Preparation method for phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive

Abstract

The invention provides a preparation method for a phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive, and relates to the preparation method for a phosphate adhesive. The preparation method is to solve problems of a conventional phosphate adhesive. The method comprises the following steps: 1, preparing an alcohol-soluble chromium aluminum dihydrogen phosphate matrix; 2, preparing a phenolic resin solution; 3, mixing the alcohol-soluble chromium aluminum dihydrogen phosphate matrix and the phenolic resin solution so as to obtain composite alcohol-soluble phosphoric acid resin; 4, preparing a curing agent; and 5, uniformly mixing the composite alcohol-soluble phosphoric acid resin and the curing agent so as to obtain the phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive. The phenolic resin modified high-temperature-resistant alcohol-soluble phosphate adhesive provided by the invention has higher adhesion strength, higher water resistance and lower dielectric loss; meanwhile, raw materials needed for preparation have extensive sources, and are cheap and easily available; and the molding process is simple and facilitates industrial production.

Description

technical field [0001] The invention relates to a preparation method of a phosphate adhesive. Background technique [0002] With the continuous advancement of aviation and aerospace technology, high-temperature-resistant adhesives with excellent performance have become a research hotspot in the field of bonding materials in recent years. There are two types of high temperature resistant adhesives, inorganic and organic adhesives. Organic adhesives, usually based on various polymers, have excellent bonding properties at room temperature, but cracking of the organic matrix in a high-temperature environment will cause the adhesive structure to fail. Inorganic adhesives are mainly composed of silicates and phosphates, which have excellent heat resistance, but low bonding strength. However, the preparation of inorganic / organic hybrid adhesives based on the respective advantages of the two types of adhesives is expected to achieve adhesives with good heat resistance and excellen...

AI Technical Summary

Problems solved by technology

Inorganic phosphate adhesives can be used to bond many materials such as metals, ceramics, composite materials, and glass. They can be cured at room temperature or at elevated temperatures. They have the advantages of good high temperature resistance and small curing shrinkage. The inorganic adhesives used are all water-based. When bonding materials containing hydrophobic coatings (the stable contact angle on the surface of the hydrophobic material is greater than 150°, and the rolling contact angle is less than 10°), the water-based adhesive cannot wet the hydrophobic coating. Therefore, the adhesive cannot play a corresponding bonding role, and the bonded parts are easy to fall off.

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