High-modulus organic-inorganic hybridized polyimide film and preparation and application thereof

Abstract

The invention relates to a high-modulus organic-inorganic hybridized polyimide film and preparation and application thereof, in particular to the technical field of organic-inorganic hybridizing polymer materials. In particular, a polymer film in which 0.1 to 60 percent of inorganic nanometer particles are dispersed has high modulus, low shrinkage and superior physical-chemical performance, and particularly has tensile modulus which is larger than 5Gpa. Designed solvent type nanoparticle dispersion liquid can be added into a polymer composition efficiently and conveniently, and inorganic nanometer particles are uniform in size, and are stable in dispersion; the high-modulus organic-inorganic hybridized polyimide film is an organic-inorganic hybridized polymer material which has the advantages of high modulus, low shrinkage, superior chemical performance and superior electric performance.

Description

technical field [0001] The invention relates to a high-modulus organic-inorganic hybrid polyimide film and its preparation and application, in particular to the technical field of organic-inorganic hybrid polymer materials. Background technique [0002] Compared with inorganic materials, organic polymer materials have good processability, better chemical resistance, and better dielectric properties, but have a larger coefficient of thermal expansion. In contrast, inorganic materials have excellent heat resistance and stability, but are difficult to shape. Organic-inorganic hybrid materials use inorganic nanoparticles to compound at the nanometer scale, which is currently the most effective method and means in the field of optoelectronic materials. [0003] As a high-performance aromatic polymer, polyimide material can be used in various applications such as plastics, films, solutions, etc. It has excellent high and low temperature stability, and exhibits excellent physical,...

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Problems solved by technology

[0005] Chinese patent CN201210246270.1 provides a way to realize the compounding of nanoparticles and organic acrylic polymers through physical grinding, but polyamic acid is a heat-sensitive polymer, and the impact of a large number of grinding particles is likely to cause multiple side effects in the molecular chain. reaction, destroying the strength and stability of the polymer

[0006] Chinese patent CN101289542B provides a method of bulk polymerization modification using spherical powder silicon dioxide and polyimide. Also, in this method, the viscosity of the polyamic acid solution is relatively high. In a state of high viscosity, the physical dispersion method cannot solve the problem of nano Severe defect of particle agglomeration

As a result, the prepared silica composite polyimide film has large inorganic particle size and poor dispersion scale, which greatly damages the performance of the product

[0007] Chinese patent CN101407590B provides a method for preparing a thermosetting polyimide hybrid film with high modulus and low thermal expansion coefficient. It is difficult to disperse, and water molecules will cause multiple side reactions in the polyamic acid molecular chain, so that the performance of the cured polyimide hybrid material cannot be optimized.

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