohol resin 4%), organic solvent 80% (wherein diethylene glycol butyl ether 20% , terpineol 20%, diethylene glycol butyl ether acetate 20%, ethyl oleate 10%, dimethyl phthalate 10%), organic additive 5% (choosing silicone...

Embodiment 2

[0046] The low-melting point glass paste of the present embodiment is made up of following weight percent raw material:

[0047] Glass powder 60%, inorganic pigment 3%, organic vehicle 37%, among which glass powder is B 2 o 3 -SiO 2 -Bi 2 o 3 System glass powder, converted into oxides, is composed of the following components by weight percentage: B 2 o 3 12%, SiO 2 19.5%, Bi 2 o 3 58%, Nb 2 o 5 1.5%, ZnO 3%, BaO 1%, Al 2 o 3 3%, ZrO 2%; Inorganic pigments are inorganic composite oxides, composed of the following transition metal oxides by weight percentage: NiO 40%, CoO 20%, Ti 2 O 40%; the organic vehicle is made up of the following raw materials in weight percent: high molecular polymer 20% (select ethyl cellulose for use), organic solvent 75% (wherein diethylene glycol butyl ether 20%, terpineol 20%, diethylene glycol 15% of glycol butyl ether acetate, 10% of ethyl oleate, 10% of dimethyl phthalate), 5% of organic additives (select polyacrylate).

[0048]...

Embodiment 3

[0057] The low-melting point glass paste of the present embodiment is made up of following weight percent raw material:

[0058] 70% glass powder, 3% inorganic pigment, 27% organic vehicle, of which glass powder is B 2 o 3 -SiO 2 -Bi 2 o 3 System glass powder, converted into oxides, is composed of the following components by weight percentage: B 2 o 3 16%, SiO 2 21%, Bi 2 o 3 51%, Nb 2 o 5 2.5%, ZnO 1.5%, BaO 1%, Al 2 o 3 4.5%, ZrO 1.5%, TiO 2 1%; Inorganic pigments are inorganic composite oxides, composed of the following transition metal oxides by weight percentage: NiO 40%, CoO 20%, Ti 2 O 40%; organic vehicle is made up of following raw material of percentage by weight: polymer 10% (select ethyl cellulose for use), organic solvent 85% (wherein diethylene glycol butyl ether 30%, terpineol 20%, diethylene glycol 15% glycol butyl ether acetate, 10% castor oil, 10% dimethyl phthalate), and 5% organic additives (select polyacrylate).

[0059] Its preparation...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
boiling pointaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses a low-melting-point glass sizing agent, which is prepared from, by weight percent, 50-80% of glass powder, 1-10% of inorganic pigment, and 19-40% of organic carrier; the glass powder is prepared from, by weight percent, 10-30% of B2O3, 10-25% of SiO2, 50-70% of Bi2O3, and 1-10% of Nb2O5; the inorganic pigment is inorganic composite oxide and consists of at least two transition metal oxides; the organic carrier is prepared from, by weight percent, 10-30% of high-molecular polymer, 40-85% of organic solvent, 5-30% of organic additive. The low-melting-point glass sizing agent is used for a thick film type resistor and excellent in both printing property and insulation property. The invention can effectively solve the problems of glass packing sizing agent in resisting acid, electroplating, heat impact and others; the materials can meet the EU RoHS environmental-friendly requirements.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a low melting point glass paste and a preparation method thereof. Background technique [0002] Low melting point glass paste, also called glass encapsulation paste, is a kind of thick film dielectric paste, which is specially used to protect chip resistors, thick film resistor networks and thick film hybrid integrated circuits, encapsulating a layer of glass glaze on the surface of components It is the most effective method to improve the stability of thick film components under hot and humid conditions and protect the surface from mechanical damage. The low melting point glass protective paste is composed of low melting point glass, inorganic pigment and organic vehicle. The requirements for the low-melting point glass protective paste are: low sintering temperature, little impact on the encapsulating resistance film, acid resistance, electroplating resistance, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/20C03C8/16C03C8/04
CPCC03C8/20C03C8/04C03C8/16
Inventor 王惠敏卢健聪谭汝泉宋先刚娄红涛梁炳联
Owner 广东羚光新材料股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap