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Processing method for selected electroplating area of bismuth telluride thermoelectric cooling chip

A technology for cooling chips and selective electroplating, applied in circuits, semiconductor devices, etc., can solve the problems of inability to recycle bismuth telluride powder, high production cost, and inability to separate nickel, tin, and gold.

Active Publication Date: 2017-05-17
鹏南科技(厦门)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention aims to provide a selective electroplating area processing method for a bismuth telluride temperature difference cooling chip to solve the problem that the existing bismuth telluride powder cannot be directly recycled and reused, and nickel tin gold cannot be separated from the bismuth telluride powder. Causes a lot of waste and high production costs

Method used

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Embodiment Construction

[0032] The present invention will be further described in conjunction with specific embodiments.

[0033] As a specific embodiment, a method for processing a selective electroplating region of a bismuth telluride temperature difference cooling chip according to the present invention, the process flow specifically includes the following steps:

[0034] S0, the step of pretreating the bismuth telluride substrate, this step specifically includes the following three steps:

[0035] A. Steps for ultrasonic degreasing: put the bismuth telluride thermocooling chip into solution A for ultrasonic degreasing to remove the grease on the surface. The content per L of each component in solution A is: ultrasonic degreasing agent 75±5g / L, the temperature of solution A is 50±5°C, and the ultrasonic degreasing time is 600±60S;

[0036] B, the step of neutralizing and activating sulfuric acid: neutralize and remove the alkaline substance on the surface of the bismuth telluride temperature diff...

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Abstract

The invention discloses a processing method for a selected electroplating area of a bismuth telluride thermoelectric cooling chip. The following technical scheme is adopted: a photosensitive emulsion shielding process is adopted, emulsion coating, exposure and development are carried out on an area needing electroplating, and the electroplating is carried out with a medicinal liquid; the other areas are protected by an electroplating-resistant photosensitive emulsion; and the photosensitive emulsion is removed after the electroplating to achieve the purpose of selecting the electroplating area. The process is reasonable and feasible in layout, and capable of saving the losses of nickel, tin and gold, and improving recycling for a cutting powder; and a plating layer on the surface of a product is high in binding force, and the production cost is greatly lowered.

Description

technical field [0001] The invention relates to the technical field of bismuth telluride chip processing, in particular to a processing method for selective region electroplating of a bismuth telluride temperature difference cooling chip. Background technique [0002] Bismuth telluride is an important material for the production of semiconductors, and has good temperature difference refrigeration. However, at present, most of the bismuth telluride cylinders are first cut into the bismuth telluride substrate for rack plating, and then cut into cuboids. The chip is soldered on the substrate. [0003] Regarding the electroplating process of bismuth telluride, the Chinese patent application publication number CN104451797A discloses a tin-plating processing method for a bismuth telluride substrate, including the following steps: A, a step of ultrasonic alkaline degreasing; B, sulfuric acid neutralization and the step of activation; C, the step of electroplating bottom nickel; D,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D7/12C25D5/14
CPCC25D5/022C25D5/14C25D7/12
Inventor 陈天顺李南生
Owner 鹏南科技(厦门)有限公司
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