Cover plate of induction identification module, and preparation method and application thereof

A cover sheet and module technology, which is used in character and pattern recognition, instruments, computer parts, etc., can solve the problems of affecting the dielectric properties of the cover sheet, prone to warping edges, poor ceramic body density, etc. The effect of compactness, good surface flatness and high density

Active Publication Date: 2017-05-31
SHENZHEN SUNTECH ADVANCED CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the industrial production of ultra-thin zirconia fingerprint recognition cover sheet usually adopts tape casting process, and the tape casting process is to cast the prepared slurry to prepare green sheet. The content of zirconia in the slurry is low, organic matter Too many components will not only make the density of the ceramic body poor and affect the dielectric properties of the cover sheet, but also easily cause warping and edge bending during the sintering process, resulting in poor flatness of the substrate prepared by tape casting. Generally, it is necessary to ensure the flatness of the substrate through secondary sintering. However, the secondary sintering temperature is low, which will cause the grain growth of the substrate, resulting in a decrease in the strength of the cover sheet and a decrease in the dielectric constant.

Method used

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  • Cover plate of induction identification module, and preparation method and application thereof
  • Cover plate of induction identification module, and preparation method and application thereof

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preparation example Construction

[0026] Such as figure 1 As shown, the preparation method of the cover sheet of the inductive identification module in an embodiment, wherein the inductive identification module can be, for example, a fingerprint identification module, etc., the preparation method of the cover sheet of the inductive identification module includes the following steps:

[0027] Step S110: Press and shape the zirconia ceramic powder to obtain a green body.

[0028] Among them, before the step of pressing the zirconia ceramic powder, the preparation step of the zirconia ceramic powder is also included: the zirconia powder is mixed with organic additives for granulation to obtain the zirconia ceramic powder, wherein the zirconia powder The median diameter of the body is 0.54 microns to 0.68 microns. Organic additives are generally binders, such as PVA (polyvinyl alcohol) and the like.

[0029] Since the particle size of the material directly affects the microstructure of the sintered ceramic body,...

Embodiment 1

[0053] The preparation process of the cover sheet of the induction recognition module of this embodiment is as follows:

[0054] (1) Mix zirconia powder with a median diameter of 0.54 microns and polyvinyl alcohol at a mass ratio of 12:1, and spray granulate to obtain zirconia ceramic powders with a particle size of 80 microns to 150 microns. The zirconia ceramic powder is cold isostatically pressed to obtain a solid green body with a diameter of 70 mm and a length of 70 mm. The pressure during cold isostatic pressing is 160 MPa, and the pressing time is 1 minute.

[0055] (2) Sinter the green body obtained in step (1) under normal pressure, raise the temperature from room temperature to 750°C at a rate of 1°C / min, keep it warm for 1 hour, and then heat up to 750°C at a rate of 2°C / min 1200°C, keep it warm for 1 hour, then raise the temperature to 1400°C at a heating rate of 1°C / min, keep it warm for 1 hour, then raise the temperature to 1500°C at a heating rate of 1°C / min, ke...

Embodiment 2

[0061] The preparation process of the cover sheet of the induction recognition module of this embodiment is as follows:

[0062] (1) Mix zirconia powder with a median diameter of 0.68 microns and polyvinyl alcohol at a mass ratio of 12:1, and spray granulate to obtain zirconia ceramic powders with a particle size of 80 microns to 150 microns. The zirconia ceramic powder is cold isostatically pressed to obtain a solid green body with a diameter of 70 mm and a length of 70 mm. The pressure during cold isostatic pressing is 120 MPa, and the pressing time is 1 minute.

[0063] (2) Sinter the green body obtained in step (1) under normal pressure, raise the temperature from room temperature to 600°C at a heating rate of 2°C / min, keep it warm for 2 hours, and then heat up to 600°C at a heating rate of 3°C / min 1000°C, keep warm for 3 hours, then raise the temperature to 1300°C at a heating rate of 2°C / min, and keep warm for 2 hours, then raise the temperature to 1450°C at a heating ra...

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Abstract

The invention relates to a cover plate of an induction identification module, and a preparation method and an application thereof. The preparation method of the cover plate of the induction identification module comprises the following steps: press forming zirconia ceramic powder to obtain a blank; sintering the blank to obtain a zirconia ceramic body; cutting the zirconia ceramic body into pieces to obtain zirconia ceramic pieces, wherein the cutting process parameters are as follows: the line diameter of a cutting line is 0.14-0.30mm, the line feeding speed is 0.1-5mm/min, the line speed is 1000-1500m/min, the line tension is 10-50N, and the tilt angle is -7 degrees to 7 degrees; and perform silk screen printing on the zirconia ceramic pieces to obtain the cover plate of the induction identification module. The cover plate of the induction identification module prepared by the preparation method of the cover plate of the induction identification module has relatively high strength, better density and higher dielectric property.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to a cover sheet of an inductive identification module and a preparation method and application thereof. Background technique [0002] Fingerprint recognition is currently one of the most widely used technologies that can accurately identify personal identity information. Fingerprint identification technology has been applied in many fields, such as ID card, fingerprint time attendance card, fingerprint unlocking in electronic products (mobile phones), etc., which require authentication of personal identity information. Based on these applications, the recognition module is required to have fast recognition speed, high accuracy, high sensitivity and long service life. [0003] Capacitive fingerprint recognition module is currently the most widely used fingerprint recognition chip, which requires the fingerprint recognition module cover to have a high dielectric constant and a small...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00C04B35/48C04B35/622C04B35/634
CPCC04B35/48C04B35/622C04B35/63416C04B2235/60G06V40/1306
Inventor 陈强向其军林勇钊谭毅成黎景锋韦灵尧
Owner SHENZHEN SUNTECH ADVANCED CERAMICS
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