5 results about "Polyglycidyl methacrylate" patented technology

This invention relates to the field of functional fabric technology, specifically to a hybrid fiber with phase change temperature control fiber and its preparation method. The raw materials for preparing the hybrid fiber, by weight, consist of 70-80 parts polymer matrix, 13-21 parts phase change material, 3-5 parts polyethylene glycol-b-polyglycidyl methacrylate (PEG-b-GMA), 0.6-1.5 parts KH-580, 0.3-1 parts thermally conductive reinforcing phase, and 0.5-1.2 parts functional auxiliaries; the thermally conductive reinforcing phase is micron-sized boron nitride modified with a silane coupling agent using a wet process. This invention, through the synergistic effect of PEG-b-GMA and the anchoring agent KH-580, can simultaneously solve the problems of poor dispersion, easy leakage of phase change material, and poor mechanical properties in existing blended spinning phase change temperature control fibers. The improved fiber properties can meet the requirements of industrial weaving. This invention uses conventional blended spinning processes, requires no additional specialized equipment, has controllable auxiliary agent costs, is simple to operate, and is easy to implement on existing production lines.

A multi-layered film includes (A) an oxygen barrier layer; (B) a moisture barrier layer disposed on and in direct contact with (A) the oxygen barrier layer; and (C) an adhesive layer disposed on and in direct contact with (B) the moisture barrier layer. (A) The oxygen barrier layer includes (a) modified polyethylene resin and (e) ethylene-vinyl alcohol copolymer. (B) The moisture barrier layer includes (b1) first poly(ethylene-co-1-octene) having a melting index of 20 g / 10 min to 40 g / 10 min at 190° C. and (b2) second poly(ethylene-co-1-octene) having a melting index of 1 g / 10 min to 10 g / 10 min at 190° C. (C) The adhesive layer includes poly(ethylene-co-methacrylate-co-glycidyl methacrylate) having a melting index of 1 g / 10 min to 10 g / 10 min at 190° C.

A multi-layered film includes (A) an oxygen barrier layer; (B) a moisture barrier layer disposed on and in direct contact with (A) the oxygen barrier layer; and (C) an adhesive layer disposed on and in direct contact with (B) the moisture barrier layer. (A) The oxygen barrier layer includes (a) modified polyethylene resin and (e) ethylene-vinyl alcohol copolymer. (B) The moisture barrier layer includes (bi) first poly(ethylene-co-1-octene) having a melting index of 20 g / 10 min to 40 g / 10 min at 190° C. and (b2) second poly(ethylene-co-1-octene) having a melting index of 1 g / 10 min to 10 g / 10 min at 190° C. (C) The adhesive layer includes poly(ethylene-co-methacrylate-co-glycidyl methacrylate) having a melting index of 1 g / 10 min to 10 g / 10 min at 190° C.

An electrolytic paper for aluminum electrolytic capacitors includes an upper surface layer, an intermediate support layer, and a lower surface layer. Both the upper and lower surface layers comprise cotton pulp fibers and / or hemp pulp fibers, while the intermediate support layer comprises aramid fibers. An interpenetrating polymer network is formed between the upper and lower surface layers and the intermediate support layer using active functional groups of polyacrylic acid or polyglycidyl methacrylate and its derivatives. In this invention, the intermediate support layer exhibits extremely high insulation strength and thermal stability, resulting in a 30%-50% or higher breakdown voltage of the composite electrolytic paper compared to pure natural fiber electrolytic paper of the same basis weight, demonstrating superior voltage withstand performance. Furthermore, the interpenetrating polymer network formed between the upper and lower surface layers and the intermediate support layer using polyacrylic acid or polyglycidyl methacrylate and its derivatives ensures rapid and thorough wetting of the electrolyte and long-term electrolyte retention, thereby ensuring capacitor capacity and reducing ESR.

This invention belongs to the field of electronic packaging materials technology and discloses a high-collapse-resistance lead-free solder paste and its preparation method. This solder paste constructs a thermally responsive, self-reinforcing thixotropic structure by in-situ grafting a thermosensitive block copolymer, poly(N-isopropylacrylamide-b-polyglycidyl methacrylate), onto the surface of alloy solder powder. This results in high yield stress at room temperature, inhibiting cold collapse. During the preheating stage, the polymer chain conformation collapses, achieving structural compaction and broadening the collapse-resistance process window. The flux system does not contain traditional free thixotropic agents, and residues can be completely cleaned after reflow, eliminating solder bead defects. This solder paste is suitable for fine-pitch packaging, exhibiting both excellent printability and high reliability.