Curing agent material formula of environment-friendly copper-clad plate without halogen or antimony

Abstract

The invention discloses a curing agent material formula of an environment-friendly copper-clad plate without halogen or antimony. The copper-clad plate comprises two conductor layers, at least three insulation dielectric layers arranged between the two conductor layers, wherein the insulation dielectric layers include ethoxyline resin, curing agent, curing accelerator and padding, the curing agent is composed of stearin, diphenylmethane-4, 4'-diisocyanate, sodium hydroxide, triethanolamine, oxidizing agent, polyacrylamide, chitosan, water, trimethylolpropane and calcium lignosulphonate. According to the curing agent material formula of the environmentally friendly copper-clad plate without halogen or antimony, diphenylmethane-4, 4'-diisocyanate is adopted to replace toluene diisocynate in the traditional curing agents, on the one hand, the product price is more preponderant, on the other hand, toxicity is reduced, and accordingly environment-friendly performance of the product curing agent is improved; by adding chitosan, the flexibility of the curing agent finished product is improved, and the problem of bad toughness of the traditional curing agents is solved; by adding trimethylolpropane and calcium lignosulphonate, curing effect is enhanced.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate production, in particular to a curing agent material formula for a halogen-free, antimony-free and environment-friendly copper clad laminate. Background technique [0002] Copper clad laminate, also known as base material, is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot-pressed as a plate-shaped material, called Copper Clad Laminates. It is the basic material for PCB, often called the base material, and when it is used in the production of multilayer boards, it is also called the core board. According to mechanical rigidity, copper clad laminates are divided into rigid plates and flexible plates; according to different insulating material structures, they are divided into: organic resin copper clad laminates, metal based copper clad laminates, and ceramic based copper clad lamina...

AI Technical Summary

Problems solved by technology

A representative example of the above-mentioned imidazole latent curing agent is known as a microcapsule latent curing agent in which the surface of imidazole compound particles having the ability to cure epoxy resin is coated with an epoxy resin cured product. Obtained, and the curing effect of the above-mentioned curing agent is poor, and its performance needs to be further improved and perfected