PC composite material used for laser direct forming and preparation technology thereof

A technology of laser direct prototyping and composite materials, applied in the field of new plastic materials, can solve the problems of affecting the mechanical properties of composite materials and the ease of exercise of resin macromolecular chains, achieving good thermal stability and oxidation resistance, and improving thermal oxidation resistance. , The effect of good chemical resistance

Inactive Publication Date: 2017-06-23
深圳市华盈新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The polymer composite material with laser direct molding performance needs to have excellent laser-induced electroplating performance and excellent thermal-oxidative aging resistance. In the prior art, in order to improve the thermal-oxidative aging resistance of the composite material, laser direct molding Molding additives (LDS additives) are used t

Method used

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  • PC composite material used for laser direct forming and preparation technology thereof
  • PC composite material used for laser direct forming and preparation technology thereof

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specific Embodiment 1

[0028] PC composite material for laser direct structuring, including the following components in parts by weight, 75 parts of PC, 10 parts of basalt fiber, 5 parts of laser additive, 1 part of antioxidant, 1.5 parts of thermal stabilizer, 3 parts of toughening agent, lubricating 1.5 parts of agent, 1 part of coupling agent, 2 parts of compatibilizer.

specific Embodiment 2

[0030] PC composite material for laser direct structuring, including the following components in parts by weight, 64 parts of PC, 20 parts of basalt fiber, 5 parts of laser additive, 1 part of antioxidant, 1.5 parts of thermal stabilizer, 2 parts of toughening agent, lubricating 1.5 parts of agent, 1 part of coupling agent, 4 parts of compatibilizer.

specific Embodiment 3

[0032] PC composite material for laser direct structuring, including the following components in parts by weight, 53 parts of PC, 30 parts of basalt fiber, 5 parts of laser additive, 1 part of antioxidant, 1.5 parts of thermal stabilizer, 2 parts of toughening agent, lubricating 1.5 parts of agent, 1 part of coupling agent, 5 parts of compatibilizer.

[0033] Control group 1:

[0034] The PC composite material for laser direct structuring comprises the following components in parts by weight: 83 parts of PC, 8 parts of laser additive, 2 parts of antioxidant, 2.5 parts of heat stabilizer, 3 parts of toughening agent, and 1.5 parts of lubricant.

[0035] Control group 2:

[0036] PC composite material for laser direct structuring, including the following components in parts by weight, 64 parts of PC, 20 parts of basalt fiber, 5 parts of laser additive, 2 parts of antioxidant, 2 parts of toughening agent, 1.5 parts of lubricant, coupling 1 part of agent, 4 parts of compatibiliz...

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Abstract

The invention relates to the field of new plastic materials, and specifically relates to a PC composite material used for laser direct forming and a preparation technology thereof. The PC composite material used for laser direct forming is prepared from the following components in parts by weight: 50 to 80 parts of PC, 10 to 50 parts of basalt fiber, 3 to 8 parts of a laser additive, 0.5 to 2 parts of an antioxidant, 0.2 to 2 parts of a heat stabilizer, 3 to 8 parts of a flexibilizer, 1 to 2 parts of a lubricating agent, 1 to 2 parts of a coupling agent and 2 to 6 parts of a compatilizer; the antioxidant consists of a hindered phenol antioxidant and a phosphite ester antioxidant; the heat stabilizer consists of a metal compound, a layered double hydroxide and an ultraviolet absorber; and the laser additive is nano-copper powder modified through acrylic ester. The PC composite material used for laser direct forming disclosed by the invention is high in laser-induced electroplating performance, high in heat and oxygen resistant performance, high in aging-resistant performance and high in mechanical performance.

Description

technical field [0001] The invention relates to the field of new plastic materials, in particular to a PC composite material for laser direct molding and a preparation process thereof. Background technique [0002] Laser Direct Structuring (LDS for short) is a 3D-MID (Three-dimensional molded interconnect device) production technology that combines injection, laser processing and electroplating. Its principle is to endow ordinary plastic components and circuit boards with The electrical interconnection function enables plastic shells and structural parts to combine with conductive circuits to produce shielding, antenna and other functions in addition to supporting and protecting functions. LDS materials are mainly laser additives added to the matrix resin, and the blended particles are injection molded into parts and then chemically plated to form conductive lines. The advantage is that the line design is more free and firm. [0003] The process of making molded interconnec...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L63/02C08L91/06C08L35/06C08K13/06C08K7/00C08K7/10C08K9/04C08K3/08C08K5/544
CPCC08L69/00C08K2201/003C08K2201/004C08K2201/011C08L2201/08C08L2205/035C08L63/00C08L91/06C08L35/06C08K13/06C08K7/00C08K7/10C08K9/04C08K2003/085C08K5/544
Inventor 贺鹏勇贺朋波
Owner 深圳市华盈新材料有限公司
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