Intelligent power module, preparation method of intelligent power module, and power electronic equipment
A technology of intelligent power module and power device, which is applied in the direction of converting AC power input into DC power output, output power conversion device, and structural components of conversion equipment, etc., can solve the application difficulties and disadvantages of energy saving and miniaturization of intelligent power module. The market popularization of intelligent power modules and the high power consumption of intelligent power modules have achieved the effects of low power consumption, reduced size, and reduced power consumption
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Embodiment 1
[0129] The preparation method of the intelligent power module 200 according to the embodiment of the present invention includes: forming the circuit wiring 202, and forming the device pin 201 at the same time; performing the first packaging on the circuit wiring 202 and the device pin 201, Forming the package substrate 203, the top side and bottom side of the circuit wiring 202, and the top side and bottom side of the device pin 201 all protrude from the package substrate 203; after forming the package layer Welding a MOSFET power device 205 on the top side of the device pin 201; sequentially forming an insulating layer 206 and a gate drive device 207 on the top side of the MOSFET power device 205; The bonding wire 208 is formed between the circuit wirings 202 to bridge; the packaging substrate 203 formed with the MOSFET power device 205, the insulating layer 206, the gate driving device 207 and the bonding wire 208 is subjected to the second Secondary packaging to form a pack...
Embodiment 2
[0146] Such as Figure 7 As shown, the preparation method of the intelligent power module 200 according to the embodiment of the present invention includes:
[0147] (1) In step 702, the circuit wiring 202 and the device pin 201 are formed.
[0148] Such as Figure 3A to Figure 3C As shown, the first process of the present invention is a process of forming device pins 201 of appropriate size and circuit wiring 202 connected to some metal pins.
[0149] The device pins 201 and the circuit wiring 202 are processed by punching or etching a copper base material or an aluminum base material, and the thickness of the device pin 201 is larger than that of the circuit wiring 202, so that the device pin 201 can expose the smart power module 200, while circuit wiring 202 is completely encapsulated inside the module. The device pins 201 have functions such as input and output with the outside, and the circuit wiring 202 has a conduction path extending the device pins 201 to facilitate...
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Abstract
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Application Information
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