A kind of epoxy resin composition using acrylate as latent curing agent

A latent curing agent, epoxy resin technology, applied in the field of epoxy resin preparation, can solve the problems of high curing temperature, crystallization, short storage period, etc., achieve high temperature reaction speed, good mechanical properties, normal temperature storage period long effect

Active Publication Date: 2018-07-20
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, dicyandiamide curing agent has an excellent storage period, but the curing temperature is relatively high, and the compatibility with epoxy resin is not good, and problems such as uneven reaction and crystallization are prone to occur.
Imidazole curing agent is a kind of highly active curing agent, which can cure epoxy resin in a short time at medium temperature, but the storage period is short, so it must be chemically modified to become a latent product with a certain storage period at room temperature. permanent curing agent
In addition, the commonly used epoxy resin latent curing agent has a complicated synthesis route, and the preparation process is time-consuming and energy-consuming. It is toxic and easily causes environmental pollution.

Method used

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  • A kind of epoxy resin composition using acrylate as latent curing agent
  • A kind of epoxy resin composition using acrylate as latent curing agent
  • A kind of epoxy resin composition using acrylate as latent curing agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Add 10g of 1,6-hexanediol diacrylate and 5g of zinc acetate to 100g of E51 bisphenol A epoxy resin in turn, mix well at 30°C; then pour the mixture into the mold and remove it in a vacuum oven at 60°C Foaming until the degassing is complete; raise the temperature of the oven to 200°C, and cure under vacuum for 3 hours. After the curing is complete, the epoxy resin cured product with acrylate as the latent curing agent is demoulded.

Embodiment 2

[0018] Add 20g of ethylene glycol dimethacrylate and 7.5g of magnesium chloride to 100g of E51 bisphenol A epoxy resin in turn, mix well at 30°C; then pour the mixture into the mold, and defoam in a vacuum oven at 60°C, Until the defoaming is complete; raise the temperature of the oven to 180° C., and cure under vacuum for 6 hours. After the curing is complete, the epoxy resin cured product with acrylate as the latent curing agent is demolded.

Embodiment 3

[0020] Add 15g of triethylene glycol diacrylate and 8g of zinc stearate to 100g of E44 bisphenol A epoxy resin in turn, mix well at 30°C; then pour the mixture into the mold, and defoam in a vacuum oven at 60°C , until the defoaming is complete; raise the temperature of the oven to 160° C., and cure under vacuum for 6 hours. After the curing is complete, the epoxy resin cured product with acrylate as the latent curing agent is demoulded.

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Abstract

The invention discloses an epoxy resin composition taking acrylate as a latent curing agent. The composition comprises the following raw materials in parts by weight: 100 parts of an epoxy resin, 5-50 parts of a curing agent and 1-30 parts of an accelerant, wherein the curing agent is one or a mixture of an acrylate monomer and an acrylate oligomer, and the accelerant is a metal oxide or a metal salt. The raw materials are simple to prepare, low in toxicity and environmental-friendly, and the constant temperature of the composition is long if being mixed with the epoxy resin, so that the storage period is effectively improved; the high-temperature reaction speed is fast, the shrinkage strain is little, and the composition has a good mechanical property.

Description

technical field [0001] The invention relates to the field of epoxy resin preparation, in particular to an epoxy resin using acrylate as a latent curing agent and a preparation method thereof. Background technique [0002] Epoxy resin is a synthetic resin widely used in many fields. It has excellent mechanical properties, bonding properties, heat resistance, and dimensional stability. It is widely used in electronics, chemicals, machinery, aerospace, coatings, adhesives Receive and other fields. Epoxy resin latent curing agent is one of the hot spots in the research of epoxy resin curing agent at home and abroad in recent years. Latent curing agent refers to the one-component system that is added to epoxy resin and has certain storage stability at room temperature, and can undergo curing reaction under conditions such as heating, light, and humidity. Compared with the two-component epoxy resin system, the one-component epoxy resin system prepared by mixing latent curing age...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/40
CPCC08G59/4007
Inventor 郑玉婴林腾飞刘晨
Owner FUZHOU UNIV
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