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Oxazolidinone structure-containing photocuring thermocuring resin and preparation method thereof, and photosensitive solder resisting material containing resin

A technology containing oxazolidinone and cured resin, which is applied in the field of photosensitive solder resist materials, can solve problems affecting the quality of circuit boards, easy foaming and peeling, etc., and achieve excellent heat resistance, increase cross-linking density, and excellent heat resistance and the effect of adhesion

Active Publication Date: 2017-06-13
FOSHAN 3Q ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional photosensitive solder resist materials are prone to blistering and peeling under high temperature conditions, which seriously affects the quality of circuit boards

Method used

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  • Oxazolidinone structure-containing photocuring thermocuring resin and preparation method thereof, and photosensitive solder resisting material containing resin
  • Oxazolidinone structure-containing photocuring thermocuring resin and preparation method thereof, and photosensitive solder resisting material containing resin
  • Oxazolidinone structure-containing photocuring thermocuring resin and preparation method thereof, and photosensitive solder resisting material containing resin

Examples

Experimental program
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Effect test

preparation example Construction

[0028] In one embodiment, the preparation method of the photocurable thermosetting resin containing oxazolidinone ring structure comprises the following steps:

[0029] Add diisocyanate, dibutyltin dilaurate and pentaerythritol triacrylate into the dibasic ester solvent respectively, keep the reaction temperature at 40°C-70°C, and react for a period of time. When the content of -NCO group in the reaction system is monitored to be When the initial content is 48%-50%, the reaction is stopped to obtain diisocyanic acid semi-adducts;

[0030] Add epoxy resin, catalyst and 2,6-di-tert-butyl-4-methylphenol to the diisocyanic acid semi-adduct respectively, keep the reaction temperature at 110°C-140°C, and react for a period of time. Stop the reaction when the -NCO group in the system disappears, and the 1750cm carbonyl in the oxazolidinone ring structure appears in the infrared spectrum -1 The absorption peak at the place, that is to obtain the oxazolidinone-containing structure lig...

Embodiment 1

[0056] Example 1: Preparation of oxazolidinone-containing structured light-curable heat-curable resin A

[0057] Add 257.8g of diphenylmethane diisocyanate and 0.8g of dibutyltin dilaurate to 36g of S150 aromatic hydrocarbon solvent respectively, add 298.3g of pentaerythritol triacrylate dropwise, keep the reaction temperature at 40-70°C, and react for 2-4h. When the content of -NCO group in the system is monitored to be 50% of the initial content, the reaction is stopped to obtain a diisocyanic acid semi-adduct, which is cooled to room temperature. Add 360 g of novolac epoxy resin (NPPN-638S), 0.7 g of N,N-dimethylbenzylamine, and 0.5 g of 2,6-di-tert-butyl-4-methylphenol into the resulting diisocyanate hemi-adduct , heated to 130°C, stopped the reaction when the -NCO group in the system disappeared, and carried out IR measurement on the product after the reaction, and the absorption peak at 1750cm-1 of the carbonyl in the oxazolidinone ring structure appeared in the infrared...

Embodiment 2

[0058] Example 2: Preparation of oxazolidinone-containing structured light-curable heat-curable resin B

[0059] Add 257.8g of diphenylmethane diisocyanate and 0.8g of dibutyltin dilaurate to 36g of S150 aromatic hydrocarbon solvent respectively, add 298.3g of pentaerythritol triacrylate dropwise, keep the reaction temperature at 40-70°C, and react for 2-4h. When the content of -NCO group in the system is monitored to be 50% of the initial content, the reaction is stopped to obtain a diisocyanic acid semi-adduct, which is cooled to room temperature. Add 276.9g of epoxy novolac resin (NPPN-638S), 0.7g of N,N-dimethylbenzylamine, and 0.5g of 2,6-di-tert-butyl-4-methylphenol to the resulting diisocyanate hemi-adduct , heated to 130°C, stopped the reaction when the -NCO group in the system disappeared, and carried out IR measurement on the product after the reaction, and the absorption peak at 1750cm-1 of the carbonyl in the oxazolidinone ring structure appeared in the infrared sp...

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Abstract

The invention relates to an oxazolidinone structure-containing photocuring thermocuring resin and a preparation method thereof, and a photosensitive solder resisting material containing the resin. In the preparation process of the oxazolidinone structure-containing photocuring thermocuring resin, diisocyanate, dibutyltin dilaurate and pentaerythritol triacrylate are added into a solvent respectively, a reaction temperature is kept at 40 DEG C-70 DEG C, the concentration change of -NCO groups in the system is monitored, the reaction is stopped when the content of the -NCO groups is 48%-55% of the initial content, and a diisocyanate semi-addition product is obtained; and then epoxy resin, a catalyst and 2,6-di-tert-butyl-4-methyl phenol are added to the diisocyanate semi-addition product respectively, a reaction temperature is kept at 110 DEG C-140 DEG C, the reaction is stopped when the content of the -NCO groups in the system is 0, a 1750 cm<-1> absorption peak of carbonyl in an oxazolidinone ring structure is determined to appear in an infrared spectrogram, and thus the oxazolidinone ring-containing photocuring thermocuring resin is obtained. The photocuring thermocuring resin prepared by the method has excellent heat resistance and good adhesive force.

Description

technical field [0001] The invention relates to the field of photocurable resins, in particular to an oxazolidinone-containing structured photocurable thermosetting resin, a preparation method thereof and a photosensitive solder resist material containing the same. Background technique [0002] Printed circuit board (PCB) is the basic industry of modern electronics industry, and a large number of photosensitive solder resist materials are used in the manufacture of printed circuit board (PCB). In recent years, due to environmental protection requirements and national restrictions on lead content in electronic products, the surface treatment process of printed circuit boards (PCB) has begun to use more lead-free HASL to replace the traditional lead HASL, lead-free HASL Higher surface temperatures are required. However, traditional photosensitive solder resist materials are prone to blistering and peeling under high temperature conditions, which seriously affects the quality ...

Claims

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Application Information

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IPC IPC(8): C08G59/14G03F7/004G03F7/027
CPCC08G59/1477G03F7/004G03F7/027
Inventor 盛星姚永平刘继强关计本
Owner FOSHAN 3Q ELECTRONICS MATERIALS
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