The invention discloses an
epoxy resin material for electronic plastic
package of a
radio frequency chip and a preparation method of the
epoxy resin material. The preparation method comprises the following steps: firstly, carrying out
alkylation reaction on
dicyclopentadiene and
phenol in the presence of a catalyst
boron trifluoride diethyl etherate to synthesize
dicyclopentadiene phenol resin, and epoxidizing the
dicyclopentadiene phenol resin through
epoxy chloropropane to obtain dicyclopentadiene epoxy resin DCPDDE; then, synthesizing a poly (dicyclopentadiene)
linear polymer PDCPD by taking a Pd / Ag
ionic compound as a catalyst, and then reacting the PDCPD with
cysteamine sulfydryl to obtain dicyclopentadiene
cysteamine PDCPDAm; and finally, mixing the DCPDDE, the PDCPDAm, the filler and the
coupling agent, stirring, defoaming and curing to form the thermosetting resin with a three-dimensional
network structure. The synthetic process is simple, the cost is low, the mobility and
polarizability of molecules are limited due to high rigidity and low polarity of the obtained resin, transmission of a
radio frequency chip under a high-frequency high-speed
signal is ensured, stable operation in a complex
working environment is ensured, reliable packaging protection is provided for the
radio frequency chip, and the service life of the radio frequency chip is prolonged. And the
thermal stability and the low
dielectric property of the radio frequency chip are improved to the greatest extent.