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A low sintering temperature power type piezoelectric ceramic material and its preparation method

A technology of low sintering temperature and piezoelectric ceramics, applied in the field of piezoelectric ceramics, can solve the problems of deteriorating electrical properties of piezoelectric materials and lowering insulation resistivity, and achieve the effects of low cost, reduced sintering shrinkage, and improved fluidity

Active Publication Date: 2020-03-17
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the relatively low melting point of silver, too high sintering temperature will cause silver ions to diffuse into the ceramic, which will reduce the insulation resistivity of the ceramic and deteriorate the electrical properties of the piezoelectric material.

Method used

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  • A low sintering temperature power type piezoelectric ceramic material and its preparation method
  • A low sintering temperature power type piezoelectric ceramic material and its preparation method
  • A low sintering temperature power type piezoelectric ceramic material and its preparation method

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preparation example Construction

[0050] 2. In the preparation method of the present invention, the method of spray granulation is adopted to improve the fluidity of the powder, increase the molding density, and reduce the sintering shrinkage. Adding CuO as a sintering aid after spray granulation can play a better role in the sintering aid;

[0051] 3. The preparation method of the present invention has the advantages of simple process, no need for special equipment, low cost, etc., is suitable for large-scale production, and meets the requirements of industrial production.

Embodiment 1

[0054] Pb 0.93 Sr 0.02 Ba 0.05 (Ni 1 / 2 W 1 / 2 ) 0.01 (Mn 1 / 3 Sb 2 / 3 ) 0.02 (Zr 0.527 Ti 0.473 ) 0.97 o 3 +0.01wt% Fe 2 o 3 +0.07wt%Sm 2 o 3 +0.1wt%MnO 2 +0.1wt% CuO piezoelectric ceramic material

[0055] Weigh out the stoichiometric ratio of Pb 3 o 4 , ZrO 2 、TiO 2 , SrCO 3 、BaCO 3 , MnCO 3 、Sm 2 o 3 , Sb 2 o 3 , Fe 2 o 3 , NiO, WO 3 For the raw material powder, use wet ball milling process to mix all the powders evenly; the ball milling conditions are: ball milling material, agate balls and deionized water are mixed at a mass ratio of 1:1.2:1.0, and ball milled for 24 hours. The obtained mixed powder is compacted and synthesized under atmospheric atmosphere. The synthesis temperature is 850°C and the synthesis time is 2 hours. Ionized water was mixed at a mass ratio of 1:1.2:1.0, and ball milled for 48 hours. Dry the finely ground powder, add polyvinyl alcohol (PVA) aqueous solution with a mass fraction of 7% of the powder mass and 5% as a bind...

Embodiment 2

[0057] Pb 0.93 Sr 0.02 Ba 0.05 (Ni 1 / 2 W 1 / 2 ) 0.01 (Mn 1 / 3 Sb 2 / 3 ) 0.02 (Zr 0.527 Ti 0.473 ) 0.97 o 3 +0.01wt% Fe 2 o 3 +0.07wt%Sm 2 o 3 +0.1wt%MnO 2 +0.2wt% CuO piezoelectric ceramic material

[0058] The only difference between this embodiment and embodiment 1 is: the mass of CuO powder added is 0.2wt% powder;

[0059] The rest of the content of this embodiment is the same as that described in Embodiment 1.

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Abstract

The invention relates to a low sintering temperature power type piezoelectric ceramic material and a preparation method thereof. The general chemical formula of the piezoelectric ceramic material is: Pb 1‑x M x (Ni 1 / 2 W 1 / 2 ) y (Mn 1 / 3 sb 2 / 3 ) z (Zr e Ti f ) 1‑y‑z O 3 +awt%Fe 2 O 3 +bwt%Sm 2 O 3 +cwt%MnO 2 + dwt%CuO, where: M is Sr 2+ and / or Ba 2+ ; c=0.01~0.4, d=0.1~0.4. The low sintering temperature piezoelectric ceramic material of the present invention has the advantages of low sintering temperature, high piezoelectric performance, high mechanical quality factor, high electromechanical coupling coefficient, moderate dielectric constant and small dielectric loss.

Description

technical field [0001] The invention relates to the field of piezoelectric ceramics, in particular to a low sintering temperature power type piezoelectric ceramic material and a preparation method thereof. Background technique [0002] In recent years, in order to meet the development needs of integrated circuit surface assembly technology, piezoelectric ceramic components are developing in the direction of miniaturization, machine integration, high performance, multi-function and integration. Low-temperature co-fired ceramic technology is used in the surface assembly technology of integrated circuits. On the one hand, it can increase assembly density, reduce volume, and reduce weight. On the other hand, it can improve reliability and performance, thereby shortening the assembly cycle. Laminated ceramics are one of the research hotspots. At present, there are mainly two methods to realize the laminated structure. One is to fire a single piece first, and then bond it to form...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/187C04B35/493C04B35/622H10N30/853
Inventor 董显林朱欣然梁瑞虹朱兴文
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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