Method for preparing multifunctional nanometer protection coating through circulation small-power continuous discharge

Abstract

The invention discloses a method for preparing multifunctional nanometer protection coating through circulation small-power continuous discharge, and belongs to the technical field of multifunctional nanometer protection coating through circulation small-power continuous discharge. The method comprises the steps that a reaction cavity is vacuumized, inert gas is introduced into the reaction cavity, a base material moves in the reaction cavity, monomer steam is introduced into the reaction cavity, chemical vapor deposition is carried out and comprises a pretreatment stage and a film coating stage, the plasma discharge mode is large-power continuous discharge in the pretreatment stage, the plasma discharge mode is small-power continuous discharge in the film coating stage, the pretreatment stage and the film coating stage are cycle and repeated at least one time, more active sites more introduced to the surface of the base material in a circulation mode in the film coating technological process, effective film coating is added, the film structure is more compact, the nanometer coating with of the multi-layer composite structure is obtained, multiple layers of protection are provided for the product, the more compact coating structure is shown microscopically, and excellent hydrophobicity, adhesive force, acid and base resistance, mechanical performance and moisture and heat resistance are shown macroscopically.

Description

technical field [0001] The invention belongs to the technical field of plasma chemical vapor deposition, and in particular relates to a method for preparing a multifunctional nano protective coating. Background technique [0002] Corrosive environments are the most common cause of damage to electronic devices. Corrosion of solid materials in electronic devices, reduction of conductor / semiconductor insulation, and failure phenomena such as short circuit, open circuit or poor contact due to environmental corrosion. At present, in the products of high-tech industries such as national defense and aerospace, the proportion of electronic components is increasing, and the requirements for moisture-proof, mildew-proof and corrosion resistance of electronic products are becoming more and more stringent. In the field of communication, with the continuous advancement of technology, the continuous increase of communication frequency, the heat dissipation of communication equipment, and...

AI Technical Summary

Problems solved by technology

[0012] The British P2i company has developed a polymer nano-coating based on a specific small duty cycle pulse discharge method using chemical vapor deposition technology. The preparation process based on the specific small duty cycle pulse discharge method cannot achieve chemical The effective coordination and control of the bond length, bond energy, molecular weight of the material and the energy provided by the different groups in the raw materials, the scratch resistance and durability of the prepared coating are not ideal

It is also due to the performance limitation of the coating that the current coating can only form a lyophobic nano-coating on electronic and electrical equipment, and the corrosion resistance to the environment cannot be effectively solved.

Moreover, the dense protective coating prepared based on a specific small duty cycle pulse discharge method has a fatal disadvantage: from a microscopic point of view, the small power density in the coating process is not conducive to the formation of a dense structure, and even cannot form a stable film. Structure; from a macro point of view, a small power density is not conducive to the large rate growth of the coating, and the efficiency is low in actual production, which limits its application

[0013] In the existing plasma chemical vapor deposition coating preparation process, the substrate is fixed, and the movement state of the substrate has no correlation with the discharge energy of the plasma; the static substrate in the chamber is treated by the continuous discharge method, The activated chain scission in the monomer is generally combined into a film through simple stacking under the action of continuous discharge, and the resulting coating generally has a loose structure, or even a high degree of powderization, which is not conducive to the formation of a microscopic dense structure of the coating. Therefore, the coating’s Waterproof, moisture-proof, corrosion-resistant, solvent-resistant and other protective properties are poor

[0014] Due to the regional differences in plasma density and chemical raw material density in the reaction chamber, the static substrate will also lead to slow coating deposition in some areas, low production efficiency, and large differences in uniformity and compactness.

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