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Turbulent electrodeposition method and matching device and modular expansion scheme

A turbulent flow and electrochemical technology, applied in the field of electrodeposition, can solve problems such as concentration polarization, and achieve the effects of high DC efficiency, reduced manufacturing and maintenance costs, and less side reactions

Inactive Publication Date: 2017-06-13
西安互达环保科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a turbulent electrowinning method, ancillary devices and a modular expansion scheme to solve the problem of concentration polarization in the prior art, which is caused by the electrodeposition reaction rate being greater than the ion diffusion reaction rate.

Method used

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  • Turbulent electrodeposition method and matching device and modular expansion scheme
  • Turbulent electrodeposition method and matching device and modular expansion scheme
  • Turbulent electrodeposition method and matching device and modular expansion scheme

Examples

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Embodiment

[0034] This example: as figure 1 As shown, a turbulent electrowinning method includes turbulent surging of an electrolyte solution containing target metal ions during electrochemical deposition of an electrolyte solution.

[0035] During the electrochemical deposition process of the electrolytic solution containing the target metal ions in the confined space of the cathode and anode, the electrolytic solution is turbulently surging by the circulating pump. surging, eliminating the phenomenon of concentration polarization caused by the electrodeposition reaction rate being greater than the ion diffusion reaction rate.

[0036] The electrolyte solution is turbulently driven by the circulating pump 206 .

[0037] The electrochemical deposition process of the electrolyte solution containing the target metal ions includes the electrochemical deposition process of the electrolyte solution containing the target metal ions in the confined space of the cathode and anode.

[0038] lik...

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Abstract

The invention belongs to the technical field of electrodeposition, and especially relates to a turbulent electrodeposition method, the turbulent electrodeposition method is a new type electrodeposition technology, is used for elimination of concentration polarization phenomenon caused by the reason that electro deposition reaction rate is greater than ion diffusion reaction rate by high speed turbulent surging of an electrolyte solution in a limited cathode-anode tubular space, is especially suitable for metallurgy and nonferrous metal resource regeneration industry for recovery of cathode deposition metals from a complex solution containing nonferrous metal ions, the invention also provides a matching device of the turbulent electrodeposition method and a modular expansion scheme of the matching device of the turbulent electrodeposition method, compared with a traditional plate-groove open electrodeposition tank, during a turbulent electrodeposition equipment operation period, side reactions are few, direct current electrical efficiency is high, generated acid gas can be centralizedly collected and processed, modular equipment units are simple to install, solution retention volume in the system is less, process adaptability is strong, with market development, technology promotion and increase of users, the matching device of the turbulent electrodeposition method can ultimately replace traditional electrodeposition equipment, and is a new development direction of the wet aqueous solution metallurgy electrodeposition technology.

Description

technical field [0001] The invention belongs to the technical field of electrodeposition, and in particular relates to a turbulent electrodeposition method, a matching device and a modular expansion scheme. Background technique [0002] Electrodeposition technology refers to the process in which simple metal ions or complex ions are reduced to metal atoms on the surface of solid (conductor or semiconductor) by electrochemical methods and attached to the electrode surface, thereby obtaining a metal deposition layer. In various electrodeposition reactions, Regardless of the type of electrolyte solution, the discharge reaction of anions and cations on the anode and cathode electrodes follows the sequence of the ion's solution precipitation potential and electrochemical equivalent. It moves towards the anode and cathode, drains the solution on the surface of the plate, and then completes the discharge reaction on the cathode and anode. When the current intensity is low, the diff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/10C25D17/02C25D17/12C25D21/04C25D21/12C25D17/00
CPCC25D21/10C25D17/004C25D17/02C25D17/12C25D21/04C25D21/12
Inventor 卢正杰
Owner 西安互达环保科技有限公司
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