A kind of nano silver/epoxy resin high dielectric composite material and preparation method thereof
A technology of epoxy resin and composite materials, which is applied in the field of composite material manufacturing, can solve problems such as difficult to uniformly disperse resin due to agglomeration, large specific surface area of nano-silver, large dielectric loss, etc., and achieve easy mass production, improved stability, and good dispersion Effect
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Embodiment 1
[0022] Prepare a kind of high dielectric composite resin, the steps are as follows:
[0023] 1) Mix 1g N-(2-aminoethyl)-3-aminopropyltriethoxysilane, 5g silver nitrate, 0.5g 2,4,6-tris(dimethylaminomethyl)phenol, 1g o-benzene Diformaldehyde and 8.5g of methylhexahydrophthalic anhydride were added to 10g of E44 epoxy resin in turn, stirred at a high speed and dispersed evenly to obtain a mixed sol;
[0024] 2) Pour the mixed sol obtained in step 1) into an iron mold, place it in a blast drying oven and heat it up in stages to solidify, heat at a constant temperature of 60°C for 6 hours, then raise the temperature to 100°C and heat for 6 hours at a constant temperature, and then raise the temperature to a constant temperature of 150°C After heating for 4 hours, a nano-silver / epoxy resin high dielectric composite material is obtained.
[0025] The composite material prepared in this example has a dielectric constant of 8.2 and a dielectric loss of 0.023 at 1 kHz measured at room...
Embodiment 2
[0032] Prepare a kind of high dielectric composite resin, the steps are as follows:
[0033] 1) Mix 1g N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 5g silver oxalate, 0.2g tetraethylammonium bromide, 1g isophthalaldehyde, 8.5g methyltetrahydrophthalic anhydride Add in 10g E44 epoxy resin successively, stir at high speed and disperse evenly to obtain mixed sol;
[0034] 2) Pour the mixed sol obtained in step 1) into an iron mold, place it in a blast drying oven and heat it up in stages to solidify, heat at a constant temperature of 60°C for 4 hours, then raise the temperature to 100°C for 4 hours, and then raise the temperature to a constant temperature of 150°C After heating for 3 hours, the nano-silver / epoxy resin high dielectric composite material is obtained.
[0035] The composite material prepared in this example has a dielectric constant of 8.7 and a dielectric loss of 0.025 at 1 kHz measured at room temperature.
Embodiment 3
[0042] Prepare a kind of high dielectric composite resin, the steps are as follows:
[0043] 1) Mix 0.2g N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 1g silver acetate, 0.3g 2-ethyl-4-methylimidazole, 0.4g terephthalaldehyde, 8.5 1g methyl hexahydrophthalic anhydride is added in the 10g E51 epoxy resin successively, high-speed stirring disperses and obtains mixed sol;
[0044] 2) Pour the mixed sol obtained in step 1) into an iron mold, place it in a blast drying oven and heat it up in stages to solidify, heat at a constant temperature of 60°C for 2 hours, then raise the temperature to 100°C and heat for 2 hours at a constant temperature, and then raise the temperature to a constant temperature of 150°C After heating for 2 hours, a nano-silver / epoxy resin high dielectric composite material is obtained.
[0045] The composite material prepared in this example has a dielectric constant of 5.7 and a dielectric loss of 0.016 at 1 kHz measured at room temperature.
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Abstract
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