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Intelligent power module, preparation method of intelligent power module, and power electronic equipment

A technology of intelligent power module and power device, which is applied in the direction of converting AC power input into DC power output, output power conversion device, and structural components of conversion equipment, etc., can solve the application difficulties and disadvantages of energy saving and miniaturization of intelligent power module. The market popularization of intelligent power modules and the high power consumption of intelligent power modules have achieved the effects of low power consumption, reduced size, and reduced power consumption

Inactive Publication Date: 2017-05-31
GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0034] Since the above-mentioned intelligent power module 100 generally adopts IGBTs and FRDs based on silicon semiconductors, the IGBTs and FRDs based on silicon semiconductors have relatively large power consumption, and the IGBTs and FRDs based on silicon semiconductors occupy a relatively large layout area in the power module. This leads to the current intelligent power module not only consumes a lot of power, but also has a large area, which causes difficulties in the application of energy saving and miniaturization of the intelligent power module, and is not conducive to the future market popularization of the intelligent power module

Method used

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  • Intelligent power module, preparation method of intelligent power module, and power electronic equipment
  • Intelligent power module, preparation method of intelligent power module, and power electronic equipment

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Embodiment 1

[0129] The preparation method of the intelligent power module 200 according to the embodiment of the present invention includes: forming the circuit wiring 202, and forming the device pin 201 at the same time; performing the first packaging on the circuit wiring 202 and the device pin 201, Forming the package substrate 203, the top side and bottom side of the circuit wiring 202, and the top side and bottom side of the device pin 201 all protrude from the package substrate 203; after forming the package layer Welding a MOSFET power device 205 on the top side of the device pin 201; sequentially forming an insulating layer 206 and a gate drive device 207 on the top side of the MOSFET power device 205; The bonding wire 208 is formed between the circuit wirings 202 to bridge; the packaging substrate 203 formed with the MOSFET power device 205, the insulating layer 206, the gate driving device 207 and the bonding wire 208 is subjected to the second Secondary packaging to form a pack...

Embodiment 2

[0146] Such as Figure 7 As shown, the preparation method of the intelligent power module 200 according to the embodiment of the present invention includes:

[0147] (1) In step 702, the circuit wiring 202 and the device pin 201 are formed.

[0148] Such as Figure 3A to Figure 3C As shown, the first process of the present invention is a process of forming device pins 201 of appropriate size and circuit wiring 202 connected to some metal pins.

[0149] The device pins 201 and the circuit wiring 202 are processed by punching or etching a copper base material or an aluminum base material, and the thickness of the device pin 201 is larger than that of the circuit wiring 202, so that the device pin 201 can expose the smart power module 200, while circuit wiring 202 is completely encapsulated inside the module. The device pins 201 have functions such as input and output with the outside, and the circuit wiring 202 has a conduction path extending the device pins 201 to facilitate...

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Abstract

The invention provides an intelligent power module, a preparation method of the intelligent power module, and power electronic equipment. The intelligent power module comprises a conducting element layer, a plurality of MOSFET (Metal-Oxide -Semiconductor Field Effect Transistor) power devices, gate drive devices and a packaging housing, wherein the conducting element layer is provided with a circuit layout and a plurality of device pin parts; the circuit layout is used for communicating with the device pin parts; the bottom side faces of the MOSFET power devices are welded to the top side faces of the device pin parts; the gate drive devices are arranged on the top side faces of the MOSFET power devices; the packaging housing completely covers the circuit layout, the MOSFET power devices and the gate drive devices; an inner side of a self-packaging housing of each device pin part stretches out to the outer side; any two of the MOSFET power devices, the circuit layout and the gate drive devices are connected through bonding wires. Through the technical scheme provided by the invention, the surface area of the intelligent power module is effectively reduced, the integration level and the heat radiation efficiency of the intelligent power module are improved, and the intelligent power module is beneficial to marketing and batch producing.

Description

technical field [0001] The invention relates to the technical field of intelligent power modules, in particular, to an intelligent power module, a preparation method of the intelligent power module and a power electronic device. Background technique [0002] Intelligent Power Module, or IPM (Intelligent Power Module), is a power drive device that combines power electronics and integrated circuit technology. Due to the advantages of high integration and high reliability, intelligent power modules are winning more and more markets, especially suitable for frequency converters and various inverter power supplies for driving motors, and are ideal for frequency control, metallurgical machinery, electric traction, servo Power electronic devices commonly used in driving and frequency conversion household appliances. [0003] Figure 1A is a top view of the smart power module 100 . [0004] Figure 1B yes Figure 1A XX' line profile. [0005] Figure 1C yes Figure 1A Schematic...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L21/50H02M7/00
CPCH01L25/16H01L25/50H02M7/003H01L2224/48091H01L2224/49113H01L2924/181H01L2924/00014H01L2924/00012
Inventor 冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD