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Manufacture method of electronic equipment radiating coating

A technology for heat-dissipating coatings and electronic equipment, applied in anti-corrosion coatings, anti-fouling/underwater coatings, coatings, etc., can solve the problems of toxic and harmful substances, high production costs, and non-environmental protection, achieve good heat dissipation capabilities, and increase service life , Strong adhesion effect

Inactive Publication Date: 2017-09-15
HEFEI DONGHENGRUI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the common heat dissipation materials on the market mainly use materials such as aluminum nitride, silicon oxide, beryllium oxide and zinc oxide. The production cost of these materials is high, and the production and use of coatings will also produce toxic and harmful substances, which is not environmentally friendly.

Method used

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  • Manufacture method of electronic equipment radiating coating
  • Manufacture method of electronic equipment radiating coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Preparation of modified resin: 40 parts of silicone resin, 20 parts of ketone-aldehyde resin, 3 parts of tributyl citrate, 5 parts of methyl orthosilicate, 5 parts of styrene-diethylene, nanometer dioxide Mix 3 parts of silicon evenly, mix and stir for 1 hour at a temperature of 85°C at a stirring speed of 600r / min, send it into an extruder for extrusion and granulation, and the discharge temperature of the extruder is 150-170°C to obtain the obtained Resin needs to be modified.

[0024] (2) Preparation of film-forming aids: put 2 parts of nano jade powder and 3 parts of styrene into 1 part of ricinoleic acid according to the mass parts and mix them, then dissolve the mixture into 5 parts of xylene solvent, and then add alcohol 4 parts of ester twelve, 3 parts of silane coupling agent, 3 parts of maleic anhydride, 0.5 part of tert-butyl peroxyvalerate, mix and stir, the stirring speed is 850r / min, heat to 70°C during stirring, and react 35min to obtain the required...

Embodiment 2

[0028] (1) Preparation of modified resin: according to the mass parts, 55 parts of silicone resin, 30 parts of ketone-aldehyde resin, 5 parts of tributyl citrate, 7 parts of methyl orthosilicate, 6 parts of styrene-diethylene, nanometer dioxide Mix 4 parts of silicon evenly, mix and stir for 2 hours at a temperature of 90°C, the stirring speed is 800r / min, and send it into an extruder for extrusion and granulation. The discharge temperature of the extruder is 150-170°C, and the obtained Resin needs to be modified.

[0029] (2) Preparation of film-forming aids: 5 parts of nano jade powder and 5 parts of styrene are put into 2 parts of ricinoleic acid and mixed according to the mass parts, then dissolved in 8 parts of xylene solvent, and then alcohol ester ten parts are added. 5 parts of silane, 5 parts of silane coupling agent, 4 parts of maleic anhydride, 1 part of tert-butyl peroxyvalerate, mixed and stirred at a stirring speed of 1100r / min, heated to 85°C during stirring, an...

Embodiment 3

[0033] (1) Preparation of modified resin: 45 parts of silicone resin, 25 parts of ketone-aldehyde resin, 4 parts of tributyl citrate, 6 parts of methyl orthosilicate, 5 parts of styrene-diethylene, nanometer dioxide Mix 3 parts of silicon evenly, mix and stir for 1.5h at a temperature of 88°C at a stirring speed of 700r / min, send it into an extruder for extrusion and granulation, and the discharge temperature of the extruder is 150-170°C to obtain required modified resin.

[0034] (2) Preparation of film-forming aids: 4 parts of nano-jade powder and 4 parts of styrene are put into 1 part of ricinoleic acid and mixed according to the mass parts, then dissolved in 7 parts of xylene solvent, and then alcohol ester ten 4 parts of silane, 4 parts of silane coupling agent, 3 parts of maleic anhydride, 0.7 parts of tert-butyl peroxyvalerate, mixed and stirred at a stirring speed of 950r / min, heated to 75°C during stirring, and reacted for 38 minutes. To obtain the required film-form...

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Abstract

The invention belongs to the technical field of coatings and particularly relates to a manufacture method of electronic equipment radiating coating; the manufacture method comprises the steps of (1) preparing modified resin; (2) preparing a film-forming aid; (3) ball-milling main materials; (4) preparing the coating. The coating comprises various resin materials, jade powder, nano carbon, nano silica and other materials; the solid matter ground by ball milling is fine and uniform; with the film-forming aid and the additives, the manufactured coating has uniform nature and high adhesion. The radiating coating produced herein has good heat conductivity, high heat-dissipating property, good antioxidant property and corrosion resistance, barely produces harmful matters during production and usage, and is good in safety and environmental friendliness.

Description

technical field [0001] The invention belongs to the technical field of coatings, and in particular relates to a method for manufacturing heat-dissipating coatings for electronic equipment. Background technique [0002] At present, most electronic and electrical products inevitably generate heat, which is mainly generated by the thermal effect of electrical components. If the heat cannot be conducted quickly, it may accumulate on the equipment and eventually lead to overheating and damage the equipment. , the way of heat dissipation is to use air-cooled or water-cooled heat sinks for heat dissipation. Valuable equipment such as servers even need to be equipped with special central air-conditioning and other refrigeration equipment for heat dissipation. These heat dissipation measures need to consume energy and are not green enough. In addition, some Small devices also dissipate heat through heat-dissipating paint. [0003] Heat dissipation coating is a special coating that e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/04C09D161/02C09D5/08C09D5/16C09D5/02C09D7/12
CPCC09D183/04C08K2003/2227C08K2201/011C08K2201/014C08L2203/20C09D5/024C09D5/028C09D5/08C09D5/16C08L61/02C08K13/06C08K5/11C08K3/36C08K9/08C08K3/22C08K3/04
Inventor 齐慧
Owner HEFEI DONGHENGRUI ELECTRONICS TECH CO LTD
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