Preparation method of transparent thermoelectric module
A thermoelectric module, transparent technology, applied in the manufacture/processing of thermoelectric devices, ion implantation plating, coating, etc., to achieve the effects of increasing output power, reducing manufacturing costs, and reducing space
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Embodiment 1
[0034] A kind of preparation method of transparent thermoelectric module, see appendix Figure 1-7 , including the following steps:
[0035] (1) Deposition of P-type transparent thermoelectric arms: using pulsed laser deposition technology, KrF excimer laser wavelength 248nm, laser pulse width 28ns, laser energy 250mJ, laser frequency 3Hz, background vacuum 1×10 -3 Pa, the growth temperature is 700°C, the growth flow oxygen pressure is 0.5Pa as the process conditions, and the P-CuCr 0.99 Mg 0.01 o 2 Ceramic as the target material, polished Al on both sides 2 o 3 (0001) Deposit P-CuCr on one of the surfaces of the single crystal substrate 1 0.99 Mg 0.01 o 2 Thin film 2, during the deposition process, use nickel mask plate I4 to block the surface of the substrate to obtain a P-type transparent thermoelectric arm array with a thickness of 100nm;
[0036] (2) N-type transparent thermoelectric arm deposition: the double-sided polished Al in step (1) 2 o 3 (0001) The singl...
Embodiment 2
[0045] A kind of preparation method of transparent thermoelectric module, see appendix Figure 1-7 , including the following steps:
[0046] (1) Deposition of P-type transparent thermoelectric arms: using pulsed laser deposition technology, KrF excimer laser wavelength 248nm, laser pulse width 28ns, laser energy 300mJ, laser frequency 4Hz, background vacuum 1×10 -4 Pa, the growth temperature is 730°C, the growth flow oxygen pressure is 1Pa as the process conditions, and the P-CuCr 0.95 Mg 0.05 o 2 Ceramic as the target material, polished Al on both sides 2 o 3 (0001) Deposit P-CuCr on one of the surfaces of the single crystal substrate 1 0.95 Mg 0.05 o 2 Thin film 2, during the deposition process, use nickel mask plate I4 to block the surface of the substrate to obtain a P-type transparent thermoelectric arm array with a thickness of 200nm;
[0047] (2) N-type transparent thermoelectric arm deposition: the double-sided polished Al in step (1) 2 o 3 (0001) The single ...
Embodiment 3
[0056] A kind of preparation method of transparent thermoelectric module, see appendix Figure 1-7 , including the following steps:
[0057] (1) Deposition of P-type transparent thermoelectric arms: using pulsed laser deposition technology, KrF excimer laser wavelength 248nm, laser pulse width 28ns, laser energy 350mJ, laser frequency 5Hz, background vacuum 1×10 -4 Pa, the growth temperature is 760°C, the growth flow oxygen pressure is 1.5Pa as the process conditions, and the P-CuCr 0.92 Mg 0.08 o 2 Ceramic as the target material, polished Al on both sides 2 o 3 Depositing P-CuCr on the surface of (0001) single crystal substrate 1 0.92 Mg 0.08 o 2 Thin film 2, during the deposition process, use nickel mask plate I4 to block the surface of the substrate to obtain a P-type transparent thermoelectric arm array with a thickness of 300nm;
[0058] (2) N-type transparent thermoelectric arm deposition: the double-sided polished Al in step (1) 2 o 3 (0001) The single crystal...
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