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Heat conduction polymer composite material with isolation double-network structure and preparation method thereof

A heat-conducting polymer and composite material technology, applied in the field of heat-conducting polymer-based composite materials and their preparation, polymer-based composite materials and their preparation, can solve the problems of reducing interface thermal resistance, limited synergistic efficiency, etc. Avoid the deterioration of mechanical properties and processing properties, and have good thermal conductivity

Active Publication Date: 2017-07-25
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But when constructing percolating combined networks, synergy only connects a limited number of points of contact or lines of contact
These small contact areas can only reduce the interfacial thermal resistance to a certain extent, resulting in relatively limited synergistic efficiencies

Method used

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  • Heat conduction polymer composite material with isolation double-network structure and preparation method thereof
  • Heat conduction polymer composite material with isolation double-network structure and preparation method thereof
  • Heat conduction polymer composite material with isolation double-network structure and preparation method thereof

Examples

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preparation example Construction

[0047] The preparation method of the thermally conductive composite material provided by the present invention can be implemented in the following manner, and the process steps of the method are:

[0048] 1) After fully premixing the dried thermoplastic polymer matrix material with filler A, melt blending is carried out above the melting temperature (or melting point) of the thermoplastic polymer matrix, and then the blended mixture is pulverized and sieved out a certain amount. Particles of micron size are binary composite particles with filler A heat conduction network;

[0049] 2) Put the above-mentioned binary particles and a certain amount of adhesive together and stir at high speed for a certain period of time, so that the surface of the particles is evenly coated with a layer of adhesive; then add filler B and mix with high-speed stirring, so that the filler B adheres to the surface of the binary particles to produce ternary composite particles with two kinds of fillers...

Embodiment 1

[0054] 100 parts by volume of polystyrene (PS) pellets and 1.12 parts by volume of multi-walled carbon nanotubes with an average length of 1.5 μm and an outer diameter of 9.5 nm are fully premixed, then put into an internal mixer, and Mix at 190° C. and 60 rpm for 20 minutes; then pulverize the polystyrene mixed with carbon nanotubes, and screen out particles with a size of 10-355 μm.

[0055] Premix the screened particles with hexagonal boron nitride with a particle size of 2-3μm at a volume ratio of 90:10, put them in a high-speed mixer and mix them for 2 minutes at a speed of 20,000rad / min, and then dry them The composite particles were pressed into a plate at 190° C. to obtain a thermally conductive composite material with an isolated double network structure. The raw material consumption of each embodiment of the present invention and comparative example is as shown in table 1.

[0056] The obtained thermally conductive composite material was tested for mechanical proper...

Embodiment 2

[0067] Formula: matrix resin (nylon 6), filler A (graphene nanosheets) that acts as a bridge and forms a thermally conductive network alone, thermally conductive filler B (hexagonal boron nitride) that acts as an isolation effect and forms an isolated network structure, adhesive ( VAE707 emulsion).

[0068] Preparation:

[0069] 1) Fully premix nylon 6 (PA-6) pellets with graphene nanosheets with a flake size of 3-5 μm at a volume fraction ratio of 100:5 and put them into an internal mixer at 245°C. Mix at 60rpm for 20min; then grind the nylon 6 mixed with graphene, and screen out the particles with a size of 75-1250μm;

[0070] 2) Put 100 parts by mass of the above particles into a high-speed stirrer, add 16.7 parts by mass of VAE707 latex, mix at a speed of 20000rad / min for 1min, and then mix according to the volume ratio of 100:19.16 (binary Add hexagonal boron nitride with a particle size of 2-3 μm in the proportion of particles: hexagonal boron nitride), and then contin...

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Abstract

The invention belongs to the technical field of heat conduction polymer based composite materials and preparation thereof, particularly relates to a polymer based composite material with a special isolation double-network structure and a preparation method thereof, and provides a heat conduction polymer based composite material. The heat conduction polymer based composite material is prepared from the following components: a thermoplastic polymer, a heat conduction filler A and a heat conduction filler B, wherein the heat conduction polymer based composite material has an isolation double-network structure; the isolation double-network structure is as follows: in the heat conduction polymer based composite material, the heat conduction filler A forms a heat conduction network (1) in the thermoplastic polymer; the heat conduction filler B is adhered to the surfaces of binary blended particles to form a heat conduction network (2) used for isolating the heat conduction network (1) between the binary blended particles; and the heat conduction network (1) and the heat conduction network (2) are connected with each other. The isolation double-network synergy structure built by the prepared composite material has higher synergy efficiency, so that the heat conduction performance of the material is greatly improved.

Description

[0001] Technical field: [0002] The invention belongs to the technical field of heat-conducting polymer-based composite materials and preparation thereof, and in particular relates to a polymer-based composite material with a unique isolated double network structure and a preparation method thereof. [0003] Background technique: [0004] In recent years, with the continuous development of information technology and the increasing popularity of electronic devices such as smart phones and notebook computers, people have higher and higher requirements for their miniaturization and multi-function, so more electronic components must be integrated into smaller printed circuit boards. With the increase of assembly density, the heat generated by electronic equipment accumulates and increases rapidly. To ensure that electronic components can still work normally with high reliability under the ambient temperature of use, the ability to dissipate heat in time becomes an important limiti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/06C08L77/02C08L23/12C08L67/04C08K7/24C08K3/38C08K7/00C08K3/04C09K5/14
CPCC08K3/04C08K3/38C08K7/00C08K7/24C08K2003/385C08K2201/001C08K2201/011C09K5/14C08L25/06C08L77/02C08L23/12C08L67/04
Inventor 傅强吴凯陈枫张祥柴颂刚
Owner SICHUAN UNIV
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