ITO-Ag-ITO etching liquid for inhibiting pits on thinned TFT liquid crystal display
A liquid crystal display and etching solution technology, applied in the etching solution field, can solve problems such as not achieving ideal effects, and achieve the effects of good large-scale application prospects, low cost, and outstanding pit suppression effect.
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Embodiment 1
[0013] Embodiment 1 An ITO-Ag-ITO etchant for suppressing pits after thinning of a TFT liquid crystal display is composed of the following raw materials in parts by weight: 13 parts of hydrofluoric acid, 18 parts of nitric acid, 9 parts of acetic ammonium fluoride 6 parts of tetrahydrofuran, 4 parts of sodium perchlorate, 5 parts of disodium edetate, 3 parts of potassium molybdate, 4 parts of permethrin, 8 parts of potassium monohydrogen phosphate, 7 parts of nonionic surfactant, additives 3 parts, 5 parts of defoamer, 50 parts of deionized water.
[0014] There are no more than 200 particles with a particle size greater than 0.2 μm per 1000 Kg in the etching solution.
[0015] The additive is organic phosphonic acid.
[0016] The general structural formula of the organic phosphine sulfonic acid is at least one of HO3S(CH2)m-N-(CH2PO3H2)n, m is 1-2, and n is 1-2.
[0017] The defoamer is at least one selected from diethylhexanol, isooctyl alcohol, isoamyl alcohol and diisobu...
Embodiment 2
[0019] Embodiment 2 An ITO-Ag-ITO etchant for suppressing pits after thinning of a TFT liquid crystal display is composed of the following raw materials in parts by weight: 16 parts of hydrofluoric acid, 22 parts of nitric acid, 14 parts of acetic ammonium fluoride 10 parts of tetrahydrofuran, 9 parts of sodium perchlorate, 12 parts of disodium edetate, 8 parts of potassium molybdate, 8 parts of permethrin, 14 parts of potassium monohydrogen phosphate, 11 parts of nonionic surfactant, additives 6 parts, 9 parts of defoamer, 60 parts of deionized water.
[0020] There are no more than 200 particles with a particle size greater than 0.2 μm per 1000 Kg in the etching solution.
[0021] The additive is organic phosphonic acid.
[0022] The general structural formula of the organic phosphine sulfonic acid is at least one of HO3S(CH2)m-N-(CH2PO3H2)n, m is 1-2, and n is 1-2.
[0023] The defoamer is at least one selected from diethylhexanol, isooctyl alcohol, isoamyl alcohol and di...
Embodiment 3
[0025] Embodiment 3 An ITO-Ag-ITO etchant for suppressing pits after thinning of a TFT liquid crystal display is composed of the following raw materials in parts by weight: 14 parts of hydrofluoric acid, 20 parts of nitric acid, 11 parts of acetic ammonium fluoride Parts, 8 parts of tetrahydrofuran, 7 parts of sodium perchlorate, 8 parts of disodium edetate, 5 parts of potassium molybdate, 6 parts of permethrin, 11 parts of potassium monohydrogen phosphate, 9 parts of nonionic surfactant, additives 4 parts, 7 parts of defoamer, 55 parts of deionized water.
[0026] There are no more than 200 particles with a particle size greater than 0.2 μm per 1000 Kg in the etching solution.
[0027] The additive is organic phosphonic acid.
[0028] The general structural formula of the organic phosphine sulfonic acid is at least one of HO3S(CH2)m-N-(CH2PO3H2)n, m is 1-2, and n is 1-2.
[0029] The defoamer is at least one selected from diethylhexanol, isooctyl alcohol, isoamyl alcohol an...
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