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Method for preparing high-dispersity spherical nano lead powder through lead-bearing soldering tin in electronic waste

A nano-lead powder and high-dispersibility technology, which is applied in the direction of nanotechnology, nanotechnology, nanotechnology, etc. for materials and surface science, can solve the problems of complex process and low output of chemicals, and achieve short process and high form. The effect of controllable size and high purity

Active Publication Date: 2017-04-19
EAST CHINA NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The process is complicated, consumes a lot of chemicals and has low output

Method used

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  • Method for preparing high-dispersity spherical nano lead powder through lead-bearing soldering tin in electronic waste
  • Method for preparing high-dispersity spherical nano lead powder through lead-bearing soldering tin in electronic waste
  • Method for preparing high-dispersity spherical nano lead powder through lead-bearing soldering tin in electronic waste

Examples

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Effect test

Embodiment 1

[0035] The method for preparing high-dispersibility spherical nano-lead powder by recycling lead-containing solder in electronic waste mainly includes the following steps:

[0036] The solder in the waste circuit board is separated from the bare board and electronic components by a certain method to obtain the waste solder, and the other parts are collected to avoid polluting the environment. Weigh 20 g of the obtained waste solder and place it in an alumina crucible, and then put the crucible into the heating chamber of a tube-type vacuum furnace. After sealing the system, the vacuum unit pumps the system pressure to 1Pa to remove the air in the vacuum furnace and avoid the oxidation of metal during heating and evaporation. Then nitrogen gas was introduced to keep the system pressure at 5000 Pa, and at the same time, the heating device was turned on, and the evaporation chamber was heated to 950 °C at a heating rate of 10 °C / min and kept for 60 min. The evaporated lead vapor...

Embodiment 2

[0038] The method for preparing high-dispersibility spherical nano-lead powder by recycling lead-containing solder in electronic waste mainly includes the following steps:

[0039] The solder in the waste circuit board is separated from the bare board and electronic components by a certain method to obtain the waste solder, and the other parts are collected to avoid polluting the environment. Weigh 20 g of the obtained waste solder and place it in a corundum crucible, and then put the crucible into the heating chamber of a tube-type vacuum furnace. Put a quartz tube in the condensation chamber as the condensation substrate. After sealing the system, the vacuum unit pumps the system pressure to 1Pa to remove the air in the vacuum furnace and avoid the oxidation of metal during heating and evaporation. Then nitrogen was introduced to keep the system pressure at 1000 Pa, and at the same time, the heating device was turned on, and the evaporation chamber was heated to 900 °C at a...

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Abstract

The invention discloses a method for preparing high-dispersity spherical nano lead powder through lead-bearing soldering tin in electronic waste. Waste soldering tin obtained and separated out on a waste printed circuit board is put into a vacuum furnace, a vacuum evaporation and forced convection inert gas condensation method is adopted, and the high-dispersity spherical nano lead powder is prepared by controlling the factors such as the heating temperature, the nitrogen pressure intensity, the condensation temperature and the powder collecting distance; and meanwhile, tin which is not evaporated is concentrated through the method, environmental heavy metal pollution is reduced, and the nano product with high additional value is prepared. The obtained product has wide application prospects in the field of lubricant additives, superconducting material studying, radiation protection, composite additives, electrode preparing and the like.

Description

technical field [0001] The invention belongs to the high-value recycling of electronic waste resources in the field of environmental protection and resource recycling, and relates to the recycling and recycling of metal elements in electronic waste, in particular to a method for preparing highly dispersed spherical nano-lead powder from waste solder. Background technique [0002] With the advancement of science and technology and the shortening of the life cycle of electronic products, the generation of electronic waste is increasing year by year. It is estimated that more than 20-50 million tons of e-waste are generated worldwide every year, and this amount increases by at least 3-5% every year. Electronic waste contains a large amount of various metals, and the content of metals after crushing exceeds 40%. The metal content is roughly: copper: ~20%, iron: ~8%, tin: ~4%, nickel: ~2% , Lead: ~2%, Aluminum: ~2%, Lead: ~1%, Silver: ~0.2%, Gold: ~0.1% and Palladium: ~0.005%. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/28B22F1/00B82Y40/00B82Y30/00
CPCB82Y30/00B82Y40/00B22F9/28B22F1/065B22F1/054
Inventor 詹路向希蜀
Owner EAST CHINA NORMAL UNIV
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