Epoxy resin thermal conductive composite material, preparation thereof and application

A heat-conducting composite material and epoxy resin technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, circuits, etc., can solve the problems of poor thermal conductivity, good thermal conductivity, high viscosity, etc., achieve high thermal conductivity and improve thermal conductivity coefficient, the effect of improving the interface effect

Active Publication Date: 2017-09-22
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above defects or improvement needs of the prior art, the object of the present invention is to provide an epoxy resin thermally conductive composite material and its preparation and application, wherein through the key thermally conductive filler structure in the epoxy resin thermally conductive composite material, and adding Compared with the prior art, it can effectively solve the problems of poor thermal conductivity and high viscosity of epoxy resin composite materials. The present invention is based on free radical polymerization on the surface of boron nitride. The method is to graft the polymer with epoxy group at the end, and use the boron nitride

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  • Epoxy resin thermal conductive composite material, preparation thereof and application
  • Epoxy resin thermal conductive composite material, preparation thereof and application
  • Epoxy resin thermal conductive composite material, preparation thereof and application

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preparation example Construction

[0047] (1-1) Preparation of hydroxyl-modified boron nitride:

[0048] uniformly dispersing boron nitride in an alkaline aqueous solution to obtain a first dispersion system, wherein each gram of boron nitride corresponds to 100 ml to 500 ml of an alkaline aqueous solution, wherein the pH value of the alkaline aqueous solution is 11-13; Next, heat and stir the first dispersion at 40°C-60°C for 2-5 hours, then suction filter, wash, and dry to obtain hydroxyl-modified boron nitride;

[0049] (1-2) Preparation of boron nitride grafted with γ-mercaptopropyltrimethoxysilane:

[0050] Disperse the hydroxyl-modified boron nitride obtained in the step (1-1) into toluene, then add γ-mercaptopropyltrimethoxysilane, and heat the mixture at 60°C to 120°C under a protective atmosphere Heating to reflux for 3 to 12 hours, wherein each gram of hydroxyl-modified boron nitride corresponds to 100 milliliters to 300 milliliters of toluene, and 1 milliliter to 3 milliliters of γ-mercaptopropyltri...

Embodiment 1

[0062] In the epoxy resin composite material in this embodiment, 3% by volume boron nitride filler is uniformly dispersed in the epoxy resin, and the average particle diameter of the boron nitride inorganic filler is 40 microns. The thermal conductivity of the epoxy resin composite material is tested according to the test standard ASTM C1113, the thermal conductivity is 0.23W / m·K, and the viscosity is 2.6Pa·s at 30°C.

[0063] The epoxy resin composite material is prepared according to the following method according to the formula ratio:

[0064] (1) Take boron nitride and fully dry the filler.

[0065] (2) Add the boron nitride obtained in the step (1) to the epoxy resin, disperse it uniformly, and solidify after degassing to obtain the epoxy resin composite material. Described epoxy resin is bisphenol A type epoxy resin; Described curing agent is imidazoles and acid anhydrides curing agent, and the addition amount of acid anhydrides curing agent is 85wt.% of epoxy resin, an...

Embodiment 2

[0072] In the epoxy resin composite material in this embodiment, boron nitride filler with a volume ratio of 9% is uniformly dispersed in the epoxy resin, and the average particle diameter of the boron nitride inorganic filler is 40 microns. The thermal conductivity of the epoxy resin composite material is tested according to the test standard ASTM C1113, the thermal conductivity is 0.44W / m·K, and the viscosity is 5.1Pa·s at 30°C.

[0073] The epoxy resin composite material is prepared according to the following method according to the formula ratio:

[0074] (1) Take boron nitride and fully dry the filler.

[0075] (2) Add the boron nitride obtained in the step (1) to the epoxy resin, disperse it uniformly, and solidify after degassing to obtain the epoxy resin composite material. Described epoxy resin is bisphenol A type epoxy resin; Described curing agent is imidazoles and acid anhydrides curing agent, and the addition amount of acid anhydrides curing agent is 85wt.% of ep...

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Abstract

The invention discloses an epoxy resin thermal conductive composite material, preparation thereof and an application. According to the epoxy resin thermal conductive composite material, boron nitride with the surface coated with polymer is dispersed in epoxy resin, and the volume ratio of the boron nitride accounts for 3%-15% of the composite material. Preferably, the average particle size of the boron nitride is 10 micrometers to 40 micrometers. The polymer is polyglycidyl methacrylate, and the thickness of a polymer layer coating the surface of the boron nitride ranges from 3 nanometers to 10 nanometers. By improving a key thermal conductive filler structure in the epoxy resin thermal conductive composite material, additive amount and the like, the corresponding preparation method is adopted, and the problems of poor thermal conductive performance and high viscosity of epoxy resin composite materials can be effectively solved as compared with the prior art.

Description

technical field [0001] The invention belongs to the field of thermal management materials, and more specifically relates to an epoxy resin thermally conductive composite material and its preparation and application. The epoxy resin thermally conductive composite material is an epoxy resin / boron nitride thermally conductive composite material. Background technique [0002] With the increasing integration of chip electronic devices, chip thermal management has become an important factor restricting the development of the electronics industry. The increase in temperature of electronic devices will have a great impact on life, efficiency and energy consumption, so improving the heat dissipation capacity has become a research hotspot. Thermally conductive and insulating packaging materials with high heat dissipation performance are the key links to improve the working stability and service life of electronic components. Plastic packaging is widely used in the field of thermal in...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/10C08K3/38C08F292/00C08F220/32H01L23/29
CPCC08F292/00C08K3/38C08K9/10C08K2003/385C08K2201/003H01L23/295C08L63/00C08F220/325
Inventor 解孝林姜昀良薛志刚周兴平刘卓勇谢金良
Owner HUAZHONG UNIV OF SCI & TECH
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