Preparation method of liquid-proof coating adopting gradient increasing structure

A gradient-increasing, liquid-proof technology, applied in the field of ion chemical vapor deposition, can solve problems such as difficult to ensure coating adhesion, mechanical properties, hydrophobic properties, poor interfacial compatibility of multi-layer structure coatings, and loss of barrier properties. Strong strength, improved protection performance, and reduced stress cracking effects

Active Publication Date: 2017-06-13
JIANGSU FAVORED NANOTECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most thick coatings and ultra-thick coatings have residual stress, which is prone to stress cracking under the conditions of variable temperature and deformation, and the poor compatibility between the interfaces of multi-layer structure coatings is also pr

Method used

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  • Preparation method of liquid-proof coating adopting gradient increasing structure
  • Preparation method of liquid-proof coating adopting gradient increasing structure
  • Preparation method of liquid-proof coating adopting gradient increasing structure

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0038] Example 1

[0039] A method for preparing a liquid-proof coating with a gradient-increasing structure, characterized in that it mainly includes the following steps:

[0040] (1) Place the base material in the reaction chamber of the plasma chamber, the base material is a solid material, the solid material is an electronic component, and the reaction chamber is continuously evacuated, and the vacuum degree in the reaction chamber is evacuated to 10 mTorr, nitrogen gas is introduced to provide a stable plasma environment;

[0041] The volume of the plasma chamber is 50 liters, and the temperature of the plasma chamber is controlled at 30° C.; the flow rate of nitrogen gas is 5 sccm.

[0042] (2) Simultaneously feed the first monomer vapor, the second monomer vapor, and the third monomer vapor, start the plasma discharge, and carry out chemical vapor deposition;

[0043] The first monomer vapor is: monofunctional unsaturated fluorocarbon resin, the monofunctional unsatur...

Example Embodiment

[0050] Example 2

[0051] The basic process steps of this embodiment are the same as those of Example 1, and the different process parameters are as follows:

[0052] 1. In step (1), the substrate is a solid material, and the solid material is an electrical component. The vacuum in the reaction chamber is pumped to 200 millitorr, and an inert gas is introduced; the volume of the plasma chamber is 1000 liters, and the plasma chamber The temperature was controlled at 60° C.; the flow rate of the inert gas was 300 sccm, and the inert gas was argon.

[0053] 2. In step (2):

[0054] The first monomer vapor is: monofunctional unsaturated fluorocarbon resin, the monofunctional unsaturated fluorocarbon resin is 2-(perfluorodecyl) ethyl methacrylate, and the first monomer The steam is to atomize and volatilize the monomer through the feeding pump, and introduce it into the reaction chamber at a low pressure of 200 mTorr, and the flow rate of the first monomer steam is 1000 μL / min; ...

Example Embodiment

[0060] Example 3

[0061] The basic process steps of this embodiment are the same as those of Example 1, and the different process parameters are as follows:

[0062] 1. In step (1), the substrate is a solid material, and the solid material is a fabric. The vacuum in the reaction chamber is pumped to 50 millitorr, and an inert gas is introduced; the volume of the plasma chamber is 200 liters, and the volume of the plasma chamber is 200 liters. The temperature was controlled at 40° C.; the flow rate of the inert gas was 100 sccm, and the inert gas was helium.

[0063] 2. In step (2):

[0064] The first monomer vapor is: monofunctional unsaturated fluorocarbon resin, the monofunctional unsaturated fluorocarbon resin is 1-ethynyl-3,5-difluorobenzene, and the first monomer vapor is passed into The monomer is atomized and volatilized by the feeding pump, and introduced into the reaction chamber by a low pressure of 40 mTorr, and the flow rate of the first monomer vapor is 300 μL / ...

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Abstract

The invention discloses a preparation method of a liquid-proof coating adopting a gradient increasing structure, belongs to the technical field of plasma chemical vapor deposition. The preparation method comprises the following steps: firstly, putting a base material into a reaction chamber of a plasma chamber, continuously vacuumizing the reaction chamber till the vacuum degree of the reaction chamber is 10-200 millitorrs, and inflating an inert gas or nitrogen gas; secondly, inflating first monomer steam, second monomer steam and third monomer steam at the same time; starting plasma discharge, and performing chemical vapor deposition; after discharge, turning off a plasma power supply, stopping inflation of the first monomer steam, the second monomer steam and the third monomer steam, continuously vacuumizing, inflating atmosphere till an atmospheric pressure after the vacuum degree of the reaction chamber is kept at 10-200 millitorrs for 1-5 min, and then taking out the base material. Through inflation of the first monomer steam, the second monomer steam and the third monomer steam at the same time, and through control over increase in the flows of the first monomer steam, the second monomer steam and the third monomer steam at different speeds, the prepared coating has gradient changing structural toughness and hardness, can reduce stress cracking and deformation, and has a relatively high barrier protection performance.

Description

technical field [0001] The invention belongs to the technical field of plasma chemical vapor deposition, in particular to a preparation method of a liquid-proof coating. Background technique [0002] Plasma chemical vapor deposition is a technology that uses plasma to activate reactive gases to promote chemical reactions on the surface of the substrate or in the space near the surface to form a solid film. Compared with other coating preparation methods, plasma coating technology has the following advantages: (1) dry process, the film produced is uniform and pinhole-free; (2) coating preparation temperature is low, and can be carried out at room temperature, effectively avoiding Damage to temperature-sensitive devices; (3) plasma technology can not only prepare micron-scale coatings but also ultra-thin nano-scale coatings; (4) solvent resistance and chemical corrosion resistance of plasma polymerized films , heat resistance, wear resistance and other chemical and physical p...

Claims

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Application Information

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IPC IPC(8): C23C16/455C23C16/50
CPCC23C16/45523C23C16/50
Inventor 宗坚
Owner JIANGSU FAVORED NANOTECHNOLOGY CO LTD
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