A photolithographic method for preparing affinity-phobic patterns

A pattern and affinity technology, which is applied in the field of photolithography for preparing affinity patterns, can solve the problems of complex photolithography process, limit the use range of photolithography technology, and the size of graphics, and achieve the effects of wide application prospects, energy saving, and simple preparation methods

Active Publication Date: 2019-03-05
GUANGZHOU INST OF ENERGY CONVERSION - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the use of photomasks complicates the photolithography process to some extent, and limits the scope of use of photolithography and the size of patterns.

Method used

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  • A photolithographic method for preparing affinity-phobic patterns

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Embodiment 1

[0016] like figure 1 A photolithography method for preparing an affinity-phobic pattern is shown, the method comprises the following steps: first, on a glass substrate 1, a dispenser is used to coat or spray a layer of organic silica gel pattern connection layer 2 with a point-like structure pattern; Coat, spray or spin coat a layer of surface coating 3, and finally irradiate with ultraviolet light for 5 minutes to obtain a hydrophilic pattern. The bottom is coated with organic silica gel as a hydrophobic region, and the bottom directly as a glass substrate is a hydrophilic region; The surface coating 3 is micro-nano titanium dioxide particles whose surface is modified with tridecafluorotriethoxyoctylsilane; the titanium dioxide particles are particles with a composite size of 25 nm and 1 μm.

Embodiment 2

[0018] refer to figure 1 , the photolithographic method for preparing the affinity pattern comprises the following steps: firstly, on the stainless steel substrate 1, a pattern connection layer 2 of polydimethylsiloxane with a linear pattern is printed by screen printing; secondly, coating, spraying or spinning Apply a layer of surface coating, and finally irradiate with sunlight for 5 minutes to obtain a hydrophilic and hydrophobic pattern. The bottom is coated with polydimethylsiloxane as a hydrophobic region, and the bottom is directly on the stainless steel substrate as a hydrophilic region; the surface The coating is 120nm micronano titanium dioxide particles.

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Abstract

The invention discloses a photoetching method for preparing a hydrophilic-hydrophobic pattern. The photoetching method comprises the following steps of firstly, coating or spraying a pattern connection layer with a pattern on a substrate; secondly, coating, spraying or spinning a surface coating layer; and finally, performing irradiation by ultraviolet light or sunlight or visible light or infrared light to obtain the hydrophilic-hydrophobic pattern, wherein the material of the substrate is selected from arbitrary one of glass, metal, alloy, stainless steel, a wall body, paper and cotton fabric, the pattern connection layer is organic silicon gel or siloxane with the pattern, the surface coating layer is micronano TiO2 particles with sizes being 10 nanometers to 10 micrometers or micronano TiO2 particles of which surfaces are modified with a low-surface energy substance. A photomask is not needed, the preparation method is simple, the application range of a photoetching technology is expanded, energy sources are saved, the pattern with an arbitrary pattern can be prepared, self supply of the low-surface energy substance is achieved, so that the service lifetime of the low-surface energy substance is prolonged, and the photoetching has a wide application prospect.

Description

Technical field: [0001] The invention relates to a method for preparing an affinity pattern, in particular to a photolithographic method for preparing the affinity pattern. Background technique: [0002] The affinity-phobic pattern refers to the pattern composed of hydrophilic and hydrophobic regions, and it has broad application prospects in microchannels, offset printing, cell growth and screening, and surface adhesion control. The preparation methods of the affinity-phobic pattern include methods such as lift-off, inkjet printing, laser etching, and ultraviolet lithography, among which the ultraviolet lithography method is the most widely used one. [0003] Ultraviolet lithography technology refers to the technology of transferring the pattern on the photomask to the substrate by means of photoresist under the action of ultraviolet light. In this UV lithography, a photomask is necessary. However, the use of a photomask complicates the photolithography process to a certa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/2004
Inventor 朱艳青徐刚史继富
Owner GUANGZHOU INST OF ENERGY CONVERSION - CHINESE ACAD OF SCI
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