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Negative-type photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problems of no durability, etc., and achieve the effects of excellent adhesion, excellent chemical resistance and storage stability

Active Publication Date: 2017-10-20
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Korean Patent No. 10-1302508 discloses a negative photosensitive resin composition comprising a copolymer polymerized using a cyclohexenyl acrylate-based monomer, thereby exhibiting excellent heat resistance and light resistance and improving sensitivity, but it Does not exhibit the required durability under low temperature curing conditions

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0157] Preparation Example 1: Preparation of Alkali-Soluble Resin (First Resin (A-1))

[0158] In a 1L flask with a reflux condenser, a dropping device (hereinafter referred to as dropping funnel) and a stirrer, nitrogen gas was introduced at 0.02L / min (minutes) to form a nitrogen atmosphere, and then 200g of propylene glycol monomethyl ether was added thereto. esters. After heating up to 100° C., a mixture containing 25.2 g (0.35 mol) of acrylic acid, 4.7 g (0.05 mol) of norbornene, 70.9 g (0.60 mol) of vinyl toluene and 150 g of propylene glycol monomethyl ether acetate was added. Then, a solution prepared by dissolving 3.6 g of 2,2'-azobis(2,4-dimethylvaleronitrile) in 150 g of propylene glycol monomethyl ether acetate was added dropwise from the dropping funnel to The flask was further stirred at 100 °C for 5 h.

[0159] Subsequently, the atmosphere in the flask was changed from nitrogen to air, and 28.4 g [0.20 mol (based on 57 mol% of the acrylic acid used in this reac...

preparation example 2

[0160] Preparation Example 2: Preparation of Alkali-Soluble Resin (Second Resin (A-2))

[0161] In a 1L flask with a reflux condenser, a dropping funnel, and a stirrer, introduce nitrogen gas at 0.02L / min to form a nitrogen atmosphere, then add 150g of diethylene glycol methyl ethyl ether thereinto, and heat to 70°C with stirring . Subsequently, 132.2g (0.60mol) of the mixture of the following chemical formula a and chemical formula b (molar ratio: 50:50), 55.3g (0.30mol) of methacrylic acid (3-ethyl-3-oxetanyl) methyl The ester and 8.6 g (0.10 mol) of methacrylic acid were dissolved in 150 g of diethylene glycol methyl ethyl ether to prepare a solution.

[0162] [chemical formula a]

[0163]

[0164] [chemical formula b]

[0165]

[0166] Use the dropping funnel to drop the prepared solution into the flask, and dissolve 27.9g (0.11mol) of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) in 200g of diethylene glycol in ethyl ethyl ether. The disso...

Embodiment 1 to 9 and comparative example 1 to 5

[0167] Examples 1 to 9 and Comparative Examples 1 to 5: Preparation of Photosensitive Resin Compositions

[0168] The components were mixed based on the components and compositions shown in Table 1 below, and stirred for 3 hours to prepare a photosensitive resin composition (unit: weight %).

[0169] [Table 1]

[0170]

[0171] A-1: Resin obtained in Preparation Example 1

[0172] A-2: Resin obtained in Preparation Example 2

[0173] B: Dipentaerythritol hexaacrylate (KAYARAD DPHA, Nippon Kayaku Co., Ltd.)

[0174] C: Oxime ester photopolymerization initiator OXE-01 (BASF)

[0175] D-1: 3-triethoxysilyl-N-(1,3-dimethylbutylene) propylamine

[0176] D-2: 3-(ethoxydimethylsilyl)-N-(pentane-3-ylidene)propan-1-amine

[0177] D-3: 3-(methoxydimethylsilyl)-N-(pentane-3-ylidene)propan-1-amine

[0178] D-4: 3-(ethoxydimethylsilyl)-N-(propan-2-ylidene)propan-1-amine

[0179] D-5: 3-(ethoxy(ethyl)(methyl)silyl)-N-(propane-2-ylidene)propan-1-amine

[0180] D-6: 3-(butyl(ethoxy...

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Abstract

The invention provides a negative-type photosensitive resin composition including alkali soluble resin, a photo-polymerization monomer, a photo-polymerization initiator, an additive and a solvent, wherein the solvent includes a silane coupling agent containing amidogen functional groups and and at least one among phenolic resin varnish epoxy resin and phenol phenolic resin varnish oxetane resin. According to the invention, the photosensitive resin composition is excellent in adhesiveness, chemical resistance and storage stability and can cure in low temperature.

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition. More particularly, the present invention relates to a negative photosensitive resin composition capable of curing at low temperature and having excellent adhesiveness and chemical resistance, a photocurable pattern formed using the same, and an image including the pattern display device. Background technique [0002] In the field of displays, photosensitive resin compositions are used to form various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and columnar spacers. Specifically, the photosensitive resin composition is selectively exposed and developed through a photolithography process to form a desired photocured pattern. In order to increase the process yield and improve the physical properties of objects applied in the process, a photosensitive resin composition with high sensitivity is required. [0003] Pattern forma...

Claims

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Application Information

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IPC IPC(8): G03F7/038G03F7/004G02F1/1335G02F1/1339
CPCG02F1/133512G02F1/1339G03F7/004G03F7/038
Inventor 金圣彬全季敏安菩恩
Owner DONGWOO FINE CHEM CO LTD