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Surface-modified composite silica particles and polyimide film comprising same

A composite silicon dioxide and polyimide film technology, which is applied in the field of polyimide film, can solve problems such as increased haze, and achieve the goal of improving dispersibility, improving physical properties, compatibility and dispersibility Effect

Active Publication Date: 2017-05-10
KOLON IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, when most organic substances are used in large quantities, there are differences in varying degrees depending on the size of the particles and the method of preparing the particles, but it is exposed that the haze (haze) increases due to the aggregation of inorganic substances when forming a thin film.

Method used

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  • Surface-modified composite silica particles and polyimide film comprising same
  • Surface-modified composite silica particles and polyimide film comprising same
  • Surface-modified composite silica particles and polyimide film comprising same

Examples

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Effect test

preparation example 1

[0068] Preparation Example 1: Preparation of Silica Particles

[0069] Add 300g of ethanol in a 500ml beaker, and add 7g of tetraethoxysilane (tetraethoxysilane, TEOS, Si(OC 2 h 5 ) 4 , Sigma-Aldrich), stirred at room temperature for 30 minutes. Next, slowly add 25 g of NH 4 After OH, it was stirred at the same temperature for 6 hours. After the reaction product obtained after the completion of the reaction was filtered, washed three times with ethanol (50 ml), and then dried in an oven at 40° C. under reduced pressure for 5 hours, 5 g of silica particles with an average particle diameter of 0.2 μm were prepared. (SiO 2 ).

[0070] Here, the shape and size of silica particles were observed by TEM (Transmission Electron Microscopy: transmission electron microscope, 200kV, JEM-2000EX, JEOL, Japan), and the Zeta sizer (ELS- 8000, Otsukaelectronics, Japan) measured the average particle size of the particles.

preparation example 2

[0071] Preparation Example 2: Preparation of Polysiloxane

[0072] In a three-necked flask, mix 40g of diphenylsilanediol (Diphenylsilandiol, DPSD, (C 6 h 5 ) 2 Si(OH) 2 , Sigma-Aldrich) and 40g of phenyltrimethoxysilane (PTMS, C 6 h 5 Si(OCH) 3 , Sigma-Aldrich), reacted at 80° C. for 10 hours to obtain 60 g of polysiloxane with a weight average molecular weight of 5000.

[0073] Here, the weight-average molecular weight (unit: g / mol) of polysiloxane is measured by GPC (Gel Permeation Chromatography: Gel Permeation Chromatography, ViscoTek Company) using polysiloxane standard (PS standard) as a standard. Measured.

preparation example 3

[0074] Preparation Example 3: Preparation of Surface Modified Composite Silica

[0075] After 5 g of the silica particles obtained in Preparation Example 1 were dispersed in 300 ml of ethanol, 0.5 g of the polysiloxane obtained in Preparation Example 2 and 1 ml of NH 4OH, reacted at room temperature for 12 hours, and prepared surface-modified composite silica particles with an average particle size of 0.2 μm. After the reaction, the obtained reaction product was filtered and washed three times with ethanol (50 ml).

[0076] At this time, the particle diameter of the surface-modified composite silica was measured by the same method as the method for measuring the average particle diameter of the above-mentioned silica particles.

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Abstract

The present invention relates to surface-modified composite silica particles and a polyimide film comprising the same. The present invention provides: surface-modified composite silica particles which are modified with polysiloxane including a phenyl group to improve compatibility and dispersibility with respect to polymers; and a polymer composite with excellent surface hardness characteristics, manufactured using the particles, especially, a polyimide film.

Description

technical field [0001] The present invention relates to a surface-modified composite silica particle and a polyimide film containing the surface-modified composite silica particle. Dahua's surface-modified composite silicon dioxide particles and an organic-inorganic composite polyimide film containing the surface-modified composite silicon dioxide particles. Background technique [0002] Generally, polyimide (PI) resin is an insoluble and infusible ultra-high heat-resistant resin, which has excellent properties such as oxidation resistance, heat resistance, radiation resistance, low temperature properties, and chemical resistance, so it is used in Heat-resistant cutting-edge materials such as automotive materials, aviation materials, and spacecraft materials, as well as electronic materials such as insulating coating agents, insulating films, semiconductors, and TFT-LCD electrode protective films. [0003] Such a polyimide is produced by solution-polymerizing an aromatic di...

Claims

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Application Information

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IPC IPC(8): C08K9/06C08K3/36C08G77/04C08L83/04C08L79/08C08J5/18
Inventor 李容根郑鹤基
Owner KOLON IND INC
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