Solder for welding of ceramic and metal and welding method

A technology of metal welding and welding method, which is applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve the problems such as the need to improve the bonding strength, complicated operation, inconvenient control, etc., achieve high bonding strength, simple method, low cost effect

Active Publication Date: 2017-06-13
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the bonding strength obtained by the above method still needs to be improved, and the cost of the former is high, the operation is complicated, and it is not easy to control

Method used

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  • Solder for welding of ceramic and metal and welding method
  • Solder for welding of ceramic and metal and welding method
  • Solder for welding of ceramic and metal and welding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A solder used for ceramic and metal welding, which is a bismuth-based glass frit, which contains components and their mass percentages are: Bi 2 o 3 70%, B 2 o 3 15%, ZnO 12%, and the rest are trace elements; the trace elements include SiO 2 、TiO 2 , MgO, and their mass percentages are 1%, 1%, and 1% respectively.

[0032] The brazing filler metal that is used for ceramics and metal welding adopts the following steps to prepare paste brazing filler metal:

[0033] First, the bismuth-based glass frit is ground into a powder with a particle size of 20 μm, and then an organic binder mixture is prepared with a mixture of ethyl cellulose and terpineol in a mass ratio of 1:3, and the bismuth-based glass frit is mixed with The mixing mass ratio of the mixture of ethyl cellulose and terpineol is 7:3 to make bismuth-containing glass paste.

[0034] The prepared bismuth-containing glass paste is used as welding raw material, and pure copper sheet and alumina ceramics are ...

Embodiment 2

[0038] (1) The structure in Example 1 was selected as the raw material matrix, and the alumina ceramics were replaced with aluminum nitride ceramics to make samples.

[0039] (2) The sample preparation method is similar to that in Example 1, the reflux temperature is 850°C, nitrogen gas is passed through during the reflux process, and the sample is cooled with the furnace.

[0040] The prepared samples were observed by scanning electron microscope, as Figure 5 As shown, a dense structure is formed, and the tensile strength of the structure can reach 10MPa after tensile test, which shows that this method can effectively connect aluminum nitride ceramics and copper.

Embodiment 3

[0042]On the basis of Example 1, the components contained in the bismuth-based glass frit and their mass percentages are: Bi 2 o 3 80%, B 2 o 3 7%, ZnO 9%, and the rest are trace elements; the trace elements include SiO 2 、TiO 2 , MgO, and their mass percentages are 1%, 1%, and 2% respectively. The preparation method of the solder used for ceramic and metal welding is the same as in Example 1.

[0043] The brazing material obtained above for welding ceramics and metals was used for the connection of copper sheet and aluminum nitride ceramics. After tensile test, the tensile strength of the structure was 8.2 MPa.

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Abstract

The invention provides a solder for welding of ceramic and metal and a welding method. The solder for welding of the ceramic and the metal is bismuth-based frit prepared from components in percentage by mass as follows: 60%-80% of Bi2O3, 5%-20% of B2O3, 7%-20% of ZnO and the balance of added microelements; the added microelements comprise one or more of SiO2, TiO2 and MgO. According to the technical scheme, under the chemical interaction of metal and bismuth oxide, the higher bonding strength is obtained; different from simple glass bonding and high-temperature sintering methods for the ceramic and the metal, the method is simple, low in cost and high in operability; a feasible method is provided for manufacturing of micro devices.

Description

technical field [0001] The invention belongs to the technical field of semiconductor device manufacturing technology, and in particular relates to a solder and a welding method for welding ceramics and metals. Background technique [0002] The joining of ceramics to metals has important applications in the field of semiconductor manufacturing. Encapsulation of ceramics and metals is an important link in the application of ceramics to electrical devices. The heat generated in the high power density electronic packaging is mainly dissipated through the ceramic metal clad plate to the shell. The most commonly used is the ceramic copper clad plate. At present, the ceramic copper clad plate is mainly directly bonded at high temperature through high conductivity oxygen-free copper. formed on the ceramic surface. It not only has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, but also has high ...

Claims

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Application Information

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IPC IPC(8): B23K35/14B23K1/19
Inventor 李明雨陈建强缪伟亮雷晴
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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