Resin composition and prepreg, laminated board and interlayer insulating film manufactured thereby

Abstract

The invention discloses a resin composition. The resin composition comprises the following solids in parts by weight: (a) 10-80 parts of maleimide resin, (b) 10-80 parts of a silica crosslinking agent, (c) 0.01-5 parts of an initiator, (d) 0-60 parts of inorganic filler and (e) 0-30 parts of a flame retardant. By adopting the silica crosslinking agent, the problems that in the prior art, hydrocarbon resin such as polybutadiene is poor in adhesiveness, poor in thermal expansion, insufficient in heat resistance, poor in compatibility with other resin and the like are further solved on the basis of providing an excellent dielectric property for the maleimide resin.

Description

technical field [0001] The invention relates to a resin composition and a prepreg, a laminate and an interlayer insulating film made by using the resin composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, information terminals such as personal computers and servers, and communication equipment such as Internet routers and optical communications process large-capacity information at high speeds, and the high-speed and high-frequency electrical signals are advancing. The integrity of high-speed high-frequency products is the focus of attention. The impact of printed circuit board materials on high-speed signal integrity is mainly reflected in signal loss, including reflection, skin effect, and dielectric loss. Especially in recent years, along with the miniaturization and thinning of packaging substrates for semiconductors, there is a problem of increasing warpage due to the difference in thermal expansion coeff...

AI Technical Summary

Problems solved by technology

However, it was found during use that polybutadiene has the following problems: (1) the high viscosity of the prepreg (prepreg) is not conducive to storage and use; (2) poor compatibility with thermosetting resins, in the lamination process Phase separation occurs in the laminate and oozes out from the laminate, resulting in the inability to fully reflect the excellent dielectric properties of polybutadiene and severely reducing the heat resistance, rigidity and adhesion of the sheet

[0005] In order to solve the problem of using polybutadiene, Japanese patent JP2014101398 uses polyphenylene ether modified polybutadiene to improve the compatibility of the resin composition, so a large amount of inorganic filler can be added to the resin composition to improve The rigidity and thermal expansion properties of the board, but the addition of a large amount of inorganic fillers seriously affects the adhesion of the board and the drilling processability of the subsequent PCB

U.S. Patent No. 6,569,943 uses an amino-modified liquid polybutadiene resin with a vinyl group at the end of the molecule, adds a large amount of low-molecular-weight monomer dibromostyrene as a curing agent and a diluent, and impregnates glass fiber cloth to make it Although the dielectric properties of the circuit board are very good, because the resin system is liquid at room temperature, it cannot be made into a non-stick prepreg. Therefore, it is difficult to use the general prepreg stacking process when the board is pressed and formed. tougher

Japanese patent JP2008133454 discloses a resin composition containing unmodified polybutadiene and polymaleimide. In this technical scheme, the dielectric properties and bonding properties of the cured product can be improved due to the use of polymaleimide resin. However, due to the use of unmodified polybutadiene, there is a problem of poor compatibility in the process of mixing with polymaleimide resin, which affects the overall performance of the board

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