Memristor and application thereof
A memristor and top electrode technology, applied in the field of microelectronics, can solve the problems of material microstructure changes, difficulty in ensuring the cyclic stability and anti-fatigue characteristics of synaptic devices, and achieve good plasticity, enhanced time retention and anti-fatigue. performance, reducing power consumption
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Embodiment 1
[0036] A memristor comprises sequentially forming a bottom electrode layer, an intermediate dielectric layer and a top electrode layer on a substrate, and the intermediate dielectric layer is composed of a chalcogenide compound layer and an oxide layer. The substrate of this embodiment is a thermally oxidized silicon wafer, and the bottom electrode layer material is platinum; the chalcogenide layer material is ZnS, and its thickness is 70nm; the oxide layer material is ZnO, and its thickness is 20nm; , with a thickness of 50 nm.
[0037] The preparation method of the memristor of the present embodiment is as follows:
[0038](1) A 20nm-thick titanium film was prepared on the surface of the substrate by electron beam evaporation as a buffer layer. The main function is to increase the mechanical bonding force between the platinum film and the thermally oxidized silicon wafer and prevent the film from falling off.
[0039] The aforementioned substrate is a thermally oxidized sil...
Embodiment 2
[0054] The difference from Example 1 is that in the intermediate dielectric layer, the thickness of zinc sulfide is 30nm, and the thickness of zinc oxide is 10nm.
Embodiment 3
[0056] The difference from Example 1 is that the thickness of the intermediate dielectric layer zinc sulfide is 50nm, and the thickness of zinc oxide is 20nm.
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